All material expands and contracts with temperature change, which is called the coefficient of thermal expansion (CTE). Eran Navick explains where and how the laminate expands effects the operation of the printed circuit in different ways.
Joe Clark, co-founder of DownStream Technologies, gives Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.
Ruben Contreras often gets questions from customers on one of his favorite subjects in PCB design: controlled impedance. Ruben explains how controlled impedance is a science, which is why he likes it; therefore, it must be designed...
This year marks the 20th anniversary of IPC APEX EXPO, and IPC is thrilled to celebrate this event milestone with attendees, exhibitors, and presenters. Their dedication to and involvement in IPC APEX EXPO is directly responsible for...
Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column,...
Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee by Patty Goldman
The Success of IPC’s STEM Student Outreach Program by Charlene Gunter du Plessis
Inspiring Next-generation Engineers Through STEM by Barry Matties
Avoiding EMI Problems With Lee Ritchey, a conversation with Lee Ritchey
Eric Bogatin Looks at EMI Root Causes and Solutions, a conversation with Eric Bogatin
PCB Fixtures for Power Integrity, by Istvan Novak
The Impact of PDN Impedance on EMI, by Barry Olney
Clearing Up the Buzz, by Tim Haag
EMI Challenges: A Contract Designer’s Take, an interview with Alexander Löwer