CPI Enhances Printed Electronics Capability; Installs NovaCentrix PulseForge
January 5, 2016 | Centre for Process Innovation (CPI)Estimated reading time: 3 minutes
The Centre for Process Innovation (CPI) has recently partnered with NovaCentrix to install a specialist system designed for the high speed photonic curing of printed electronics inks. The NovaCentrix PulseForge 1300 state-of-the-art system is the first of its kind in the UK to be available to clients on an open access basis and will aid the commercialisation of a host of applications including printed sensing and Radio Frequency Identification (RFID) and Near Field Communication (NFC) antennas for smart packaging. The recent installation builds upon CPI’s existing capability for the market adoption of printed sensing technologies, allowing companies to develop and scale up their concepts from laboratory scale right through to pilot production.
Photonic curing has become a critical process in the manufacture of printed electronics products as very little energy is needed to sinter the inks to a high temperature. This allows for printed circuits to be produced on inexpensive and flexible materials such as plastic, paper or cardboard, whilst achieving excellent conductivity and without causing thermal damage to these materials. The technology is ideal for a number of printed electronics based applications that utilise low cost substrates such as printed temperature, capacitive touch and medical sensors, in addition to wearable electronics, energy harvesting devices and intelligent packaging products.
The NovaCentrix PulseForge tool at CPI uses specialist computer controlled high-intensity pulsed light technology enabling conductive inks to be sintered or annealed in a matter of milliseconds. The tool also provides the opportunity for comparably low cost inks formulated from copper-oxide and the rapid development of new printable electronics applications. Processing developed with the PulseForge 1300 at CPI can immediately be applied to volume production using the PulseForge platforms already in use for manufacturing of products sold world-wide.
New opportunities are opening up to integrate high volume, low cost printed sensors into everyday products with applications in a number of market sectors. The ‘Internet of Things’ and NFC are increasingly gathering attention from businesses, technology providers and most importantly the modern day consumer. NFC allows consumers to intuitively communicate with everyday items such as product packaging and sensors. The printing of electronic functionality has enabled product designers to embed electronic technology into their designs, creating innovative products that are low cost, smarter, lightweight and wireless. Applications are numerous, from interactive point-of-sale products and branding to disposable printed bio-sensors used in medical analysis and unobtrusive printed smart labels that allow for identification and anti-counterfeiting control. The integration of advanced printed sensors into paper and plastic opens up a wide range of market opportunities to create products with added value. Sensors can be designed to provide the opportunity to optimise logistics operations and stock control within the product life cycle and also to indicate the validity or quality of a product or whether the packaging has been subject to tampering during its transport and storage prior to purchase.
Page 1 of 2
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.