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Mentor White Paper: Analyzing Crosstalk’s Impact on BER Performance
August 26, 2015 | Mentor GraphicsEstimated reading time: Less than a minute

This paper by Mentor Graphics’ Vladimir Dmitriev-Zdorov and Zhen Mu discusses two major issues associated with channel crosstalk that have not been fully addressed previously: models from measurements and algorithms for BER prediction.
It presents a practical solution that allows designers to add in near-end or far-end crosstalk characterized by a group of 4-port S-parameters, rather than to perform multiport parameter characterization.
The paper then presents in details two simulation approaches for channel crosstalk: synchronous and asynchronous algorithms, and considers their implementations in time and statistical domains.
Finally, it gives examples of the proposed procedures implemented together with IBIS-AMI buffer models and discusses their comparative advantages and limitations.
To download this paper, click here.
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Brent Fischthal - Koh YoungSuggested Items
Pulsonix 14.0 Adds Embedded Simulation, Smarter 3D Views, Enhanced Workflow
10/08/2025 | PulsonixPulsonix, the EDA company delivering technology-leading PCB design solutions, is proud to announce the launch of Pulsonix 14.0, its latest PCB design software platform.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
Siemens Leverages AI to Close Industry’s IC Verification Productivity Gap in New Questa One Smart Verification Solution
05/13/2025 | SiemensSiemens Digital Industries Software announced the Questa™ One smart verification software portfolio, combining connectivity, a data driven approach and scalability with AI to push the boundaries of the Integrated Circuit (IC) verification process and make engineering teams more productive.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.