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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Ventec International Materials Certified to Latest IPC-4101 Revision E
July 11, 2017 | Ventec International GroupEstimated reading time: 1 minute
Further to the latest release of the IPC-4101 revision E, Ventec International Group announces that as of 1st July 2017, all related products are certified and released to the IPC-4101E standard.
Following an internal review process, Ventec materials meet all the requirements of the new IPC-4101 Revision E standard (Specification for Base Materials for Rigid and Multilayer Printed Boards). Back in 2014, Ventec International Group declared its support for the proposal led by ESA, the European Space Agency, to define supplemental requirements to the IPC4101D specification for base materials for rigid and multilayer PCBs. The latest revision E of the specification replaces IPC-4101D-WAM1 and formally includes an Appendix A that provides supplemental inspection requirements for base materials used in high-reliability PCBs for critical applications, with particular reference to the prevention and detection of foreign material inclusions (FOD) early in the supply chain.
Ventec has been inspecting, testing, and releasing materials to the standard for many years. The company continues its commitment to ongoing strategic investments in clean-room equipment and facilities that demonstrate Ventec’s principles of continuous improvement to consistently achieve the highest delivered quality to all its customers including military & aerospace and automotive customers. The latest investments will add AOI onto all treaters in Suzhou, China starting with highest reliability materials for high reliability applications (VT-901 and VT-90H polyimide as well as the full range of No Flow / Low Flow prepregs for rigid flex applications).
Mark Goodwin, COO Europe & USA commented: "Our approach to manufacturing and supplying laminates & prepregs covers the entire supply chain. We follow rigorous procurement, manufacturing and auditing processes at all our manufacturing sites and global service centers to ensure our materials and our services are consistently of the highest quality. This includes ensuring that our materials always comply with the prevailing standards."
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
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