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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week in the news. I could legitimately have published another five items because there were so many meaningful topics. So, I start with attorney James Kim, who returns to update us on metals tariffs. Brian Chislea and Cody Schoener from Dow recently published a book on UV curable conformal coatings. The Taiwan Printed Circuit Association has launched a PCB-specific AI knowledge base. SEMI FlexTech is seeking proposals for advancing flexible hybrid technologies, and the Global Electronics Association has launched the Global Electronics Policy Council, unifying its advocacy voices.

Webinar Review: Europe Moving to Strengthen Defence Industrial Base

Europe is seeking to establish a more sovereign, coordinated, and resilient defense industrial base in response to mounting political pressure, especially following Russia’s invasion of Ukraine, through the European Defence Industry Programme (EDIP). Renauld Hock of DG DEFIS outlined the efforts in a webinar last week hosted by the Global Electronics Association. Electronics manufacturers and PCB-related companies will have an opportunity to apply for funding through the program to support specific defense systems by supplying critical enabling components.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

When you work in the news business, even in trade media, you can never really get that far away from it. We never want to miss something important. Chances are, even the books we take on our “vacations” end up having to do with the business. For example, my colleague Michelle Te recommended “Creativity, Inc., by Ed Catmull, a business skills study wrapped up in stories about Pixar, which I brought with me on a trip through the stunning U.S. Mountain West. Now, I’m back, and here are my recommendations for the week.

Separating Fact from Fear on the FCC ‘China Lab Ban’

Recent news headlines have suggested that the U.S. Federal Communications Commission (FCC) has “banned all testing laboratories in China and Hong Kong.” Understandably, this has created concerns around PCB testing, material approvals, UL listings, and the continued use of established test laboratories in Asia. The good news is that for most PCB, PCB material, and PCBA testing, nothing has changed. Let’s separate fact from fear.

New Courses: Advance Your Electronics Expertise in June and July

Stay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.

I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest

The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.

A Necessary Shift From Gerber to IPC-2581

IPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.

Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect

Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.

PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary

Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

If it feels like the PCB industry is accelerating faster than ever, you’re not imagining it. From advanced materials driven by AI applications to renewed investment in domestic manufacturing—and the next generation stepping into critical roles—there’s a lot shifting at once. My selections for this week highlight where the pressure points are forming, and where the opportunities are emerging.

Jiva Soluboard Getting the Attention It Deserves

Jiva is a newer company that bridges the divide between PCB fabrication and product circularity or sustainability. Jiva Soluboard is the first fully recyclable laminate material ever created for PCB fabrication, and it's not going unnoticed. Stephen Driver, CEO of Jiva, gave us an update at APEX EXPO, including an exciting certification achievement in February.

How Are You Vetting Your Supply Chain?

For many years, supplier management was largely focused on standard commercial priorities: cost, quality, lead time, and delivery performance. If a supplier met specifications, shipped on time, and remained price competitive, the relationship was often considered healthy. However, the world has changed.

Roundtable: Advanced Materials

Driven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.

AI, HDI, and Interconnect Optimization with MKS' ESI

This discussion revolves around the transformative impact of AI on HDI and substrate manufacturing. Casey Krueger explains the company's "Optimize the Interconnect" initiative, which features Atotech, to provide a comprehensive solution from pretreatment to laser drilling. MKS' ESI offers the innovative Geode G2 platform which is an advanced laser drilling technology that enhances productivity, reduces energy consumption, and addresses complex design challenges in processing both PCB and ICP materials.

Insulectro: Advanced PCB Fabrication Materials

Explore advanced PCB fabrication materials with Insulectro's Dain Hertsgaard and Gabriel Zepeda. This interview covers Arlon's innovative polyimide and epoxy solutions, including low-flow options for flex materials and high-performance materials for HDI applications; Qnity's polyimide films for demanding environments, and DuPont Interra's capacitance films for enhanced reliability. Insulectro offers comprehensive service and a commitment to advancing circuit technology

PHOTO GALLERY: A Walk on the Lighter Side

APEX EXPO isn’t all business! To wrap up our last photo gallery, we’re sharing some of our favorites from the show—a walk on the lighter side. We’re highlighting those in-between moments: quick selfies, familiar faces reconnecting, robot dogs, booth-side laughs, and the kind of candid snapshots you only get when people are genuinely enjoying themselves. At the end of the day, it’s not just about what we do, it’s about the people we do it with.

