Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Mentor Hosts Design Tool for Rigid-Flex Circuits Webinar
August 20, 2020 | Mentor, a Siemens businessEstimated reading time: Less than a minute
“What Technology Should Your PCB Tool Have To Design Rigid-flex Circuits Properly?” is the topic for a webinar hosted by Mentor, A Siemens Business, from 2 to 3 p.m. EDT, Tuesday, Aug. 25.
Today, electronic design companies are meeting consumer form-factor demands and ensure high reliability and flexibility in design options for products using flex/rigid-flex circuits. Designing these rigid-flex PCB’s requires a design tool with advanced technologies distinctly unique to flex/rigid-flex design. From flex/rigid-flex centric operations and capabilities that understand the unique structures, constraints, plane management, materials, stack-ups, and beyond, PADS Professional has the features and operations necessary to support flex/rigid-flex design that other tools don’t.
Presenters are Brent Klingforth, a technical marketing engineer specializing in schematic, PCB and manufacturing products; and John McMillan, technical marketing engineering manager.
You will learn:
- Requirements for Flex design
- Where arced and rounded structures are required
- How to design a proper stack-up
- Intelligent overlapping flex regions
- Automation specific to Flex design
- Proper design technique for flexible circuits
- How to incorporate Flex and Rigid-Flex designs into your product
- Automated features allowing you to dramatically reduce design time
Visit pads.com to register.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).