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EIPC Technical Snapshot: Cleanliness

March 1, 2021 | Pete Starkey, I-Connect007

John Ling’s invitation to the fifth in EIPC’s series of Technical Snapshots was as droll as we have come to expect: “In these confined days of lockdown, and exhortations to stay at home and only go out for exercise, this only exercises the natural inclination to hop on a ‘plane to some sunshine.’ Although not the same as Factor 20, one of our webinars gives a high degree of protection from harmful ignorance, and you do not have to go out in the cold.”

The Magnitude of Stackup Considerations

March 1, 2021 | Michael R Creeden, CID+, MIT, Insulectro

When I was asked to write about stackup creation, I paused at the magnitude of this subject. It is similar to the framework used to pour concrete cement—you need to get the framework right because the framework has such a big impact on the final outcome. Such is the case with shaping the success or failure of our circuits. In writing the newest training manual due out early this year, I observed that the longest chapter in the textbook was dedicated to this subject.





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Time to Market: Customer Service is Still the Key

February 18, 2021 | Imran Valiani, RUSH PCB Inc.

Times have changed and fast time to market is not an excuse to skimp on quality, technology or customer service. In fact, great customer service is more important than it has ever been, especially when it comes to quick turn-around...

Elementary, Mr. Watson: The Printed Circuit Board Design

February 11, 2021 | John Watson, Altium

John Watson addresses continuous improvement by examining the PCB design...

In person or online, our goal is to maintain IPC APEX EXPO’s position as the premier event for the electronics industry by providing far-reaching insights and ideas. The challenge we face to provide a premier networking event is...

Footprints and Library Management Featuring:

  • Best Practices for Footprint Design and CAD Library Management, a conversation with John Watson, CID
  • Footprint Design Techniques: Don’t Trust Datasheets, a conversation with Tom Hausherr, CID+
  • Managing Footprints with Integrated EDA Tools, by Matt Walsh, Siemens EDA
  • A Library Management Cautionary Tale, by Stephen V. Chavez, CID+
  • Circuit Material Library Considerations, by John Coonrod
  • The Case for Expansive Parts Libraries, by Bob Tise
  • Footprints—Small Steps with a Giant Impact, Kelly Dack, CID+
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