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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Advanced Copper Foil Secures a Non-Provisional Patent for New Product: Poly-Supported Copper Foil
January 13, 2017 | Advanced Copper FoilEstimated reading time: 1 minute
Advanced Copper Foil has secured an international patent for Poly-Supported Copper Foil, promoted under the name ACF-Screen. This patent is non-Provisional under International Application number PCT/050938.
ACF-Screen is comprised of a proprietary protective Poly Release film, which is adhered to sheets of ultra-thin copper foil in a cleanroom environment. This product provides complete protection of the copper surface throughout the entire cycle of PCB layup and lamination. ACF-Screen utilizes an inert adhesive which results in a guaranteed residue-free copper surface during subsequent processing. The release film will withstand temperatures of the lamination cycle, allowing for easy removal during break-down. ACF-Screen will eliminate anomalies caused by bending or creasing of copper foils during handling, while always completely protecting the surface from foreign materials and contamination. This product is available on copper foils from 5 µm, 9 µm to 70 µm. ACF-Screen is available on Standard, VLP, HVLP and ANP (Almost No Profile) copper foils.
“This product is going to revolutionize the industry. It will ease the handling of copper foils compared to loose foils, resulting in more efficient and speedier layup process,” says Shane Stewart, Product Manager.
ACF will be showcasing this product at the IPC APEX show in San Diego on February 14-16. Drop by the booth (#3701) for more information and to request samples of this new revolutionary product.
About Advanced Copper Foil
Advanced Copper Foil is a company dedicated to High Performance Copper Foils and their applications in the Printed Circuit and Battery Shielding Industries. Advanced Copper Foil is committed to providing PCB Fabricators, Laminate Manufacturers and Battery Shielding Companies with a cost-effective alternative to the traditional products on the market today. For further information visit: www.advancedcopperfoil.com
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