-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Insulectro Tees Up Signal Integrity Product Arsenal at Designcon
January 13, 2016 | InsulectroEstimated reading time: 2 minutes

Insulectro, a leading distributor of materials for use in the printed circuit board and printed electronics industries, has announced its plan to speak directly to PCB designers’ greatest challenge – signal integrity – during next week’s DesignCon in Santa Clara, CA (January 21-22). Insulectro can be found in space #414.
Attendees will learn first hand about signal loss solutions as Insulectro aggregates products from their suppliers Isola, DuPont, Oak-Mitsui, CAC Inc., and Ormet Circuits.
“This is a very strategic show for the PCB industry,” said Ken Parent, Insulectro Vice President of Sales, “It’s located right in the heart of Silicon Valley and attracts all members of the supply chain – from suppliers to fabricators, plus designers and OEMs. We are fortunate to have been a major player in Northern California for many years. It’s a perfect opportunity for us to showcase the incredible array of products we offer that help to maximize signal integrity.”
Vice President of Technology Chris Hunrath agrees, “Engineers and designers attend DesignCon looking for solutions to the continual challenge of signal loss. We hope to engage the attendees and discuss their issues and introduce them to the material solutions we provide.
“They will see some interesting new laminate materials from Isola designed for high speed applications as well as high-quality electrodeposited copper from one of our newest suppliers – Oak-Mitsui,” Hunrath continued. “We have knowledge and experience with many different materials used in PCB construction and are expert at how they work together. A broad range of dielectrics, foils, interconnecting pastes and imaging technologies enables us to offer systems to different design requirements.”
Parent added, “There’s a new no-glass solution for rigid, fine-line applications being introduced by one of our top-flight suppliers at the show and we’ll also focus on the exciting possibilities of Ormet Sintering Paste – a lead-free paste that is highly electrically and thermally conductive and cures to form a solid metallurgical bond.
“Stop by our booth, #414, at DesignCon and get acquainted with us and the best-in-class products we offer. And don’t forget, technical service is an important part of the Insulectro difference. We have a complete staff of Field Application Engineers ready to work with you on solutions that are on-time, on-target, and on-budget,” Ken Parent concluded.
About Insulectro
Insulectro is the leading supplier of materials used to manufacture circuit boards and printed electronics. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.
Insulectro supplies advanced engineered materials manufactured by DuPont Microcircuit Materials, DuPont Circuit & Packaging Materials, Isola, LCOA®, CAC, Inc., Integral Technology, Pacothane, Oak-Mitsui, Shikoku, and Focus Tech.
Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.