Summit Interconnect Adds John Vaughan to Lead Strategic Market Initiatives
Flex Expert Joe Fjelstad Releases Nine-Part Flexible Circuit Technology Workshop Series
American Standard Circuits Continues Wednesday Webinars Through September
PV Nano Cell Expands Its Application Department Services
Arlon EMD Launches New Website
Summit Interconnect, Inc. Acquires Integrated Technology Ltd. (ITL Circuits)
PV Nano Cell Appoints Mr. Masayuki Tani as New Advisory Board Member
Flex Veteran Daniel Skiba Joins CHASM Management Team
PV Nano Cell Launches New Program for Turnkey Printing Solutions Focused on Mass-Production Customers
Matrix Offering a Lamination Assist System for Flexible Circuit Lamination
Merlin Flex Achieves Formal Global Approval by Thales UK
HARTING’s Component Carrier Can Replace Flexible PCBs
AT&S Starts Partnership With Design Company IMST GmbH
Taiyo America Announces New Technical Sales Engineer
Liquid X Receives OEKO-TEX Standard 100 Certification for Textiles
Cogative Intelligent System Joins CHASM Advanced Materials Partner Program
SEMI FlexTech Launches Three New Projects to Advance Flexible Hybrid Electronics
ROARTIS Introduces Fast Cure Materials for Printed Electronic Applications
InnovationLab Demos Printed Organic Sensor ‘Smart Mat’
Ynvisible Expands Its Printed Electrochromics Offering Through License Agreement with RISE
EastPrint Expands Offerings for Printed Electronics to Include CNT Hybrids
North American PCB Industry Sales Up 1.0 Percent in May
BGM Electronic Services Joins CHASM Preferred Integration Partner Program
Registration and Sponsorships Open for IPC E-Textiles 2020 Virtual Summit
Critical Communications Component Made on a Flexible Wooden Film
AT&S Uses Temporary Corona Short-Time Work for the Fehring Plant
AT&S Appoints Ingolf Schröder as New COO to the Management Board
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Advanced Copper Foil Inc. Granted Trademark Registration for EUROPADS