Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
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Where Electronics Manufacturing Turns for Trusted Technical Insight
In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Happy New Year, everyone! This year promises to be a year of evolution and change. If you didn’t catch Michelle Te’s video review of the most-read stories of 2025, be sure to visit our LinkedIn page for the update. Expect to see changes here at I-Connect007 in 2026 as well. We’re cooking up new ways to better bring you the kind of coverage we do best: reporting that gets under the surface. We’re always asking, “What does that mean to the industry?”
From Technology to Talent: The Ultimate Formula for Success
American Standard Circuits (ASC) has been a cornerstone of the U.S. PCB manufacturing industry. With more than 50 years of expertise, the company has evolved from its early focus on RF technology into a full-spectrum provider of advanced PCB solutions, including RF/microwave, metal-backed, backplane, flex and rigid-flex, and ultra high density interconnect (UHDI) boards. Customers range from military and aerospace applications to high-reliability commercial sectors, including medical, telecom, radar, and transportation.
I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future
I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?
Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec
Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.
UHDI Fundamentals: An Overview of UHDI Layer Types
UHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.
I-Connect007 Editor's Choice: Five Most-Read Articles for 2025
Happy New Year! As we begin 2026, I would like to pause and reflect on our most-read articles from 2025. They give us insight into what you’re focused on, and what you’re trying to understand, prepare for, and improve. Each piece earned its place through relevance, depth, and sustained reader engagement.
Advance Your Electronics Career in 2026: Upcoming Instructor-Led Courses from Electronics U
Staying competitive in the electronics industry requires continuously strengthening your technical expertise. Electronics U is excited to present a new lineup of expert-led, online courses designed to elevate your skills in PCB design, electronics assembly, wire harness design, program management, and more. Whether you're looking to build foundational knowledge or expand into specialized applications, these immersive, instructor-guided sessions will help you master the tools and techniques that today’s leading companies rely on.
Kelly Atay: Work-Life Balance for a Marketing Professional
Kelly Atay has one piece of advice: Don’t wait until you’re burnt out. Balance requires intentional choices and consistent practice. As the sales and marketing manager at ASC Sunstone Circuits, Kelly often feels herself being pulled in many directions. This interview examines her ongoing efforts to achieve a healthier work-life balance. While it’s generally positive, Kelly is still learning to set stronger boundaries, and uses audiobooks during her commute as a daily reset time.
Happy New Year from the I-Connect007 Staff
The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.
Voices of the Industry Podcast Explores the Evolving Role of Inspection Systems in EMS Manufacturing
Inspection technology continues to play a pivotal role in the evolution of electronics manufacturing services, and the latest episode of Voices of the Industry brings that conversation into sharp focus. Hosted by I-Connect007’s Nolan Johnson, this episode features Joel Scutchfield of Koh Young, a recognized leader in 3D measurement-based inspection systems.
Denny Fritz: A Hall-of-Fame Career in PCBs
From DuPont to the Navy’s top electronics programs, Defense Speak Interpreted columnist Dennis “Denny” Fritz has devoted his career to advancing defense technology and collaboration. In this interview, Denny reflects on decades of leadership, service, and innovation, offering timeless advice on staying technically active and leading with purpose.
CMMC 2.0: What You Need to Know
Tenets of the Department of Defense's (DoD) Cybersecurity Maturity Model Certification Program (CMMC) 2.0 went into effect on Nov. 10. What are the primary differences between 1.0 and 2.0 compliance, and what exactly must be in place now? CMMC 2.0 is now being written into DoD contracts and enforced through DFARS (Defense Federal Acquisition Regulation Supplement), with a three-year phased rollout. For PCB and electronics manufacturers in the defense supply chain, this is now a real gate to doing business with the DoD, not a “nice to have.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
What a year it’s been! I don’t think anyone could have anticipated the level of shake-up that was to come on the global trade scene when U.S. President Donald Trump came into his second term in January, but the drama that has ensued rivals anything ever aired on “The Apprentice.” However, I am somewhat heartened by our current position compared to how things felt in Q2 of this year. Much remains to be worked out, but as we sprint into the new year, there are three things I know for sure: 1) Working in tech is never dull—you will not be bored in 2026; 2) Expect to work very hard; and 3) Business, like life, will go on no matter what. I hope you enjoy my picks for week: all good reads for different reasons. Happy New Year!
