Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Latest Articles
Technology Pavilion Debuts at APEX EXPO 2026
Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.
NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
The I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
Growing an Engineer: Meet Emerging Engineer Julian Vega
Julian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.
Big Ideas Take the Stage: APEX EXPO 2026 Keynotes
Some of the most consequential conversations in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy. From IBM and Intel technologists to an AI futurist and a global industry leader, this year’s keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem.
I-Connect007 Launches Six-Part Podcast Series Highlighting the Critical Role of PCB Materials
I-Connect007, the leading media source for the electronics manufacturing industry, today announced the release of the first episode in a new six-part podcast series, “PCB Materials: The Backbone and Future of Electronics.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Frankly, there were so many worthy news items this week, it quite a bit of whittling to get it down to my five must-reads. For example, this week we showcased Schweitzer Engineering Labs’ new manufacturing facility in Moscow, Idaho. Marcy LaRont launched an On the Line With… podcast on materials, and the February issue of I-Connect007 Magazine features the annual APEX EXPO preview.
New IPC Standards Released
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q1 2026.
Changing the Electronics Systems Conversation
Rebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.
UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1
The electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes
IPC Standards: The Heart of the Electronics Industry
From its very inception, standards development has been at the core of the Global Electronics Association’s work, and APEX EXPO continues to serve as a major venue for standards development and approval. For example, standards committees from around the globe are expected to conduct more than 100 task group meetings during the event. We visited with the Association’s standards development team to learn more about their process, its impact on the industry, and how you can get your voice heard.
EIPC Winter Conference Review: From Innovation to Qualification
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
PCB Design in 2026 and Beyond
We asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.
EIPC Winter Conference Review: A Focus on Miniaturization
The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
EIPC Winter Conference 2026 Review: The Keynote Sessions
Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Design Village: Bringing the Design Community Front and Center
When APEX EXPO returns to Anaheim in March, PCB designers and design engineers will find a new hub on the show floor: the Design Village, a dedicated exhibition area launched by the Global Electronics Association to elevate the design experience and foster deeper engagement across the electronics ecosystem.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.
PCBAA Sets Its Priorities for 2026: Support in the House and Senate
David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In the continuation of this interview, David talks about the ways his organization is aligning its priorities with Washington, in particular, the Executive Branch. It might feel like a snail’s pace, but progress could mean financial support and more domestic security, even for the smaller companies.
What's Next in PCB Fabrication?
If you have been in the PCB business for any length of time, you either know Gene Weiner or know of him. With a career spanning more than six decades, he has been an active member of the Global Electronics Association (formerly IPC) since the early 1960s and was inducted into the Raymond E. Pritchard Hall of Fame in 2005 in recognition of his lifelong impact on the industry. Having presented hundreds of technical and management papers, he remains a sought-after speaker in the HDI and UHDI space, most recently being recognized at the TPCA conference in Taiwan.
Navigating the Shift: Key Trends Shaping Growth in AI and Electronics Through 2026
Global Electronics Association's Chief Economist Shawn DuBravac offers guidance on how companies can successfully navigate challenges and seize new opportunities in this dynamic industry. First, he says, economic growth will remain dangerously narrow. Prosperity will concentrate on artificial intelligence infrastructure, defense electronics, and high-income consumer spending, while companies outside these lanes face headwinds.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.
ICT Winter Seminar: Leading-edge Developments in Electronics Manufacturing
Early fog made the journey challenging for those travelling from afar, but it lifted to reveal a clear blue sky over Hinckley, Leicestershire, which is actually closer to the exact geographical centre of England than the familiar Meriden venue, for the Institute of Circuit Technology winter seminar in December. An intriguing programme, focused on some leading-edge developments in electronics manufacturing, more than justified the effort to attend.
How Technology, Materials, and Manufacturing Will Redefine 2026
Matt Kelly, chief technology officer and vice president of standards and technology for the Global Electronics Association, explores how technology, supply chains, sustainability, and standards are redefining the electronics ecosystem. This is the latest installment in a blog series exploring the future of the global electronics industry.
