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Signal Integrity by Example

by: Fadi Deek, Mentor, A Siemens Business

Signal integrity issues remain a concern for many in the electronics industry. This micro eBook details the importance of eliminating signal integrity challenges. Written by signal integrity engineer Fadi Deek of Mentor, A Siemens Business, the chapters explore four possible signal integrity problems using an understanding of essential signal integrity principles.

Deek explores how to reach effective design solutions and make strong engineering tradeoffs through analysis techniques, best design principles, and software tools to achieve accurate simulations and measurements. This eBook has something to offer for any engineer interested in identifying problems, root causes, and solutions surrounding electronic transmissions.



ISBN: 978-0-9982885-2-9

Fadi Deek
In 2005, Fadi received his B.S. degree in computer and communications from the American University of Science and Technology (AUST) in Beirut, Lebanon. That same year, he joined Fidus Systems as a design engineer. He designed circuit boards at Fidus for three years. In 2010, he received his M.S. in electrical engineering from the University of Arkansas in Fayetteville. He then joined Mentor, A Siemens Business, as a corporate marketing engineer. In 2013, Deek became a corporate application engineer supporting the HyperLynx tool suite. In parallel, he is also pursuing his Ph.D. at the University of Colorado in Boulder under the supervision of Dr. Eric Bogatin.

Mentor, A Siemens Business, is a world leader in electronic hardware and software design solutions providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products and solutions help engineers conquer design challenges in the increasingly complex worlds of board and chip design. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Website: www.mentor.com.

Related Video:

Not a signal integrity expert? No problem! With HyperLynx you can run fast and accurate simulations from the design planning phase, throughout the design process, and in the post-layout stage, to ensure that your products can be manufactured and work as intended in the field.

This book has been technically reviewed by the following experts:

Eric Bogatin Dean, Signal Integrity Academy

Professor Bogatin has a BS in physics from MIT and an MS and PhD in physics from the University of Arizona. He has worked in various industry roles, including senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices.

Happy Holden

Consulting Technical Editor,
I-Connect007

Happy Holden is the retired director of electronics and innovations for GENTEX Corporation. Formerly, he was the chief technical officer for the world’s largest PCB fabricator—Hon Hai Precision Industries (Foxconn). Prior to Foxconn, Holden was the senior PCB technologist for Mentor Graphics and [...]

Chapter Summaries

  • Chapter 1

    Chapter 1: Impedance

    Chapter 1 outlines the basic concepts of characteristic, instantaneous, and driver output impedance. The chapter also covers driver features and package effects.

  • Chapter 2

    Chapter 2: Reflections and Terminations

    Chapter 2 addresses how to engineer proper terminations to minimize reflection noise. This includes a discussion of reflection and noise margins, termination strategies, and single-bit responses.

  • Chapter 3

    Chapter 3: Crosstalk

    Chapter 3 explores near-end and far-end crosstalk, and the effects of multiple aggressors on victim nets. This chapter also discusses root causes of crosstalk and solutions for resolving crosstalk issues.

  • Chapter 4

    Chapter 4: Differential Pairs

    Chapter 4 introduces differential pairs, differential and common signals, and methods to terminate them. Additionally, the chapter compares channel-to-channel crosstalk in tightly versus loosely coupled differential pairs.

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Eric Bogatin Professor Bogatin has a BS in physics from MIT and an MS and PhD in physics from the University of Arizona. He has worked in various industry roles, including senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices. Since January 2021, Bogatin has been a full-time professor at the University of Colorado–Boulder in the Department of Electrical, Computer and Energy Engineering. He teaches courses in circuits, systems, and signal integrity and is involved with research activities related to signal integrity, circuit design and analysis, and rapid prototyping of circuits. Bogatin is the author of 18 technical books about signal integrity and electronics and the technical editor of the Signal Integrity Journal, an industry-focused publication covering signal integrity, power integrity, and electromagnetic compliance topics. He is a Fellow with Teledyne LeCroy and conducts webinars and presentations on best measurement practices using real-time scopes, TDR, and VNA instruments. As part of his Fellow activities, he is the Dean of the Teledyne LeCroy Signal Integrity Academy.

Happy Holden Happy Holden is the retired director of electronics and innovations for GENTEX Corporation. Formerly, he was the chief technical officer for the world’s largest PCB fabricator—Hon Hai Precision Industries (Foxconn). Prior to Foxconn, Holden was the senior PCB technologist for Mentor Graphics and advanced technology manager at Nan Ya/Westwood Associates and Merix. He previously worked at Hewlett-Packard for over 28 years as director of PCB R&D and manufacturing engineering manager. He has been involved in advanced PCB technologies for over 47 years.