Behind the Design: Visteon®


Reading time ( words)

First place winner in the Transportation & Automotive category for the 2014 Technology Leadership Awards went to: Visteon, United States. 

Design: automotive heads-up display

Design team: Hai Pham, Padmanaban Kanagaraj, and Krzysztof Russa

Design challenges:

  • BGA connections
  • The connections between 0.80 mm pitch BGA microprocessor 624 pin 25 X 25, two DDR3 96 pin 16 X 16, one Flash 1 mm pitch 64 pin 8 X 8 and the 30 pin double side edge connector proved to be very challenging. The requirements were to place the traces in close proximity in order to minimize trace length. Utilizing Constraint Manager allowed the requirements to be met while complying with all design rules for performance and fabrication.
  • Through-hole vias used for cost; challenging to route to BGA.
  • Mechanical: keepouts for slots, holes, and metal contact with housing
  • Power management: eight power rails to microprocessor; decoupling requirements 
Visteon_Award_Winning_Design-520x186.jpg

Design tools and team comments:

  • Xpedition® Enterprise
  • Constraint Manager: Multiple net classes to manage signal integrity, EMI constraints
  • Hyperlynx PI was used to analyze decoupling capacitance for each group of circuits, such as power and GND plane areas, as well as the proximity of decoupling capacitors to the IC, and the number of vias and capacitors used.
  • Hyperlynx SI was used to measure and analyze circuit delay, cross talk, and impedance.
  • Hyperlynx Thermal was used to analyze component temperature and over PCB temperature to ensure the design met requirements.

Judges’ comments:

  • Excellent example of high-speed, higher-than-average density design using the latest design simulation and tools for new innovative features in autos.
  • This board was designed using standard layout technology. Tight interconnections to meet electrical requirements were compounded by strict mechanical limitations. Good description of what they went through to complete this design.

About the Technology Leadership Awards

Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and designers who use innovative methods and design tools to address today’s complex PCB systems design challenges and produce industry-leading products. See the full list of 2014 winners here.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/28/2020 | Andy Shaughnessy, Design007 Magazine
This week, we have quite a potpourri for you. There's good news about the PCB market. And as this year continues to surprise us at every turn, companies are discovering the true nature of their leaders. Todd Kolmodin has a great column about bosses and leaders and why the two words are not synonymous. Not to be outdone, columnist Barry Olney found a way to explain the wavelength of electromagnetic energy by using a chocolate bar and a microwave oven. We also have great articles by Sagi Reuven and Pete Starkey.

Avishtech: A New Player in the Field Solver and PCB Simulation Tools Market

08/13/2020 | I-Connect007 Editorial Team
It has been a crazy year with lots of ups and downs. But within the clouds, we’ve seen plenty of silver linings, too. Case in point: Avishtech, a brand-new company lead by founder and CEO Keshav Amla. (You may be familiar with his father, Tarun Amla, a veteran PCB materials technologist who is now with ITEQ.) We recently caught up with Keshav and asked him to discuss his company’s simulation tools, his plans for the company, and what it’s like launching a company in this “new normal.”

Dana Korf: What Fabricators Expect From Designers

06/18/2020 | I-Connect007 Editorial Team
Andy Shaughnessy and Barry Matties spoke with Dana Korf, former chief PCB technologist for Huawei and currently principal consultant of Korf Consultancy, about the breakdown in communication between manufacturers and designers. Dana discusses exactly what a fabricator expects from a PCB designer, why these expectations are often not met, and the need for designers to make mistakes so that they can learn from them.



Copyright © 2020 I-Connect007. All rights reserved.