I-Connect007 Editor’s Choice: Five Must-Reads for the Week
August 14, 2020 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 3 minutes
This week’s picks include a little of everything.
We don’t see new companies in the PCB community very often, especially in EDA. But this week, we have an interview with the founder of Avishtech, a new EDA software company that has a spin on field solvers and stackup tools. A lot of successful companies first hung out their shingle during times that were, shall we say, “interesting.” Is this a good omen?
We also have an interview with Mike Carano, who discusses the need for mentors to help ensure that young technologists are ready for the future. Then, there’s news about Koh Young and Mentor, a Siemens Business, integrating Valor functionality into the Koh Young inspection software. And iNEMI has published a “best practices” document for disinfecting manufacturing and assembly equipment; the group worked with the EPA, as well as numerous companies and organizations, to get this process dialed in.
Lastly, we’ve compiled all of your questions for Happy Holden, along with his answers, into one document for your reading pleasure. Your questions covered much of the industry, and Happy had a great time answering them. Happy Friday!
Avishtech: A New Player in the Field Solver and PCB Simulation Tools Market
Published August 13
This week, we welcome a new company into the EDA software tool community. Avishtech was recently founded by Keshav Amla, a young entrepreneur who plans to shake up the markets for field solvers and PCB simulation tools. You may know his father, Tarun, a veteran materials specialist, who is now with ITEQ. When was the last time a new software tool company was launched in this segment?
Koh Young Collaborates With Mentor to Further Simplify Inspection System Programming
Published August 12
Many complain about Gerber files. Now, Koh Young and Mentor, a Siemens Business, have partnered to create an optimized inspection programming solution that does not require Gerbers or CAD files. The Koh Young software integrates the Valor Open Product Model and the extensive Valor Parts Library. This new flow now automates even more of the process, reducing the chance for human error.
Foundations of the Future: Interview With Michael Carano on Mentorship
Published August 12
Years ago, every newly-minted PCB designer or manufacturing engineer started out working with a mentor. Those were the days. But it seems that everything old is new again, and mentoring is making a comeback. In this column, IPC’s Charlene Gunter du Plessis interviews columnist Mike Carano, creator of the Michael Carano Teacher Excellence Award. Mike discusses his work as a mentor with IPC’s Emerging Engineer Program, and why it’s so important to help mentees personally and professionally.
iNEMI Publishes Best Practices for Electronic Equipment When Disinfecting for COVID-19
Published August 12
When the world first began to understand the severity of the COVID-19 situation early this year, fabricators and assembly providers began disinfecting their facilities from top to bottom. But there was no proven method for dealing with this new virus. Now, iNEMI has released “Recommended Best Practices for Protecting the Reliability and Integrity of Electronic Products and Assemblies When Disinfecting for SARS-CoV-2 (COVID-19).” This document includes a list of chemicals that will not harm electronic equipment and appropriate application methods.
Just Ask Happy: The Exclusive Compilation
Published August 13
Over the past few months, readers have sent in questions for Happy Holden, “Mr. HDI,” and he answered them. The topics ran the gamut: front-end design, microvia reliability, the fabrication market, final assembly issues, and anything PCB-related that you could imagine. We’ve combined all 21 questions and answers into one document and, judging by the number of views in just one day, many of you are enjoying this hotbed of “Happy-ness.”
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.