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When an engineer researches high-frequency circuit materials, they will notice there are many offerings of what appears to be the same material type but with different Dk values. One might ask, “Why are so many different Dk values desired?” The answer is not straightforward, but there are very good reasons for these different materials. This column will give a quick overview of the need for these materials with different Dk values, as related to different high-frequency applications.
A ball-grid-array (BGA) device can be a daunting component to route, especially in fine-pitch arrays featuring solder ball counts in the hundreds and pitch values as tight as 0.5 millimeters. Bob Tise and Matt Stevenson describe how you can take the mystery out of BGA routing and create a PCB design that can handle all those pesky narrow spaces.
Selecting the correct material is critical if you want your circuit board to survive the assembly process or come out of the assembly process in good condition. Jeffrey Beauchamp explains the four main characteristics from the...
In past columns, Sagi Reuven has written about topics mostly related to the shop floor. In this column, he talks about design for manufacturing (DFM). It is clear to everyone in the Industry 4.0 era that the holy grail is to close the...
When trying to get a new product to market, time can be the most important factor when it comes to its future success or failure. Imran Valiani details 12 characteristics you should look for when choosing and developing a long-term...