Merry Christmas from I-Connect007!
The I-Connect007 offices are closed today, in observance of the Christmas holiday. As part of the Global Electronics Association, the offices remain closed through New Year’s Day. I-Connect007 will still publish daily and weekly newsletters (with the exception of Christmas and New Year’s Day). Some staff members will still be checking email. Just for fun, we thought we’d share a bit of Christmas tradition about the gingerbread house. You’ve likely built one at some point and perhaps wondered how this tradition originated.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.
Real Time with... productronica 2025: Jiva's Product Progress Update
Jiva’s Jack Herring provides an update on products, scalability, and lifecycle assessments. He answers questions about material properties, compliance, and sustainability. Jack also highlights the importance of being a market option and discusses plans for scaling production in the UK and Asia to meet demands and reduce carbon footprints.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Before diving into this week’s must-reads, I want to spotlight the incredible batch of interviews our team captured at productronica. They go beyond the quick booth chitchat and dig into the most pressing topics in electronics manufacturing. We spoke with companies and leaders who are shaping what happens next, and the conversations touch on the challenges and innovations that matter most to the industry today.
Tom Kastner: Navigating the Complex World of M&A
With a background spanning Silicon Valley, Japan, and Chicago, Punching Out columnist Tom Kastner has helped countless PCB and EMS business owners achieve their goals. In this interview, Tom reflects on his path from anthropology student to M&A expert, his love of nature and restoration work, and the satisfaction of guiding entrepreneurs through one of the most complex—and rewarding—transitions in business.
I-Connect007 Announces the December Issue of Advanced Electronics Packaging Digest
Landing in inboxes Monday, Dec. 15, the next issue of Advanced Electronics Packaging Digest (AEPD) explores some of the most pressing questions shaping U.S. advanced electronics capability, from defense readiness to power constraints and the fast-moving world of printed electronics. This month, we spotlight the technologies, strategies, and industry perspectives driving next-generation manufacturing forward.
Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
Ventec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.
Summit Interconnect’s Leadership in the ‘Silicon Prairie’
Summit Interconnect is one of the two largest PCB fabricators in the United States. I visited with Deepak Makwana, general manager of Summit’s Chicago plant, Business Development Manager Tom Veitch, and Vice President of Technology Gerry Partida at their Schaumberg, Illinois (Summit Chicago) facility to learn more about the evolution of PCB manufacturing in the Midwest.
Understanding Agentic AI
For those of us who design, build, and use computers, AI is our most frequent topic of conversation. Next to that is agentic AI, a form of artificial intelligence designed to function autonomously. But how is it different from traditional and generative AI? Simply said, agentic AI can execute complex tasks autonomously with little or no human intervention.
Real Time with... productronica 2025: Energy Security and Nuclear Fusion Innovations
Pete Starkey meets with Alun Morgan to discuss significant upcoming EIPC events, including a conference at a nuclear fusion reactor site in France and a summer conference in Lithuania. He emphasizes the importance of energy security and advancements in nuclear fusion technology, particularly the role of AI in reactor design. Additionally, Alun highlights a new PCB plant in Lithuania, marking a major investment in the region.
Mehul Davé: A World Full of Opportunities and Possibilities
In this interview, entrepreneur, technologist, and global visionary I-Connect007 columnist Mehul Davé reflects on a lifetime of innovation. From founding companies and mentoring teams to shaping global supply chains, Mehul discusses leadership, culture, and optimism for a thriving PCB future—reminding us that “chips don’t float,” and opportunity is everywhere.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Yesterday was the U.S. Thanksgiving holiday. The traditional meal is, of course, roast turkey with “all the trimmings.” Although not everyone observes that menu, most do, and it was reported that 42 million turkeys were consumed on that day. With an average weight of 16 pounds per turkey, we cooked up 672 million pounds! With approximately 342 million people in the U.S, that pencils out to just under two pounds of drumstick and white meat per person. That, my friends, is a whole lot of leftovers.
