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IPC’s Validation Services program has awarded an IPC-1791, Trusted Electronics Designer Requirements Qualified Manufacturer Listing (QML) to Fralock, located in Valencia, California.
Following the initial IPC audit, Fralock passed stringent design requirements to optimize product quality, reliability, and consistency across the entire manufacturing operation, earning a place on IPC’s global network of rigorously vetted and trusted sources.
“Fralock provides product design, development, engineering, prototyping, and manufacturing services to customers that require a high level of quality and precision,” said Shibu Gangadharan, vice president of specialty engineered materials at Fralock. “This validation assures our customers that processes pertaining to IPC-1791 are adhered to throughout the manufacturing cycle.”
IPC's Validation Services QML program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.
"Different from other audit programs, IPC's Validation Services programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Fralock on becoming members of IPC's network of trusted QML suppliers.”
Nolan Johnson, I-Connect007
“New year, new you.” That tagline seems to be everywhere right now. All five must-reads this week reflect this theme. Does this apply to you and your company? We have quite a duke’s mixture of articles. We’ve got AT&S outlining their market position on advanced packaging, and Auburn University doing research on smart manufacturing processes. Keysight is coordinating practical 6G research in Europe, Technica shares where they see the market growing, and SEMI adds new members to a key board responsible for market guidance. These five stories drew a lot of reader attention this week.
Tony Plemel, Flexible Circuit Technologies
As a flex circuit applications engineer, when I receive an RFQ, the first thing I do is look at the customer’s data and review their manufacturing notes. Quite often, I find notes that supersede IPC specifications in manufacturing documents, as customers often believe these added notes and associated specifications will make the circuit more robust. However, these non-standard IPC manufacturing specifications/notes can wreak havoc on the manufacturing process and can actually lead to a less robust circuit.
Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy recently spoke with Dale Smith and David Moody of Lenthor Engineering. Dale is Lenthor’s new chief technology officer, and David is the director of sales/marketing.