Cogative Intelligent System Joins CHASM Advanced Materials Partner Program
July 2, 2020 | PRWEBEstimated reading time: 1 minute

CHASM Advanced Materials, Inc., inventor of AgeNT™ - the leading ITO alternative for transparent printed electronics, announced Cogative Intelligent System joining CHASM’s Partner Program. With a broad, existing customer base of automotive OEMs and suppliers in China, Cogative will act as a representative for CHASM and market CHASM’s advanced product line driving innovation in safety, comfort and convenience in today’s vehicles.
Located in Shenzhen, Cogative will offer CHASM’s complete line of printed electronics materials to the automotive manufacturing market in mainland China. Marketed under the AgeNT brand, the company’s TCF materials are a novel combination of best-in-class carbon nanotube inks and conductive film using silver nanowire or metal mesh providing superior optoelectronic performance and are far more cost effective when patterned into circuits.
“Smart cockpits and vehicle cameras continue be areas of keen interest to automotive OEMs, so selecting the optimal material for touch user interfaces or heaters keeping cameras free of ice and condensation are critical decisions for suppliers,” said Rose Chiang, CEO of Cogative Intelligent System. “Having expertise with innovative new materials like AgeNT from CHASM, helps Cogative successfully advise clients on the optimal material for their application.”
Using AgeNT, printed electronics manufacturers create innovative transparent, flexible printed electronics such as heaters, antennas, touch buttons/smart surfaces and large format touch screens. Of particular interest to automotive suppliers and manufacturers are transparent heaters that can be formed into sculpted surfaces such as headlight assemblies to clear ice and snow for safety systems. Unlike current microwire heaters, AgeNT heaters are transparent to not interfere with collision avoidance or autonomous vehicle systems employing optical cameras. AgeNT is ideal material for integrating touch user interfaces into the curved shapes and smart surfaces found in cockpit of the car.
“Partners like Cogative help CHASM quickly and effectively scale, extending our reach to strategic geographies and industries we couldn’t service directly,” said David J. Arthur, CEO of CHASM Advanced Materials, Inc. “Cogative’s demonstrated experience pairing automotive suppliers and OEMs with the novel materials to fuel innovation will deliver value to our customers.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
NOVOSENSE, UAES and Innoscience Advance Power Electronics for New Energy Vehicles
10/17/2025 | PRNewswireThe partnership focuses on developing next-generation intelligent integrated Gallium Nitride (GaN) products. Leveraging their combined expertise, the new devices will deliver more reliable GaN driving and protection features, enabling higher power density and paving the way for wider adoption in automotive systems.
Jabil Announces Board Transitions
10/17/2025 | JabilJabil Inc. announced that Executive Chairman of the Board of Directors Mark T. Mondello and Directors Kathleen A. Walters and Jamie Siminoff will not seek re-election at Jabil’s Annual Meeting of Stockholders in January 2026.
StenTech Strengthens Precision Parts Platform with AME Acquisition
10/17/2025 | StenTechStenTech, North America’s leading provider of SMT printing solutions and precision manufacturing, has announced the acquisition of Advanced Metal Etching, Inc. (AME), a recognized specialist in chemically etched and laser cut precision parts.
MKS’ Atotech, ESI to Participate in TPCA Show & IMPACT Conference 2025
10/17/2025 | MKS’ AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 26th TPCA Show 2025 to be held at the Taipei Nangang Exhibition Center from 22-24 October 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.