FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

DFM 101: Final Finishes—Electrolytic Nickel/Gold

January 30, 2023 | Anaya Vardya, American Standard Circuits

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

IPC APEX EXPO Wrap-up

January 30, 2023 | Andy Shaughnessy, Design007 Magazine

IPC APEX EXPO 2023 is over, and I think it was successful show no matter how you slice it. There was barely a break in traffic on the show floor on Tuesday and Wednesday, and even on Thursday I saw people sprinting to close one more deal. Some committee meetings had nearly 200 participants; the meetings I sat in on were anything but boring.





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Elementary, Mr. Watson: Advanced Packaging Not a Passing Fad

January 26, 2023 | John Watson, Altium

As it is said, necessity is the mother of invention. That is precisely the situation when we are discussing the PCB design industry. We are living in what can only be described as the golden age of Electronics. The advancements and...

Sensible Design: Automotive Conformal Coating Applications

January 25, 2023 | Team Electrolube, Electrolube

Conformal coatings are all around us. The benefits they offer are discreet but intensely purposeful, as they protect electronic circuitry against harsh environments and help to extend the reliability and lifetime of our devices. With...

Fresh PCB Concepts: Designing Controlled Impedance PCBs

January 19, 2023 | Team NCAB, NCAB Group

Imagine that you are getting ready to work on a new PCB when the electronics engineer you work with suddenly gives you a controlled impedance requirement for the board. This will be your first experience designing a PCB with...

The Advanced Future Featuring:

  • Advanced Packaging Means Advanced Routing Issues, by Kris Moyer
  • A Challenge Facing Aerospace Designers in 2023, by Lee Ritchey
  • Threading the Needle Through Advanced Packaging, by Tim Haag
  • Advanced Packaging Not a Passing Fad, by John Watson
  • Scaling Beyond Silicon, by Ashutosh Mauskar
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