Is Washington Ready to Get Serious About PCBs?
David Schild, executive director of the Printed Circuit Board Association of America (PCBAA), leads an organization focused on the domestic manufacture of PCBs and substrates to support America’s critical microelectronics supply. In part one of this interview, he reflects on how a “perfect storm” during the COVID-19 pandemic actually ignited the conversation that has allowed PCBAA to flourish: Years of advocacy, the shock of COVID-era supply chain disruptions, and the long road to the CHIPS Act have helped to reshape the federal mindset on industrial policy.
MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics
The I-Connect007 Industry Resource Center brings together technical white papers from leading suppliers to help electronics professionals navigate today’s manufacturing and reliability challenges. Built as an educational hub, the Resource Center connects engineers and manufacturers with application-focused guidance on materials, processes, and performance considerations shaping modern electronics.
Normalizing the Impossible: The Next Era of PCB Fabrication
Sunny Patel, technical sales manager at Candor Industries, sees the intersection of advanced manufacturing, operational realities, and strategic foresight. In this interview, Sunny offers a technically-grounded view of what will define PCB fabrication through 2030. It’s not about incremental change, he says, but velocity, physics, and the people willing to get their hands dirty to push the limits of what’s possible.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Lately, I’ve been thinking a lot about storytelling. Partly because I’m reading "Creativity, Inc.," by Ed Catmull, and partly because it’s impossible to separate Pixar’s success from the power of the stories it tells, both on screen and behind the scenes. Everything matters to Pixar—from the technology to the leadership—but what makes Pixar truly special is the stories it tells about human emotions. They make our human complexity understandable.
Resilience Through Adaptation: What to Expect from the Electronics Industry in 2026
What does the future hold for the global electronics industry? Few organizations are better positioned to answer that question than the Global Electronics Association. With a unique, global perspective spanning the electronics supply chain, we work at the intersection of industry, policy, technology, and workforce development by engaging with member companies, governments, and partners across major regions worldwide.
Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond
The Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I was in Chicago this week, where the weather went from sunny and 45° F on the day I arrived to snow and ice by the next morning. As a California/Arizona native, let’s just say I love the look of snow much more than I love driving in it. Still, I am grateful to have been part of some genuinely fun teambuilding with my colleagues at the Global Electronics Association. My must-reads for this week are a diverse grouping of articles and columns, ranging from printed electronics and additive manufacturing to a comprehensive overview of the European EMS and PCB markets to marketing wisdom and, finally, a book to help you reach your full potential, personally and professionally.
Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
Where Electronics Manufacturing Turns for Trusted Technical Insight
In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.
Hall of Fame Spotlight Series: Highlighting Michael Carano
This month’s Hall of Fame spotlight features Michael Carano, a former recipient of the Finnegan Standards Medal, which honors those who have exhibited extraordinary leadership in developing and applying voluntary standards. He is the recipient of the Association’s Dieter Bergman Fellowship Award and was inducted into the Hall of Fame in 2014. Still well known within the industry, many of us have had the pleasure of working with Mike on numerous Association projects and committees over the years.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Happy New Year, everyone! This year promises to be a year of evolution and change. If you didn’t catch Michelle Te’s video review of the most-read stories of 2025, be sure to visit our LinkedIn page for the update. Expect to see changes here at I-Connect007 in 2026 as well. We’re cooking up new ways to better bring you the kind of coverage we do best: reporting that gets under the surface. We’re always asking, “What does that mean to the industry?”
From Technology to Talent: The Ultimate Formula for Success
American Standard Circuits (ASC) has been a cornerstone of the U.S. PCB manufacturing industry. With more than 50 years of expertise, the company has evolved from its early focus on RF technology into a full-spectrum provider of advanced PCB solutions, including RF/microwave, metal-backed, backplane, flex and rigid-flex, and ultra high density interconnect (UHDI) boards. Customers range from military and aerospace applications to high-reliability commercial sectors, including medical, telecom, radar, and transportation.
