-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Fast Interconnect Announces Multi-Platform Design Services
September 2, 2015 | Fast InterconnectEstimated reading time: 1 minute
Fast Interconnect is now offering its customers a choice of CAD software platforms. According to co-founder Gary Griffin, “One large benefit of coming to Fast Interconnect is that fact that we can design your product in your existing CAD software package. Many companies that ask for design updates find it hard to find a company to assist them that can use the software they have established as their core software design suite.”
This provides immediate advantages for PCB designers.
“Keeping the design in the software currently being used enables the customer to have a useable database in their archive that their engineers are comfortable with. This also means that for future updates the customer is not forced to remember what package was used and where it was done,” Griffin continued. “This provides a freedom from being forced to go with a different design package simply because you are in a hurry and don’t feel you have a choice. We provide that freedom of choice.”
The available CAD packages are Mentor Graphics PADS/Xpedition®/xDX Designer, Cadence Allegro®, Zuken CADSTAR, Altium, P-CAD and Protel. Schematic capture packages for all of the aforementioned, as well as Cadence OrCAD.
As a value-added service, Fast Interconnect performs a full CAM preview of the Gerber files before they are released to the customer. This ensures there are no issues that were not evident during the design review.
For more information, visit www.fastinterconnect.com.
Suggested Items
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
07/16/2025 | SEMIElectronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Pulse: Design Constraints for the Next Generation
07/17/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.