UHDI Fundamentals: Standardization, Workforce, and the Road Ahead for Flex-Packaging Integration, Part 3

Parts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.

New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains

A new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.

Women in Technology: Learning to Just Be Myself

Approximately 100 women and a handful of men gathered for a Women in Electronics evening event at APEX EXPO. As I wandered among the tables before it started, I stopped to chat with several women all wearing purple and white polo shirts emblazoned with the TTM logo. It turns out they are part of TTM’s Women in Technology Group, so I sat down and invited them to share their thoughts on coming to the event and what it means to be part of the electronics industry.

Volatile Metals Market Creates PCB Pricing Headache

Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.

A 60-Year Legacy of PCB Innovation from IEC

Chris Hrusovsky, director of business development for International Electronic Components (IEC), shares his company’s commitment to customer partnerships, seamless service, and technical support for fabricators. Chris updates us on technological advancements in direct imaging, copper-filled vias, and the company's global collaborations driving innovation in consumables and equipment.

The Global Electronics Association Is Future Forward

John W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.

UHDI Fundamentals– Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2

In the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.

PHOTO GALLERY: Putting in the Work on Standards, Professional Development

Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.

AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging

The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.

Podcast Hits the Mark in a Materials Market

The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.

PHOTO GALLERY: A Show Floor Showcase, Part 2

Take a walk back through APEX EXPO with our photo gallery, capturing the faces, moments, and energy from across more than 400 booths on the show floor. This week, we’re highlighting our many customers, and some of the work in the I-Connect007 booth, where we conducted dozens of video and audio interviews. It’s a chance to see who was there, what was happening in real time, and maybe even spot yourself in the crowd.

My Top 7 Takeaways from APEX EXPO 2026

I’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.

Women in Electronics Keynote Review: A Life and Career Filled With Humor

In an industry that was dominated by male comedians, Jan McInnis quickly learned an important tip to help her succeed in the business: Don’t ask for permission to be yourself. “Don’t try to be something you’re not,” she said after headlining the Women in Electronics event at APEX EXPO 2026. “They’re paying for you and what you bring to the table, so put your blinders on, and just do your thing.”

Understanding Tolerances in Flexible Circuit Design

The challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.

Ensuring the Next Generation of U.S. Weapons Has Homegrown Electronics

The U.S. has in the works several new weapons to counter emerging enemy threats. These include new warships, fighter aircraft, bombers, submarines, drones and a network of air defenses to defend the entire U.S. against missile and air attacks. And yet the U.S. will be challenged to produce key electronics within these systems known as printed circuit boards (PCBs), which are primarily sourced domestically. While the U.S. government has played a key role in helping to revive the domestic semiconductor industry, with the exception of some funding through the Defense Product Act it has largely ignored domestic production of PCBs.

Webinar Review: The Challenges of UL Certification for Flex and Flex-Rigid PCBs

UL certification is one of an engineer’s least favorite topics, yet it is critically important. The process is complicated but relatively straightforward for standard rigid PCBs, but as Jan Pedersen makes clear in NCAB Group’s recent webinar, “UL Approval for Flex and Flex-Rigid PCBs,” it is a very different story.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week for many of us traversing the conference halls and exhibition floor at APEX EXPO in Anaheim, California. This is the 26th event since it was renamed APEX EXPO in 2000. For those who love trivia, and in reverence to the founders, a more accurate accounting is that 2026 marks its 33rd year, beginning in 1994 as the IPC Printed Circuits Expo. It’s always a great time to convene with old friends, colleagues, and customers, as well as to meet exciting new companies and individuals with interesting things to share. And afterwards, it’s always nice to get home.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Cue up “The Final Countdown, the monster ’80s hit song by Swedish band Europe, because it’s almost APEX EXPO week. Side note: When it comes to rock anthems, I’m more of an “Eye of the Tiger” man, myself. Some folks are already arriving in Anaheim, as standards development committee work starts as early as tomorrow. The show continues through Thursday, March 19.

I-Connect007 to Launch Weekly Show & Tell Newsletter Series Featuring APEX EXPO Highlights

Building on our tradition of delivering comprehensive coverage of APEX EXPO 2026, I-Connect007 will present a five-episode Show & Tell Newsletter series, arriving in subscribers’ inboxes each Friday, March 27 to April 24. The special series will highlight key moments from the Global Electronics Association’s annual trade show, offering readers an inside look at the people, companies, and ideas shaping the electronics manufacturing industry.

