U.S., India Semiconductor Groups Announce Initiative to Strengthen Public-Private Collaboration in Chip Ecosystem
February 16, 2023 | SIAEstimated reading time: 1 minute

The U.S. Semiconductor Industry Association (SIA) and the India Electronics and Semiconductor Association (IESA) jointly announced plans to form a private-sector task force that will strengthen collaboration between the two countries in the global semiconductor ecosystem.
Specific goals of the task force include the following:
- Developing a “readiness assessment” regarding the semiconductor ecosystem in India.
- Assembling industry, government, and academic stakeholders to identify near-term industry opportunities and facilitate longer-term strategic development of complementary semiconductor ecosystems.
- Making recommendations on opportunities and challenges to increase India’s role within the global semiconductor value chain, including chip manufacturing.
- Identifying and facilitating workforce development and exchange opportunities to benefit both countries.
“We are thrilled to kick off this new initiative with IESA, our counterpart in India,” said SIA President and CEO John Neuffer. “India is already a major hub for semiconductor research, chip design, and equipment engineering, but its future potential is even greater. This task force will help identify tangible ways to unlock this potential by increasing collaboration between the U.S. and India within the global chip ecosystem.”
“IESA is excited to be part of this new taskforce in partnership with SIA,” said IESA President and CEO Krishna Moorthy. “It will be an important platform to bring together global resources to identify actionable plans to support India to increase its presence in the world-wide chip industry and then enable global collaboration to execute the plans across all segments of the design and manufacturing supply chain, as well as creating semiconductor talent for the world.”
Suggested Items
EWPTE 2025: Wire Processing Innovation Driving Technical Dialogue
05/13/2025 | Brittany Martin, I-Connect007From cutting-edge automation to advanced testing and harness assembly solutions, the 2025 Electrical Wire Processing Technology Expo (EWPTE) delivered a packed exhibit floor, robust technical programming, and valuable peer-to-peer connections.
Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
05/13/2025 | Prashant Patel -- Column: Facing the FutureInnovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.
Barnes Aerospace Appoints George Whittier as CEO
05/12/2025 | BUSINESS WIREBarnes Aerospace, a global provider of component repair services and manufacturer of highly-engineered parts primarily for aeroengines and an operating division of Barnes Group Inc., announced the appointment of George Whittier to the newly created role of CEO, effective May 12, 2025.
I-Connect007 Technical Library: Your Ultimate Free Knowledge Resource
05/12/2025 | Barb Hockaday, I-Connect007I-Connect007’s technical library was created in 2016 with the launch of its first title, "The Printed Circuit Buyer’s Guide to AS9100 Certification." Created to satisfy a need for readily available, free technical resources, the library has become a powerful knowledge hub for the printed circuit board and electronics manufacturing supply chain.
The Shaughnessy Report: Solving the Data Package Puzzle
05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIf you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.