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Meet Chris Young, one of our newest I-Connect007 columnists! Chris’ columns will take a lighthearted (sometimes humorous) and informative view of the aerospace and defense industry.
Chris has more than 20 years of experience as an electrical engineer, working predominantly in the avionics/aerospace industry, supplemented by experience in the semiconductor and medical fields. He is the owner/lead engineer of Young Engineering Services LLC and chief hardware engineer at The Goebel Company.
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Boeing, Shield AI Set to Collaborate on Artificial Intelligence, Autonomy for Defense Programs
03/13/2023 |
Boeing
Boeing and Shield AI have signed a memorandum of understanding to explore strategic collaboration in the areas of autonomous capabilities and artificial intelligence on current and future defense programs. Shield AI created Hivemind, an artificial intelligence pilot that has flown a variety of aircraft. According to Shield AI, the AI pilot can also enable swarms of drones and aircraft to operate autonomously without GPS, communications or a human pilot in the cockpit.
A Conversation With ‘The Space Gal’
02/23/2023 |
I-Connect007 Editorial Team
With multiple advanced degrees in aerospace science, Emily Calandrelli could have had her pick of any project in earth and space science. Instead, she has chosen to use her skills in science policy and communication to break down complex science topics, advocate for women in STEM fields, and bolster enthusiasm for the next generation of scientists through her own Netflix show and an active slate of social media accounts. Emily’s platform is huge, but it's one that she wholeheartedly embraces. In this interview with the I-Connect007 Editorial Team, Emily talks about her unconventional entry into science, what’s ahead for space commerce, advice for industry leaders, and what she really thinks about going into space.
A Challenge Facing Aerospace Designers In 2023
01/24/2023 |
Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
