Elementary, Mr. Watson: Rein in Your Design Constraints
Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Mentor White Paper--Concepts of Power Integrity: Controlling Impedance Across a Bare Cavity
August 27, 2018 | Fadi Deek, Mentor, a Siemens BusinessEstimated reading time: Less than a minute
The power distribution network (PDN) is the path from the power supply source (VRM) to the ICs (active devices). At low impedance, the PDN delivers adequate current to the receiver, enabling the PCB to function as desired.
Without a low-impedance path across the PDN, noise can propagate throughout a PCB, causing bit errors, voltage ripples, timing violations, and more. This white paper by Fadi Deek of Mentor, a Siemens Business, examines how impedance can be controlled in the PDN cavity.
To download this free white paper, click here.
Share on:
Suggested Items
IBM Power11 Raises the Bar for Enterprise IT
07/10/2025 | IBMIBM revealed IBM Power11, the next generation of IBM® Power® servers. Redesigned with innovations across its processor, hardware architecture, and virtualization software stack, Power11 is designed to deliver the availability, resiliency, performance, and scalability enterprises demand, for seamless hybrid deployment on-premises or in IBM Cloud.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Maxar Awarded Contract by NGA to Deliver Ai-Powered Object Detection Services
07/01/2025 | MaxarMaxar Intelligence, the leading provider of secure, precise geospatial insights, announced that it was awarded Delivery Order 01 under the Luno A program by the National Geospatial-Intelligence Agency (NGA).
Empower Appoints Steve Hertog as Senior Vice President of Sales to Strengthen Next Phase of High Growth
07/01/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in integrated voltage regulators (IVRs), announced the appointment of Steve Hertog as Senior Vice President of Sales. In this role,
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in