I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future
I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?
Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec
Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.
UHDI Fundamentals: An Overview of UHDI Layer Types
UHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.
I-Connect007 Editor's Choice: Five Most-Read Articles for 2025
Happy New Year! As we begin 2026, I would like to pause and reflect on our most-read articles from 2025. They give us insight into what you’re focused on, and what you’re trying to understand, prepare for, and improve. Each piece earned its place through relevance, depth, and sustained reader engagement.
Advance Your Electronics Career in 2026: Upcoming Instructor-Led Courses from Electronics U
Staying competitive in the electronics industry requires continuously strengthening your technical expertise. Electronics U is excited to present a new lineup of expert-led, online courses designed to elevate your skills in PCB design, electronics assembly, wire harness design, program management, and more. Whether you're looking to build foundational knowledge or expand into specialized applications, these immersive, instructor-guided sessions will help you master the tools and techniques that today’s leading companies rely on.
Kelly Atay: Work-Life Balance for a Marketing Professional
Kelly Atay has one piece of advice: Don’t wait until you’re burnt out. Balance requires intentional choices and consistent practice. As the sales and marketing manager at ASC Sunstone Circuits, Kelly often feels herself being pulled in many directions. This interview examines her ongoing efforts to achieve a healthier work-life balance. While it’s generally positive, Kelly is still learning to set stronger boundaries, and uses audiobooks during her commute as a daily reset time.
Happy New Year from the I-Connect007 Staff
The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.
Voices of the Industry Podcast Explores the Evolving Role of Inspection Systems in EMS Manufacturing
Inspection technology continues to play a pivotal role in the evolution of electronics manufacturing services, and the latest episode of Voices of the Industry brings that conversation into sharp focus. Hosted by I-Connect007’s Nolan Johnson, this episode features Joel Scutchfield of Koh Young, a recognized leader in 3D measurement-based inspection systems.
Denny Fritz: A Hall-of-Fame Career in PCBs
From DuPont to the Navy’s top electronics programs, Defense Speak Interpreted columnist Dennis “Denny” Fritz has devoted his career to advancing defense technology and collaboration. In this interview, Denny reflects on decades of leadership, service, and innovation, offering timeless advice on staying technically active and leading with purpose.
CMMC 2.0: What You Need to Know
Tenets of the Department of Defense's (DoD) Cybersecurity Maturity Model Certification Program (CMMC) 2.0 went into effect on Nov. 10. What are the primary differences between 1.0 and 2.0 compliance, and what exactly must be in place now? CMMC 2.0 is now being written into DoD contracts and enforced through DFARS (Defense Federal Acquisition Regulation Supplement), with a three-year phased rollout. For PCB and electronics manufacturers in the defense supply chain, this is now a real gate to doing business with the DoD, not a “nice to have.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
What a year it’s been! I don’t think anyone could have anticipated the level of shake-up that was to come on the global trade scene when U.S. President Donald Trump came into his second term in January, but the drama that has ensued rivals anything ever aired on “The Apprentice.” However, I am somewhat heartened by our current position compared to how things felt in Q2 of this year. Much remains to be worked out, but as we sprint into the new year, there are three things I know for sure: 1) Working in tech is never dull—you will not be bored in 2026; 2) Expect to work very hard; and 3) Business, like life, will go on no matter what. I hope you enjoy my picks for week: all good reads for different reasons. Happy New Year!
Merry Christmas from I-Connect007!
