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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
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Register Now for DesignCon’s Early Bird Pricing
August 26, 2015 | DesignCon 2016Estimated reading time: Less than a minute
DesignCon 2016 is offering more than 100 technical paper sessions, panels and tutorials covering signal integrity, power integrity, jitter, crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more.
Taking place annually in Silicon Valley, DesignCon was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country.
To register now for Early Bird pricing, click here.
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Brent Fischthal - Koh YoungSuggested Items
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Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
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