FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

Global Technology: The Importance of Laminate CTE in PCB Design

February 20, 2020 | Eran Navick, FineLine USA

All material expands and contracts with temperature change, which is called the coefficient of thermal expansion (CTE). Eran Navick explains where and how the laminate expands effects the operation of the printed circuit in different ways.

Joe Clark Says DownStream Is Ready for More Growth in 2020

February 20, 2020 | Kelly Dack, CID+, EPTAC

Joe Clark, co-founder of DownStream Technologies, gives Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.





MORE ARTICLES

COLUMNS:

Fresh PCB Concepts: Controlled Impedance—Design to Testing

February 12, 2020 | NCAB Team, NCAB Group

Ruben Contreras often gets questions from customers on one of his favorite subjects in PCB design: controlled impedance. Ruben explains how controlled impedance is a science, which is why he likes it; therefore, it must be designed...

One World, One Industry: IPC APEX EXPO 2020—A Special Anniversary Year

February 3, 2020 | John Mitchell, IPC--Association Connecting Electronics Industries

This year marks the 20th anniversary of IPC APEX EXPO, and IPC is thrilled to celebrate this event milestone with attendees, exhibitors, and presenters. Their dedication to and involvement in IPC APEX EXPO is directly responsible for...

Foundations of the Future: Get More Engaged in 2020

January 23, 2020 | IPC Education Team, IPC

Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column,...

EMI/Power Distribution Featuring:

Avoiding EMI Problems With Lee Ritchey, a conversation with Lee Ritchey
Eric Bogatin Looks at EMI Root Causes and Solutions, a conversation with Eric Bogatin
PCB Fixtures for Power Integrity, by Istvan Novak
The Impact of PDN Impedance on EMI, by Barry Olney
Clearing Up the Buzz, by Tim Haag
EMI Challenges: A Contract Designer’s Take, an interview with Alexander Löwer

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