I-Connect007 Closes for Thanksgiving Day
I-Connect007 recognizes Thanksgiving Day and its office will be closed Nov. 27–28, 2025. The Thanksgiving holidays, as celebrated across North America, trace their roots to early harvest celebrations, expressions of gratitude, and moments of national significance. In Canada, Thanksgiving is often linked to explorer Martin Frobisher’s 1578 Arctic expedition, where he held a ceremony giving thanks for a safe passage—decades before the Pilgrims arrived in North America.
productronica 2025: Showcasing the Future of Electronics Manufacturing for 50 Years
Last week’s productronica 2025 at Messe München in Munich marked a significant milestone for the European electronics manufacturing industry. The biennial show celebrated its 50th anniversary, highlighting five decades of technological transformation as the largest global trade fair for electronics manufacturing. Co-located with Semicon Europa, productronica attracted an attendance of over 47,000 visitors, featuring more than 1,600 exhibitors from over 50 countries.
Schmoll's Kurt Palmer: Building on a Strong Foundation in PCB Fabrication
From growing up surrounded by laminates to leading one of the industry’s premier equipment suppliers, Driving Innovation columnist Kurt Palmer’s career has come full circle. In this feature, he shares lessons learned from building a family business, his passion for customer commitment, and why adaptability, optimism, and strong relationships remain the keys to thriving in an ever-evolving PCB landscape.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Were you one of the lucky ones who made it to Europe’s largest electronics trade show this week? By all accounts, this massive event was buzzing with new technologies, packed booths, and plenty of tired feet by the end of each day. So, if you’re heading home from productronica (or, like me, just enjoying the end of a busy week), now’s the perfect time to unwind a bit. Settle into that airplane seat (or office chair), grab a snack, and catch up on some great reads from I-Connect007.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I read an interesting article this week about a breakthrough on building microprocessors to run on microwaves rather than traditional digital circuitry. It cites an academic study that begins, “The development of high-bandwidth applications, including multi-gigabit communication and radar imaging, demands faster processing. However, in the microwave regime, where frequencies exceed clock rates, sampling and computation become challenging. Here we report an integrated microwave neural network for broadband computation and communication.”
The Impact of the AI Boom on PCB and Raw Materials Supply Chains
The PCB industry is entering a period of unprecedented structural change, driven by the demands of artificial intelligence and advanced computing. What was once a cyclical market has become a capacity race. It’s one that rewards foresight, collaboration, and strategic supply partnerships. Understanding these dynamics is essential for maintaining stability and growth across all market segments. This report, created by Ventec International Group, provides a clear view of how AI-driven demand is reshaping the PCB materials landscape and what actions are required to secure long-term supply.
Real Time with... productronica 2025: Looking Ahead to productronica, and a Stronger European Electronics Ecosystem
Next week at productronica, the Global Electronics Association Europe will be hosting a full program each day of the show at their booth in Hall A1. Philippe Leonard, head of the Association’s European office, recently shared what’s happening for our industry in Europe, details of the Hand Soldering World Championship at the show, a preview of a new Cable & Wire Harness competition kicking off in 2026, and information about the impressive lineup of speakers at the Electronics Industry Forum at the Association’s booth.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
The Technical Backbone of an EMS Company: A CEO’s Perspective
As the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In electronics industry news, my picks start with Pete Starkey’s review of EIPC’s latest Technology Snapshot webinar. With all eyes on Europe as a pressure lever for ESG worldwide, Pete’s coverage is a must-read. Next, I want you to check out the new column by Leo Lambert on EPTAC, who provides a solid and complete overview of UHDI from concept to assembly.
EIPC Technical Snapshot: Sustainability in Electronics Manufacturing
EIPC selected the highly topical issue of sustainability in electronics manufacturing for the 24th Technical Snapshot webinar on Oct. 29, with guest speakers Satoshi Konagai of Elephantech and Liisa Hakola of the VTT Technical Research Centre of Finland. The program was moderated by Kirsten Smit-Westenberg, executive director of EIPC, who also introduced each speaker.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Better Sustainability Policies for Electronics
I joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
FCT Leverages Flex Design and Total Build Solutions to Drive Innovation
What’s hot in flexible circuits right now? At PCB West, I spoke with Ben Savage, business development manager at Flexible Circuit Technologies (FCT), about their flex design services and end-markets where FCT sees the most flex activity. We also discussed the company’s focus on providing supply chain resiliency, as well as the constant search for new flex engineers. If you’re looking for a new opportunity in flexible circuits, FCT is hiring.
