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PADS Paper, Part 4: QFN Components
June 3, 2015 | Mentor GraphicsEstimated reading time: Less than a minute
This paper, the fourth and final in a series downloaded by thousands of PCB designers, is dedicated to CAD library quality. It describes every aspect you need to consider when creating quad flat no-lead (QFN) component library parts.
It also describes the impact each feature has in the PCB process. To read this paper, click here.
Suggested Items
Fineline Global Group Acquires IBR
04/19/2024 | PRNewswireIBR Leiterplatten GmbH & Co. KG joins the Fineline Global Group and is now an integral part of one of the leading suppliers of PCBs. Fine Line Gesellschaft für Leiterplattentechnik mbH acquired 100% shares of IBR.
SEMI Applauds U.S. Chips Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain
04/17/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’ presence in Texas and the company’s development and production of leading-edge chips.
Microchip Technology Expands Partnership with TSMC to Strengthen Semiconductor Manufacturing Capacity
04/08/2024 | Microchip Technology Inc.Microchip Technology announced it has expanded its partnership with TSMC, the world’s leading semiconductor foundry, to enable a specialized 40 nm manufacturing capacity at Japan Advanced Semiconductor Manufacturing, Inc. (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan.
MS2 a Beneficial System for Reducing Solder Dross
04/04/2024 | I-Connect007 Editorial TeamWe recently spoke with Octavio Raygoza, sales manager for P.Kay Metal in Mexico, to discuss how P.Kay’s MS2® system for reducing solder dross is both financially and environmentally responsible. By reducing solder dross up to 85%, you nearly double the output while consuming the same amount of solder.
Hentec/RPS to Exhibit Vector Selective Soldering and Odyssey Lead Tinning Systems at IPC APEX EXPO 2024
04/04/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability testing equipment, is pleased to announce it will exhibit its Vector 300 selective soldering and Odyssey 925 lead tinning systems at the upcoming IPC EXPO 2024.