Flex Standards Update With Nick Koop

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This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.

Andy Shaughnessy: Nick, tell us a little about your background and your work with flex and rigid-flex circuits at TTM.

Nick Koop: I’ve worked in the flex and rigid-flex world since 1985 where my roles have ranged from process engineer to design engineer to general manager of a factory. And I’ve been with TTM since 2013. It has been a great experience working with such a wide range of customers and programs, solving problems that lead to success for our customers.

Shaughnessy: You’re the vice-chair of the Flexible Circuits Committee and co-chair of the 6013 Subcommittee. Give us some updates on the flex committees.

Koop: All of the flex specifications are being reviewed on an ongoing basis. We are close to releasing new versions of IPC-2223 and IPC-6013. They will include more information on microvias, finished copper thickness, and other member-requested updates. I would expect that to happen by early 2020. The supporting material specifications and test methods are also under review. In addition, there is work happening on the T-50 Terms and Definitions Guideline, which is in the middle of a substantial update. So, there is a lot happening on all fronts.

Shaughnessy: We talk to a lot of rigid board designers who are being forced into flex design. Usually, they start with flex standards, and then hopefully, they will call a flex board shop. What advice would you give any rigid folks moving into the flex world?

Koop: We are also seeing dramatic growth in flex use driven by several factors; space, weight, reliability, and cost being some of the most common. Flex provides a lot of advantages over a rigid board and discrete wiring. My initial advice would be to gain an understanding of the similarities and differences. The key differences are unique materials and a variation in material movement, which can impact alignment.

To read this entire interview, which appeared in Flex007 in the September 2019 issue of Design007 Magazine, click here.

02/21/2020 | Real Time with...IPC

During the show, Guest Editor Dick Crowe and Kurt Palmer, president and CEO of Burkle North America, discuss Kurt's career history and responsibilities in his present role. Palmer also details the equipment that the company is exhibiting on the show floor, and the palpable excitement that veteran technologists feel this year seeing younger engineers and students attending IPC APEX EXPO 2020. There’s a lot of “new blood” in the industry, as Palmer explains.

02/21/2020 | Charlene Gunter du Plessis, IPC Education Foundation

The IPC Education Foundation (IPCEF) hosted its STEM Student Outreach Event on February 6 at IPC APEX EXPO in San Diego. Nine local high schools attended bringing 193 students and 30 educators from Mission Hills High School, Morse High School, North County Trade Tech High School, Saint Marcos High School, E3 Civic High School, Point Loma High School, Otay Ranch High School, Mount Miguel High School, Otay Ranch High School—Girls in STEM. Twice as many students were able to participate this year, and each participating high school received a $1,000 grant and soldering station to enhance STEM-related learning at their school.

02/20/2020 | I-Connect007 Editorial Team

"We have a wide range of kids. All of them have some sort of interest in technology, which is why they wanted to come in general," said Katie Carl, a high school teacher escorting a group of kids at IPC APEX EXPO. "It’s neat when they start seeing how these technologies are created because a lot of them have seen robotics or have done a tiny bit of soldering with little circuits, but when they can see how those things are built and created in the industry, it makes it more applicable for them."