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Catching Up With Tom Yang of CEE PCB

05/30/2024 | Dan Beaulieu, D.B. Management Group
I was in the Bay Area recently and met with my new friend Tom Yang, CEO of CEE PCB, a $450 million Chinese PCB fabricator. For too long, we have enjoyed the luxury of complaining about Chinese companies without even knowing who they are and what they do. That’s just too easy. My mission was to talk to a real live shop owner in China. With this interview, you will have a better and more personal understanding of CEE and the rest of the Chinese PCB industry.

High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) Rating

05/29/2024 | Neil Hubble, Akrometrix
Moisture sensitivity requirements for non-hermetic surface mount devices are defined in the joint IPC/JEDEC standard J-STD-020E, “Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification for Non-hermetic Surface-Mount Devices,” last updated in December 2014. This standard allows customers and suppliers to place electronics devices into specific categories, defined into 8 different moisture sensitivity levels (MSL). Test method criteria are defined within this standard to define MSL levels for different packages. A subsection of MSLs are shown in Figure 1 below, showing the MSL 3 and 4 used in this study.

Murata Obtains ISO 26262 Certification for Functional Safety in Automotive Applications

05/21/2024 | Murata
Murata Manufacturing Co., Ltd., obtained the ISO 26262 development process certification for Functional Safety* Automotive ISO 26262 from the German third-party certifier SGS-TÜV Saar GmbH on February 13, 2024.

IPC Raymond E. Pritchard Hall of Fame Award: Pierre-Jean Albrieux

05/10/2024 | Marcy LaRont, PCB007 Magazine
Congratulations to Pierre-Jean Albrieux, who received the 2024 IPC Raymond E. Pritchard Hall of Fame Award. The award is given to individuals in recognition of the highest level of achievement, extraordinary contributions, and distinguished service to IPC and toward the advancement of the industry, including helping to create a spirit of mutual esteem, respect, and recognition among members consistent with the goals and mission of IPC.

Real Time with… IPC APEX EXPO 2024: Circuit Board Testing Strategies and the Impact of AI

05/08/2024 |
Editor Marcy LaRont speaks with Bert Horner, president of The Test Connection, about the importance of strategic planning and design-for-test (DFT). Bert touches on some common mistakes that occur when DFT is not adequately considered early on. The discussion outlines an overarching industry need for a culture shift toward increasingly higher levels of integration and collaboration. Bert mentions that AI now has an influence on testing, as everywhere else, and announces his forthcoming book.
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