RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions

Reading time ( words)

Mark Goodwin, Ventec International Group CEO EMEA and USA, speaks with I-Connect007 Technical Editor Pete Starkey on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.

To watch the interview, click here.

Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates

08/01/2019 | Todd Kolmodin, Gardien Services

Some people think of the PCB manufacturing process as a black box: design data goes to the manufacturer (fabrication house), and magically, the finished PCB is produced. While it may have been like that in the past, in actuality, fabricating PCBs today is quite a ballet of processes.

07/24/2019 | Jeff Beauchamp, NCAB Group

Creating reliable PCBs is an outcome of considering all aspects that can affect reliability as early as possible in the design process. The further down the design process, the more expensive and risky it can be to fix. As they say, everything starts with the design. Because a good board design improves the reliability of the end product and lessens the risk of failure.

07/19/2019 | Nolan Johnson and Dan Feinberg, I-Connect007

Dan Feinberg and Nolan Johnson speak with Amit Dror, CEO of Nano Dimension, about recent company events and the company’s focus on high-mix/low-volume and agile local manufacturing.