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Lenthor Engineering, Inc., a California based designer, manufacturer and assembler of rigid-flex and flex printed circuit boards, is pleased to announce the addition of Dale Smith in the role of Chief Technology Officer. In this new role Mr. Smith brings to Lenthor many years of direct hands-on experience in advanced rigid-flex and flex processing technology and techniques. Additionally Mr. Smith brings his immense understanding of advanced materials having been associated with DuPont and their materials teams for the past five years.
Mr. Smith will assume the lead role in directing Lenthor’s technical teams in identifying and integrating technologies being sought out by Lenthor’s customers. Mr. Smith will also engage directly with Lenthor’s customers assisting them in the advancement of their technologies within the rigid-flex and flex circuit design arena by use of advanced materials and processing.
Mark Lencioni, Lenthor Engineering’s president/ CEO commented, “The addition of Mr. Smith will allow Lenthor to optimize its recent capital expenditures including our fully automated high temperature lamination press, alternative oxide line and advanced laser imaging systems. Mr. Smith will be charged with implementing the technology requirements our customers are forecasting to ensure Lenthor’s technology roadmap exceeds our customer’s future needs. We are very excited for the opportunity to have someone of Mr. Smith’s background and accomplishment join our team.”
For additional information, contact: David Moody, firstname.lastname@example.org
Andy Shaughnessy, Design007 Magazine
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In the first part of this roundtable, the team dispelled a variety of myths surrounding PEC. In this second part of the roundtable, the participants discuss what designers and fabricators need to know to jump into printed electronics, and some of the drivers behind this growing technology.
I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. Today's question: Do you think IC substrates (BGA, CSP, flip chip, etc.) will ever be produced in high volumes in the U.S.?
I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Omni PCB President Tara Dunn’s turn! A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. Tara is the co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”