Flex/MSTC Joint Conference: A Collaborative Week in Monterey
March 6, 2019 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute

Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/MEMS&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019. Known officially as the Flexible Electronics Conference and Expo and the MEMS & Sensors Technical Conference, respectively, these two events shared event space for the second time. SEMI, the industry association representing the electronics supply chain, hosted this conference.
Keynote speakers included Dragos Maciuca from Ford Motor Company, Jason Jelinek from John Deere Electronics Solutions, John A. Rogers from Rogers Research Group, Peter Hartwell from TDK InvenSense, Nancy Ranxing Li from Verizon, and Kristofer Pister from UC Berkley.
"The more than 550 FLEX and MSTC 2019 attendees saw the future of flexible printed and hybrid electronics and the MEMS and sensor technologies that are helping us reinvent a wide range of biomedical, transportation and IoT applications,” said Dave Anderson, president of SEMI Americas. He continued, “Small, flexible skin-worn devices that can monitor an infant’s vital signs, agricultural sensing platforms capable of improving food production, and autonomous vehicles that are both safe and affordable were just a few innovations highlighted at the event. Globally recognized industry innovators showed us how these technologies will transform our lives.”
SEMI President and CEO Ajit Manocha took the opportunity during his opening remarks to launch SEMI’s young professionals outreach campaign with this video.
In the expo hall, 60 exhibitor companies were on hand to discuss their latest products and projects. The center of the hall featured a TechTALKS pavilion, which hosted 17 fast-paced presentations, including product demos and discussions of best practices. Also, with 123 papers and presentations overall—36 related to MSTC and 87 sessions related to flex technology—the technical presentations on the conference side of the event were vibrant and full of energy.
The SEMI staff brought a lot of educational outreach to the Flex/MSTC conference. University student work was showcased in the lobby with 11 student teams discussing their research in sensors and flex manufacturing techniques. Look for additional coverage of SEMI’s educational programs coming soon.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.