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Al Wasserzug, SR Business Development Exec at Cirexx talks about their new product, Eclisp. Developed in conjunction with Lockheed Martin, Eclisp is an alternative to co-fired ceramics and used to evacuate heat very efficiently with a low CTE. Wasserzug gave a paper on the new technology at IPC APEX EXPO.
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Patrick Crawford, IPC
Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.
Douglas Brooks, Consultant, and Johannes Adam, ADAM Research
Most of are aware that when we pass an electrical current through a trace (conductor), the trace will heat up. This temperature increase is caused by the I2R power loss dissipated in the resistance of the trace. The resistance of a copper trace is mostly determined by its geometry (cross-sectional area), and there are lots of studies trying to look at the relationship between the current down a trace (of known size) and the resulting temperature of the trace. But the situation is much more complicated than this. There are physical properties that exist that result in helping to cool the trace. These properties are usually a combination of conduction of the heat away from the trace through the material, convection of the heat away from the trace through the air, and radiation of the heat away from the trace.
Didier Mauve and Robert Art, Ventec
Regarding basic principles of thermal dissipation there are three ways of dissipating energy: Conduction, convection, and radiation. The integrated metal substrate (IMS) printed circuit boards rely predominantly on heat conduction all the way through the different layers of the substrates from a hot point (the base of the component) to a cold point (the furthest surface of the metal base) and, usually, thereafter, through a dissipator.