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TTM Technologies, Inc., a leading global printed circuit board (PCB) and radio frequency (RF) components manufacturer, today announced that members of its management team will virtually present at the following investor conferences:
- The J.P. Morgan Technology, Media, and Communications Conference on May 12th, 2020 at 4:10pm Eastern Time
- The Needham Technology and Media Conference May 19th, 2020 at 1:45pm Eastern Time
- The Baird Global Consumer, Technology and Services Conference on June 3th, 2020 at 3:10pm Eastern Time
- The Stifel Cross Sector Insight Conference on June 9th. After our presentation time has been finalized, we will post this event to our website
All presentations will be webcast live on the company’s website, www.ttm.com, and a replay will be accessible for a limited time following the events.
I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.
Nolan Johnson, I-Connect007
Nolan Johnson spoke with Brian Wojtkiewicz at PCB West about Taiyo’s latest developments in solder mask technology. They discussed the company’s advances in flexible circuits, HDI, and much more. In particular, Brian discusses the importance of reliability in fabrication and assembly. "We’re always in the fabricators’ shops. I’m out in the field talking to them, helping the operators understand the process, and making things work better because then we don’t have issues down the road," he says.
Dan Beaulieu, D.B. Management Group
It’s always good to catch up with old friends, especially when you can start working together. I recently spoke with my friend John Johnson, who has joined American Standard Circuits as the director of business development. At ASC, John will be using the Averatek A-SAP process that he was previously involved with. He shares some of his background and provides insight on the best ways to use this semi-additive PCB fabrication process that opens the capability window for forming trace and space.