T-type Thermocouples in Foil Heater Technology

This article examines the use of T-type thermocouples implemented with flexible printed circuit and etched foil heater technology, focusing on their design, fabrication, and integration into advanced thermal management systems. I’ll give particular attention to how their low-profile construction, accuracy at low temperatures, and mechanical robustness make them well-suited for critical devices operating in demanding environments

UHDI, AI, and RF Materials: Signals From the Next Phase of Advanced Packaging

The upcoming issue of Advanced Electronics Packaging Digest explores several developments shaping the future of advanced electronics, from the convergence of IC substrates and ultra-high-density interconnect (UHDI) PCBs to the growing influence of artificial intelligence on semiconductor packaging and the materials science behind high-frequency system performance.

The Power of Apprenticeship: Connecting Talent, Training, and Opportunity

The lack of a skilled workforce looms large over the electronics manufacturing industry, but the Global Electronics Association is building a powerful solution through an apprenticeship program that has evolved into a nationally recognized, well-funded workforce engine. Cory Blaylock and Vicki Hawkins are cutting through red tape with the U.S. Department of Labor (DOL) to access millions of dollars in funding, and their collaboration with industry companies, creative problem solving, and commitment to success is helping address this great challenge and shape the next-gen electronics workforce.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’m highlighting a book, a podcast, a magazine, winners of the APEX EXPO Technical Conference, and a narrative-style column. Not only do these published pieces vary in style, but they also examine the electronics industry from a variety of perspectives. From test to materials, trade show storytelling, and thought leadership, I-Connect007 has the industry covered.

Professional Development Courses for Every Electronics Manufacturing Sector

Professional Development Courses at APEX EXPO are designed to give electronics professionals focused, instructor-led learning that connects directly to today’s manufacturing realities. The courses are offered Sunday, Monday, and Thursday, and allow attendees to build new skills while still taking part in the broader APEX EXPO experience.

Finding the Funny: Jan McInnis Headlines Women in Electronics Keynote

In an industry driven by precision, deadlines, and innovation, laughter may not be the first tool professionals think to reach for, yet it’s one that can transform workplace culture, elevate collaboration, and boost personal well-being. Jan McInnis, comedian and humor strategist, presents “Finding the Funny” for the Women in Electronics Keynote, from 6 to 7:30 p.m. March 18, at APEX EXPO.

East Asia at APEX EXPO 2026: Focusing on Cross-regional Exchange and Industry Connectivity

At APEX EXPO 2026, the Global Electronics Association East Asia team will promote engagement with global experts, industry partners, and member companies by participating in technical committee meetings and industry forums, and by organizing networking dinners and exhibitor visits. More than 40 companies from East Asia are expected to exhibit at this year’s show, representing Mainland China, Taiwan Region, Japan, and Korea.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!

Technology Pavilion Debuts at APEX EXPO 2026

Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.

NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results

The I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.

Growing an Engineer: Meet Emerging Engineer Julian Vega

Julian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.

Big Ideas Take the Stage: APEX EXPO 2026 Keynotes

Some of the most consequential conversations in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy. From IBM and Intel technologists to an AI futurist and a global industry leader, this year’s keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem.

I-Connect007 Launches Six-Part Podcast Series Highlighting the Critical Role of PCB Materials

I-Connect007, the leading media source for the electronics manufacturing industry, today announced the release of the first episode in a new six-part podcast series, “PCB Materials: The Backbone and Future of Electronics.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Frankly, there were so many worthy news items this week, it quite a bit of whittling to get it down to my five must-reads. For example, this week we showcased Schweitzer Engineering Labs’ new manufacturing facility in Moscow, Idaho. Marcy LaRont launched an On the Line With… podcast on materials, and the February issue of I-Connect007 Magazine features the annual APEX EXPO preview.

New IPC Standards Released

Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q1 2026.         

Changing the Electronics Systems Conversation

Rebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.

UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1

The electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes.

IPC Standards: The Heart of the Electronics Industry

From its very inception, standards development has been at the core of the Global Electronics Association’s work, and APEX EXPO continues to serve as a major venue for standards development and approval. For example, standards committees from around the globe are expected to conduct more than 100 task group meetings during the event. We visited with the Association’s standards development team to learn more about their process, its impact on the industry, and how you can get your voice heard.

EIPC Winter Conference Review: From Innovation to Qualification

Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.

PCB Design in 2026 and Beyond

We asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.

EIPC Winter Conference Review: A Focus on Miniaturization

The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.

February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

EIPC Winter Conference 2026 Review: The Keynote Sessions

Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
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