Comtech Receives $1.7 Million Order for Engineering Services to Support U.S. Army’s Gray Eagle UAS Program
May 29, 2020 | Business WireEstimated reading time: 1 minute
Comtech Telecommunications Corp. announced that during its third quarter of fiscal 2020, its Tempe, Arizona-based subsidiary, Comtech EF Data Corp., which is part of Comtech’s Commercial Solutions segment, received a $1.7 million order for engineering services from Hughes Network Systems, LLC (“Hughes”) to support the Data Link Modernization contract by providing new advanced satellite communications (“SATCOM”) systems for the U.S. Army’s MQ-1C Gray Eagle Unmanned Aircraft System. Additional orders are expected in future periods.
Under the development and prototype phase of the sub-contract with Hughes, Comtech EF Data will provide advanced engineering services, including porting of waveforms to the prime’s airborne and ground-based satellite modems and supporting the stringent Army Cyber Security requirements.
“We are very happy to be selected to support our customer for this critical program,” commented Fred Kornberg, Chairman of the Board and Chief Executive Officer of Comtech Telecommunications Corp. “We believe this award is tangible evidence that our ongoing investments in secure wireless technologies are paying off. We are proud to be working with Hughes and the DoD to support the warfighters’ needs with the highest performance, most robust, cost-effective and reliable solution available in the marketplace.”
Comtech EF Data Corp. is a leading supplier of communications equipment with a focus on satellite bandwidth efficiency and link optimization. The high-performance satellite communications ground equipment is deployed globally to support mission-critical and demanding applications for government, mobile backhaul, premium enterprise and mobility. Service providers, satellite operators, governments and commercial users wanting to optimize communications, increase throughput and delight customers, are leveraging the performance and flexibility of the Comtech brand. The solutions are facilitating fixed and mobile networks in 160+ countries and across every ocean.
Suggested Items
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsIn this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.
Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science
04/16/2024 | BUSINESS WIRELeaders in high performance computing in the U.S. and Japan have signed a memorandum of understanding (MOU) establishing a cooperative relationship in support of artificial intelligence (AI) computing projects.