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OpenAI and Foxconn Collaborate toStrengthen U.S. Manufacturing Across the AI Supply Chain

11/21/2025 | OpenAI
OpenAI announces a collaboration with Foxconn focused on design work and U.S. manufacturing readiness for the next generation of AI infrastructure hardware. As part of this work, OpenAI will share insight into emerging hardware needs across the AI industry to help inform Foxconn’s design and development efforts for hardware to be manufactured at Foxconn’s U.S. facilities.

Inside the Machine: Power Electronics Driving the Road to Reliability

11/21/2025 | Stanton Rak, SF Rak Company
The silent, seamless propulsion of an EV masks the incredible complexity and engineering finesse required to make it all happen. Beneath the vehicle’s floor or under its hood lies a dense cluster of power electronics systems comprised of coordinated, high-performance modules that collectively control, convert, and condition energy from the battery to the wheels. These systems not only govern how smoothly an EV accelerates or how efficiently it uses its charge but also play a defining role in the long-term reliability, safety, and serviceability of the vehicle.

Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025

11/17/2025 | Sydney Xiao, Global Electronics Association East Asia
Discussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.

Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems

11/18/2025 | Jesse Vaughan -- Column: Beyond the Board
Over the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.

SPEA Honored with Bosch Global Supplier Award

11/14/2025 | SPEA
Bosch, a leading global supplier of technology and services, has honored SPEA with a prestigious Bosch Global Supplier Award, recognizing the company’s excellence as a provider of manufacturing test equipment and systems for microelectronics
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