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Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025

11/17/2025 | Sydney Xiao, Global Electronics Association East Asia
Discussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.

Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems

11/18/2025 | Jesse Vaughan -- Column: Beyond the Board
Over the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.

SPEA Honored with Bosch Global Supplier Award

11/14/2025 | SPEA
Bosch, a leading global supplier of technology and services, has honored SPEA with a prestigious Bosch Global Supplier Award, recognizing the company’s excellence as a provider of manufacturing test equipment and systems for microelectronics

Advanced Electronics Packaging Digest: Third Issue Arrives November 17

11/12/2025 | I-Connect007
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.

Sypris Reports Third Quarter Results

11/12/2025 | BUSINESS WIRE
The Company’s third quarter revenue decreased compared to the prior-year quarter primarily due to the near-term impact of tariffs, which reduced demand from certain transportation-related customers and necessitated the conversion of certain shipments from our facility in Mexico to a value-add only sub-maquiladora.
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