American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
CAES Wins Award to Deliver Dual System-in-Package Circuit Card Assemblies
February 1, 2023 | Business WireEstimated reading time: Less than a minute
CAES, a leading provider of mission-critical advanced RF technology, is pleased to announce its recent award to perform on the Extremely Wideband Radio Frequency Spectrum Operations (EWO) System.
The new award is an extension of an ongoing partnership with MITRE and the United States Air Force. Under the contract, CAES will deliver solutions for design and development of Dual System-in-Package Circuit Card Assemblies and will continue to improve performance of the microelectronics-based wideband digital antenna array.
CAES Missiles Advanced Technology and Engineering, based in Colorado Springs, Colorado, develops cutting-edge RF, analog, digital hardware and software solutions for complex commercial and defense industries. By leveraging the best combination of commercial off-the-shelf and customized products, complex solutions can be developed in a matter of weeks and months, not years.
“As threats evolve, CAES is devoted to ensuring the safety of our warfighters,” said Dave Young, CAES Senior Vice President and Chief Technology Officer. “We look forward to our continued partnership with MITRE and the US Air Force delivering advanced electronics to achieve their system objectives.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
GlobalFoundries, Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
11/05/2025 | GlobalFoundriesGlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, and Silicon Labs, the leading innovator in low-power wireless, announced the expansion of their strategic partnership to advance the development of next-generation, energy-efficient wireless technologies and scale U.S.-based semiconductor manufacturing.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.