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John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave™ family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave™ is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.
Watch this Real Time with... IPC APEX EXPO 2021 interview conducted by Pete Starkey, I-Connect007 Technical Editor.
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