Global Electronics Association Releases Fall Schedule of Instructor-led Courses
Whether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Much of the news over the last week focused on the push-pull between the U.S. and China and the latter’s most recent announcement about rare earth mineral restrictions. Despite that situation, the IMF raised its growth forecast, and global markets showed cautious optimism. Then, as the U.S. attempted to retreat from all environmentally based policy and ESG gains achieved to date, the global shipping emissions pact continues to gain momentum.
Waging the Battle for American PCB Reshoring
Legislation is shaping global trade, tariffs, and sustainability and environmental regulations. David Schild of PCBAA discusses exactly where the U.S. stands in its efforts to reshore printed circuit board manufacturing for critical industries. This conversation at PCB West occurred on the first day of the federal government’s shutdown, so it seemed especially timely to hear David's thoughts and insights on how the current political climate is affecting efforts to achieve the U.S. industry’s reshoring goals.
New Course Presents a Comprehensive Guide to IPC Standards
Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been a busy week. We’ve been covering PCB West, and we’ll be bringing you a variety of news and interviews from the show in the next few weeks. We’ll also be attending SMTA International later this month, and productronica as trade show season rolls on.
This week, we have a number of interesting columns and news items. We start with a positive story about North American PCB sales, which were heading in the right direction in August. Don Ball writes about the ins and out of working with overseas partners, and there’s a great column by Dan Beaulieu on avoiding the temptation to offer discounts when your customer gets squirrely.
Jiva Leading the Charge Toward Sustainable Innovation
Environmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Though the news cycle felt a little less exclamatory this week, there were many global business news headlines worth revisiting. Among them, China announced a bold carbon emissions goal of 10% over the next decade to double its solar and wind power capacity. The Wall Street Journal published an article, “Global Port Leaders See Trade Shifting, Not Slowing,” a nod to businesses’ risk mitigation strategies and execution around overreliance on China coming into play in a bigger way.
Understanding Signal Integrity, the Foundation of High-Speed Digital Design
Signal integrity has become a critical factor in ensuring reliable performance in high-speed digital systems. As data rates continue to increase, engineers must understand the fundamental principles that govern how signals propagate through transmission lines and how to mitigate common issues that can degrade signal quality.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We definitely have advanced packaging on our minds this week at I-Connect007. We just launched our monthly “Advanced Electronic Packaging Digest,” and we’re feeling the excitement. Whenever we find ourselves in the middle of a technological sea change, we’re in for some fun.
UHDI Fundamentals: UHDI Technology and Quality 5.0
The convergence of ultra-high density interconnect (UHDI) technology and Quality 5.0 represents a transformative leap in electronics design and manufacturing. UHDI enables extreme miniaturization and enhanced performance, while Quality 5.0 delivers adaptive, intelligent human-centric quality systems. Together, they set the foundation for advanced electronics that are smarter, more resilient, and more sustainable.
Staying on Top of Signal Integrity Challenges
Over the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
Kris Moyer Discusses His Emerging Design Technologies Class
Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
Walt Custer: Making Data Interesting
I just learned that IPC Hall of Famer Walt Custer has passed away at 81. I first met Walt about 20 years ago when I started covering the fabrication industry. Right away, he started telling me which companies to watch and which trends to follow. This was in the years following 9/11, and things were still pretty fluid.
Industry Icon Walt Custer Passes Away
We regret to announce that Walt Custer passed away on Aug. 30, 2025. Walt’s son, Jonathan, shared the following: I am in complete shock that my dad, Walt Custer, is gone, and I am comforted that he died peacefully at 81 years old. Walt built CCG from the ground up 26 years ago, guided by his passion, hard work, and commitment to the printed circuit board community. His dedication not only established our company, but he frequently shared his experience as a chemist and industry executive veteran to provide market insights as an analyst, an avid speaker, a magazine columnist, a board and committee member and a data contributor for the electronics manufacturing community.
Wisdom From Data-center Power Pioneer Mike Mosman
Few engineers have moved the levers of modern electronics more decisively than Mike Mosman. From the pre-email computer rooms of the 1980s to today’s hyperscale campuses cranking out AI cycles, the retired power engineer and co-founder of CCG Facilities Integration has spent four decades proving that uptime is a design discipline, not a hope.
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