The I-Connect007 offices are closed today, in observance of the Christmas holiday. As part of the Global Electronics Association, the offices remain closed through New Year’s Day. I-Connect007 will still publish daily and weekly newsletters (with the exception of Christmas and New Year’s Day). Some staff members will still be checking email. Just for fun, we thought we’d share a bit of Christmas tradition about the gingerbread house. You’ve likely built one at some point and perhaps wondered how this tradition originated.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We are days away from the end of 2025 and the beginning of 2026. This Jan. 1 will mark not only the end of a year, but also the end of a quarter-century. Doors are closing, while others are opening, and it wasn’t until I collated my must-reads this week that I noticed that a similar theme, though perhaps with more grace than in other current events around the globe. First up is the final episode of John Johnson’s series on UHDI. If you’re the type of person who reads the last chapter of a book first, definitely start with this episode, then listen to the rest of the series.
Real Time with... productronica 2025: Jiva's Product Progress Update
Jiva’s Jack Herring provides an update on products, scalability, and lifecycle assessments. He answers questions about material properties, compliance, and sustainability. Jack also highlights the importance of being a market option and discusses plans for scaling production in the UK and Asia to meet demands and reduce carbon footprints.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Before diving into this week’s must-reads, I want to spotlight the incredible batch of interviews our team captured at productronica. They go beyond the quick booth chitchat and dig into the most pressing topics in electronics manufacturing. We spoke with companies and leaders who are shaping what happens next, and the conversations touch on the challenges and innovations that matter most to the industry today.
Tom Kastner: Navigating the Complex World of M&A
With a background spanning Silicon Valley, Japan, and Chicago, Punching Out columnist Tom Kastner has helped countless PCB and EMS business owners achieve their goals. In this interview, Tom reflects on his path from anthropology student to M&A expert, his love of nature and restoration work, and the satisfaction of guiding entrepreneurs through one of the most complex—and rewarding—transitions in business.
I-Connect007 Announces the December Issue of Advanced Electronics Packaging Digest
Landing in inboxes Monday, Dec. 15, the next issue of Advanced Electronics Packaging Digest (AEPD) explores some of the most pressing questions shaping U.S. advanced electronics capability, from defense readiness to power constraints and the fast-moving world of printed electronics. This month, we spotlight the technologies, strategies, and industry perspectives driving next-generation manufacturing forward.
Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
Ventec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.
Summit Interconnect’s Leadership in the ‘Silicon Prairie’
Summit Interconnect is one of the two largest PCB fabricators in the United States. I visited with Deepak Makwana, general manager of Summit’s Chicago plant, Business Development Manager Tom Veitch, and Vice President of Technology Gerry Partida at their Schaumberg, Illinois (Summit Chicago) facility to learn more about the evolution of PCB manufacturing in the Midwest.
Understanding Agentic AI
For those of us who design, build, and use computers, AI is our most frequent topic of conversation. Next to that is agentic AI, a form of artificial intelligence designed to function autonomously. But how is it different from traditional and generative AI? Simply said, agentic AI can execute complex tasks autonomously with little or no human intervention.
Real Time with... productronica 2025: Energy Security and Nuclear Fusion Innovations
Pete Starkey meets with Alun Morgan to discuss significant upcoming EIPC events, including a conference at a nuclear fusion reactor site in France and a summer conference in Lithuania. He emphasizes the importance of energy security and advancements in nuclear fusion technology, particularly the role of AI in reactor design. Additionally, Alun highlights a new PCB plant in Lithuania, marking a major investment in the region.
Mehul Davé: A World Full of Opportunities and Possibilities
In this interview, entrepreneur, technologist, and global visionary I-Connect007 columnist Mehul Davé reflects on a lifetime of innovation. From founding companies and mentoring teams to shaping global supply chains, Mehul discusses leadership, culture, and optimism for a thriving PCB future—reminding us that “chips don’t float,” and opportunity is everywhere.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Yesterday was the U.S. Thanksgiving holiday. The traditional meal is, of course, roast turkey with “all the trimmings.” Although not everyone observes that menu, most do, and it was reported that 42 million turkeys were consumed on that day. With an average weight of 16 pounds per turkey, we cooked up 672 million pounds! With approximately 342 million people in the U.S, that pencils out to just under two pounds of drumstick and white meat per person. That, my friends, is a whole lot of leftovers.
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