Lenthor Engineering Adds Dale Smith in the Role of Chief Technology Officer
May 21, 2020 | Lenthor EngineeringEstimated reading time: 1 minute

Lenthor Engineering, Inc., a California based designer, manufacturer and assembler of rigid-flex and flex printed circuit boards, is pleased to announce the addition of Dale Smith in the role of Chief Technology Officer. In this new role Mr. Smith brings to Lenthor many years of direct hands-on experience in advanced rigid-flex and flex processing technology and techniques. Additionally Mr. Smith brings his immense understanding of advanced materials having been associated with DuPont and their materials teams for the past five years.
Mr. Smith will assume the lead role in directing Lenthor’s technical teams in identifying and integrating technologies being sought out by Lenthor’s customers. Mr. Smith will also engage directly with Lenthor’s customers assisting them in the advancement of their technologies within the rigid-flex and flex circuit design arena by use of advanced materials and processing.
Mark Lencioni, Lenthor Engineering’s president/ CEO commented, “The addition of Mr. Smith will allow Lenthor to optimize its recent capital expenditures including our fully automated high temperature lamination press, alternative oxide line and advanced laser imaging systems. Mr. Smith will be charged with implementing the technology requirements our customers are forecasting to ensure Lenthor’s technology roadmap exceeds our customer’s future needs. We are very excited for the opportunity to have someone of Mr. Smith’s background and accomplishment join our team.”
For additional information, contact: David Moody, davidm@lenthor.com
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.