It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Orbotech to Supply Seven UV Laser Drilling Systems to Japanese Electronic Materials and Components Manufacturer
January 14, 2016 | OrbotechEstimated reading time: 1 minute
ORBOTECH LTD. has received an order for seven Emerald™ UV Laser Drilling systems from a leading Japanese manufacturer of ceramic-based electronic components and solutions. This customer, which produces a range of components used in applications including mobile phones, home appliances, automotive systems and healthcare devices, will utilize Orbotech’s Emerald systems to drill smaller, high-quality via openings in multi-layer ceramic-based IC substrates for next-generation applications.
Orbotech’s Emerald systems were selected for their ability to support mass production of ceramic-based IC substrates while maintaining throughput, accuracy and quality. Ceramic packaging is often used for very small form factor devices and to ensure RF performance support, which require production tools. The small size and the stringent performance requirements of ceramic designs demand a system that is able to drill extremely small via holes consistently and accurately.
“The worldwide demand for smaller and sleeker electronic devices with higher performance capacity continues to increase”commented Yair Alcobi, president of Orbotech Asia East. “Orbotech’s solutions enable manufacturers to develop next-generation electronic devices in smaller form factors, and offer exceedingly high accuracy with very attractive cost of ownership. This customer’s follow-on order for additional Emerald systems validate the effectiveness of this cutting edge solution and affirms our successful collaboration in providing optimal production tools to meet customers’ needs.”
About Emerald Series UV Laser Drilling
Orbotech’s Emerald series UV Laser Drilling solutions simultaneously drill eight areas on a panel through patented Multi-Path Technology. High-power UV laser drilling achieves the best registration accuracy in the market. The Emerald series supports below 20 μm via drilling through ABF, polyimide, ceramic, resin, mold compounds, metal and solder resist substrates with no residue or damage to the bottom of the via, and no undercut.
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics market and adjacent industries. The company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems.
For more information, visit http://www.orbotech.com/.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.