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Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Essentra Components Advise on Efficient PCB Design With New Free Guide
June 16, 2020 | Essentra ComponentsEstimated reading time: 1 minute
Essentra Components know that the performance of your circuit will depend greatly on how it’s laid out on the PCB, and that poor PCB layout can cause function and reliability problems. To save time and problems they suggest therefore that designing your PCB needs to start before the actual process of ideation, definition and validation.
This updated Essentra Components guide to efficient PCB design shows how you can improve the overall product by allowing electronic design engineers to ensure compatibility among the project hardware. The guide is available at www.essentracomponents.com.
They suggest that design and prototyping should begin with consideration of the design software, fabrication and component density, then matters of trace width calculation and a choice of SMT or Through Hole technology. The guide addresses how to avoid errors in landing patterns, deal with component fit, consider the positioning of specialist components such as decoupling capacitors, so leading on to optimising the layout of switching regulators and concerns of blind and buried vias.
They offer free component samples and free download of component CAD designs as well as other related articles for free download.
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Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Electronic Design Automation (EDA) Market Size to Reach $811.1 Million by 2030
11/12/2025 | PRNewswireThe Global Electronic Design Automation (EDA) Market was estimated to be worth USD 541 Million in 2023 and is forecast to a readjusted size of USD 811.1 Million by 2030 with a CAGR of 6.4% during the forecast period 2024-2030.
The Technical Backbone of an EMS Company: A CEO’s Perspective
11/12/2025 | Jay Rupani, Precision PCBAs the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
11/12/2025 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform.
Alpha Insights, Performance by Design: Understanding Heat at the Core of Every Design
11/11/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignPower isn’t just about current. It’s about control. As electronic systems grow smaller and faster, every amp and every layer generates a new source of heat. That heat is more than a byproduct. It’s a measure of efficiency, a benchmark of performance, and often the first indication of failure.