I-Connect007 Editor’s Choice: Five Must-Reads for the Week


Reading time ( words)

Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation!

This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. 

We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about? 

See you next time.

Sunstone and I-007eBooks Launch Book on Designing for Reality 
Published October 20

There are probably a dozen “design fors” floating around now, with DFM being ubiquitous at this point. But this new I-Connect007 book cuts right to the chase with a new acronym: The Printed Circuit Designer’s Guide to… Designing for Reality. Sunstone’s Matt Stevenson takes designers through the reality of the PCB fab process. Matt basically says, “Here’s what works, and here’s what doesn’t. Let’s go.” Check it out.  

IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs 
Published October 12

As fictional NASCAR driver Ricky Bobby so eloquently put it, “If you ain’t first, you’re last.” When it comes to advanced substrate packaging, North America is definitely not in first place. As Jan Vardaman explains, last week’s IPC Advanced Packaging Symposium in Washington, D.C., represented a call to action. Speakers from across the electronics industry and various branches of the U.S. government addressed this gap in the supply chain which threatens our ability to develop the most cutting-edge fighter planes and weaponry. We’ll keep a watch on this situation.

Time to Go ‘Exploring’ at SMTA International 
Published October 19

If you’re getting ready for SMTA International, don’t miss this. Editor Michelle Te has a handy-dandy article that covers how to use the SMTAI 2022 Passport. Ambassador Exhibitors on the show floor will discuss their companies’ technology and stamp your passport, and the most active Explorers and most popular Ambassadors can win various prizes. Grab your pith helmet and start exploring.

Market and Tech Convergence: Electrically Conductive Inks 
Published October 17

In this article, Stan Farnsworth of NovaCentrix discusses the development of electrically conductive inks. Now in use in everything from smartphones and medical devices to cars and space suits, these inks can be configured by the OEM and applied in a variety of ways. Stan explains what all this means to designers and fabricators on the cutting edge.

Beyond Design: Routing Strategies to Minimize Radiation 
Published October 19

If you’re a designer or design engineer wrestling with EMI issues, this Barry Olney column is just for you. Barry explains how good routing practices can save up to 10 dB of substrate radiation. He addresses things like fanout, mark-to-space ratios, and flight time for microstrip vs. stripline. In case this topic isn’t your strongest suit, Barry summarizes your best way forward. Don’t miss it.

  

 

 

 

Share




Suggested Items

Real Time with... IPC APEX EXPO 2023: Wise Continues Expansion With Technica Partnership

02/02/2023 | Real Time with...IPC APEX EXPO
Andy Shaughnessy sits down with Massimo Passerini, founder of Wise, and Technica's Jason Perry, to discuss Wise's latest PCB manufacturing automation. They also focus on the company's distributor partnership with Technica, which is moving into the PCB fab market. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.

Real Time with... IPC APEX EXPO 2023: Coating With Robotic Technology

02/01/2023 | Real Time with...IPC
Paige Fiet sits down with Steve Keller of Taiyo America to discuss the benefits of using robotic technology such as Taiyo Circuit Automation's AT-100 for coating PCBs. If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.

Don't Blink: The IPC APEX EXPO Time-lapse

01/31/2023 | Nolan Johnson, I-Connect007
It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.