Registration and Sponsorships Open for IPC E-Textiles 2020 Virtual Summit
June 23, 2020 | IPCEstimated reading time: 1 minute

Registration is now open for IPC E-Textiles 2020 Virtual Summit, to be held Thursday, October 1 and Friday, October 2. IPC E-Textiles 2020 Virtual Summit will consist of two 90-minute interactive educational workshops each day, as well as a live tour of the University of Minnesota Wearable Technology Lab.
IPC E-Textiles 2020 Program Committee has selected the following workshop topics for the Virtual Summit:
- E-Textiles for Medical Needs
- The Digital Layer – Software and Programming
- To Wear or Not to Wear
- How Do We Do This? 101
Each workshop will provide educational presentations followed by interactive panel discussions with attendees. Session leaders and speakers will use web cameras during the presentations and panel discussions, and attendees will be encouraged to do the same.
Unique to this event is the opportunity for sponsors to record a video to be included on the event agenda. Using these videos, sponsors will be able to bring Virtual Summit attendees into their facilities, demonstrate their recent technologies and even introduce them to key personnel. Working with the University of Minnesota Wearable Technology Lab, IPC will also bring this lab tour and spotlights of students direct to all attendees. The tour will include live Q&A with students and faculty.
“Networking that is so valuable at in-person events will exist in a virtual setting, with many opportunities for attendees, sponsors and speakers to learn from one another and to build on current relationships,” said Stephanie Rodgers, IPC D70 E-Textiles Committee, co-chair and program committee member. “If you have been to previous IPC e-textile events, then you know how dynamic the information exchange is. This year, our Virtual Summit will continue to deliver knowledge of standards development, manufacturing equipment, user experience developments and product commercializations that shape the future of e-textile adoptions. We are looking forward to seeing the natural creativity of this group showcased in a virtual setting.”
Registration for the two-day IPC E-Textiles Virtual Summit is $120 for members, $150 for nonmembers. Sponsorships start at $500 and include access to all workshops.
For further information about the event or how to take advantage of the unique sponsorship opportunities, contact Chris Jorgensen, IPC director of technology transfer, at ChrisJorgensen@ipc.org. Register for event at www.ipc.org/E-Textiles-NA.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.