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Indium Technical Manager to Present on Solder Solutions for Cutting-Edge Solutions for AI and Automotive at SEMICON Taiwan

08/26/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on September 5 in Taipei,Taiwan. Chou’s presentation will highlight cutting-edge, high-reliability, and low-temperature solder solutions for these rapidly evolving markets.

AIM to Highlight H10 Halogen Free Solder Paste at Productronica India

08/21/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming Productronica India taking place September 11-13 at India Exposition Mart Limited (IEML), Greater Noida, Delhi.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at NEPCON Vietnam

08/20/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming NEPCON Vietnam taking place September 11-13 at I.C.E. Hanoi, Vietnam.

Koh Young's Ramiro Mora to Unveil Insights on SPI Process Capability at SMTA Guadalajara Expo

08/19/2024 | Koh Young
Koh Young, the industry leader in True 3D measurement-based inspection solutions, is excited to announce that Ramiro Mora, Application Team Leader for Mexico and South America, will present on solder paste print process capability analysis at the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico, on September 11-12, 2024.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/16/2024 | Nolan Johnson, I-Connect007
People are on the move, new books are being released, and a new PCB manufacturer is making waves. This week, I'm highlighting the latest ASC/Sunstone book on DFM essentials, our 40th book in the I-Connect007 library and a must-read whether you're a new or seasoned member of industry. I'm also including leadership news from NextFlex, a discussion on integrated passives from Joe Fjelstad, and a new processor chip from Intel meant specifically for automotive applications.
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