Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
IPC Executive Forum on Advancing Automotive Electronics
December 4, 2018 | IPCEstimated reading time: 1 minute
Register early for IPC's Executive Forum on Advancing Automotive Electronics and receive a 20% discount. You must register before December 21 to receive the discount.
This not-to-be-missed event on January 28, 2019 at IPC APEX EXPO 2019 is designed for executives in the global electronics systems supply chain. The forum features such worldwide notables as Dr. Udo Welzel, team leader of automotive electronics, engineering assembly and interconnect technology at Robert Bosch GmbH, who will present "Enabling Connected, Electrified and Automated Mobility: Challenges for Assembly and Interconnect Technology.” Also featured is Alex Stepinski, vice president of GreenSource Fabrication LLC, with Jochen Zeller, managing director of AWP GmbH, who will discuss the world's first “green” 4.0 PCB fabrication facility with single piece flow in-line automated facility with 100% layer traceability for advanced HDI/IC substrate/FPC production, plus its implications for automotive electronics.
Bob Neves, chairman/CTO of Microtek Labs China and member of the IPC's board of directors, will present "PCB Reliability Testing for Automotive Electronics—The China Story." Joe D'Ambrisi, senior vice president of MacDermid Alpha Electronics Solutions, will present "The Global Outlook for Specialty Chemicals & Materials in Automotive Electronic Packaging."
Carlo Favini, founder of Elga Europe will present "Developing a New Dry Film Photoresist to Meet Automotive Very Fine Line Circuit Needs - a Multicompany-Multinational Cooperative Program" (co-authored with Giorgio Favini, CEO Elga Europe).
Dwight Howard, manager, electrical engineering, North America & Asia-Pacific product development infotainment and driver information (IDI) PBU, electronics & safety division, APTIV LLC (formerly Delphi Automotive Systems IDI/NA Division) will discuss "Integrated Intelligent Transportation and Key Enablers."
Randy Hierbaum, vice president of sales, Optimal+, will present "Striving for Zero DPPM." He will discuss working on quality excellence programs with a Tier 1 provider while improving process cycle times. Alun Morgan, technology ambassador of Ventec and Chairman of the EIPC, will discuss providing a simple and universal adoption route for all suppliers with "Developing Universal Solutions to Automotive Materials Challenges."
Larry Wilson III, leader of Nexteer's Automotive Global Electronics Costing Team, will discuss creating cost models with suppliers and investing costs of new technologies. He will provide forecasts of future costs of automotive electronics.
Dr. John Mitchell, IPC president and CEO, will initiate the meeting with a high level, presentation, "Freeway to the Future: Automotive Elecronics Past/Present/Future."
For further information contact forum chairman Gene Weiner or Tracy Riggan, senior director, member support.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
NOTE Appoints Bahare Mackinovski Chief Sales and Marketing Officer
09/04/2025 | NOTEAs part of NOTE’s strategic focus on growth and customer value, the company is now strengthening its executive management team by appointing Bahare Mackinovski as Chief Sales and Marketing Officer.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.