Nano Dimension to Present at LD 500 Virtual Conference
August 26, 2020 | Nano Dimension Ltd.Estimated reading time: 1 minute

Nano Dimension Ltd., a leading Additively Manufactured Electronics (AME) / PE (Printed Electronics) provider, announced that it will be presenting at the LD 500 Virtual Conference on Thursday, September 3, at 9:20 am ET. Yoav Stern President and CEO of Nano Dimension will be presenting to a live virtual audience.
“Virtual conferences are a symptom of a changing world,” commented Mr. Stern. “I am going to speak about how COVID-19 is transforming the world of prototyping and manufacturing electronic devices. Price advantages are losing ground to fears of disrupted supply chain. Such disruptions can eliminate, in one event, years of previous savings. With our unique AME technology, we are at the verge of digitalization for electronic devices fabrication. The AME Technology enables prototyping and short-runs production of Hi-PEDS (High-Performance Electronic Devices) on-the-ground, directly from a CAD file without the need for tooling.”
Chris Lahiji, Founder of LD, stated, “We have been waiting for this moment all year long. Due to COVID, it has been nearly impossible for physical conferences to even take place. I want to show the world that you can still learn, have a great time, and see some of the most unique companies in the capital markets today. All without having to step foot outside. For the first time, LD Micro is accessible to everyone, and we are honored to welcome you to one of the most trusted platforms in the space.”
The LD 500 will take place on September 1st through the 4th.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.