Luca Gautero, SÜSS MicroTec
Exploring the many opportunities and challenges offered by inkjet as an advanced method of solder mask application.
Latest Column: Additive Reality: Drop It, and Enjoy the Greenback
Chris Young, Young Engineering Services
Lighthearted (sometimes humorous) and informative view on the aerospace and defense industry.
Team Cadence, Cadence
Enabling shorter, more predictable PCB design cycles with better integration of component design and system-level simulation.
Latest Column: All Systems Go: Auto-Detecting Over- and Under-Derated Parts
Travis Kelly, PCBAA
This column will cover the support and growth of U.S. domestic printed circuit board (PCB) manufacturers and suppliers as they contribute to national security.
Marc Carter, Aeromarc LLC
This is a series of columns or articles based on a course at Michigan Tech on PCB design, manufacturing, and assembly.
Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: The Eye Diagram
Kim O'Neil, Prototron Circuits
Kim discusses the daily challenges of running an American PCB fabricaton facility.
Latest Column: Circuit Chronicles: It’s All About the Team
Matt Stevenson, Sunstone Circuits
Matt Stevenson covers solutions to help your PCB projects succeed.
Latest Column: Connect the Dots: Demystifying Multi-Layer PCBs
John Talbot, Tramonto Circuits
John focuses on flex and rigid-flex PCB and PCBA technologies, as well as various global business, technical, and market aspects.
Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: ‘What Customers Hate’
Dana Korf, Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: An IPC APEX EXPO 2023 Data Transfer Mission
Dennis Fritz, Fritz Consulting
Dennis covers military and defense industry topics and applications.
Patrick Crawford, IPC
Patrick Crawford provides updates on IPC Design activities.
Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Team Siemens, Siemens Digital Industries Software
Siemens explores the digital thread from concept to manufacturing.
John Watson, Altium
John Watson covers a variety of tips that designers need to know.
Latest Column: Elementary, Mr. Watson: Advanced Packaging Not a Passing Fad
Dominique Numakura, DKN Research
Dominique Numakura offers weekly updates on the PCB industry in Japan, from M&A activity to technological breakthroughs.
Latest Column: EPTE Newsletter: Travel to Japan During COVID
Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: A Patently Innovative Resolution
IPC Education Foundation, IPC
IPC Education Foundation updates on programs and activities.
Team NCAB, NCAB Group
A variety of field application engineers from NCAB Group's technical team explore fresh PCB concepts.
Latest Column: Fresh PCB Concepts: Designing Controlled Impedance PCBs
Happy Holden, I-Connect007
Happy will endeavor to catch our readers up on the latest technologies developed around the world since Karl Dietz retired this column in 2016.
Latest Column: Happy’s Tech Talk #16: Protocols for a Smart Factory Future
Christine Davis, EMS Specialist
Christine shares lessons learned from 20 years running her own company.
Latest Column: Her Voice: The Intractable Ceiling
Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Bob Wettermann, BEST, Inc.
Bob Wettermann looks at the challenges in rework and repair, and provides strategies in addressing them.
Marc Ladle, Viking Test Ltd.
Marc’s columns deal with various aspects of PCB production, focusing especially on troubleshooting production problems.
Latest Column: Ladle on Manufacturing: LED UV Cure—Does It Really Work?
Zac Elliott, Siemens Digital Industries Software
Zac Elliott offers PCBA manufacturers advice on Lean manufacturing with a focus on ROI and customers' stories.
Latest Column: Lean Digital Thread: The Manufacturing Metaverse Revisited
John Coonrod, Rogers Corporation
John Coonrod offers PCB designers advice on modern laminates, with a focus on high-speed substrates.
Ronald C. Lasky, Indium Corporation
Continuous improvement and education in SMT assembly.
Latest Column: Maggie Benson’s Journey: Fair and Square
Clive "Max" Maxfield, Clive Maxfield High-Tech Consulting
Max focuses on EDA tools, PCB design techniques, and innovative technologies of the past, present, and future.
Latest Column: Maxed Out: Component Search Engine is a Total Game Changer
Doug Sober, Essex Technologies Group
Doug writes about the problems of & concerns with PCB laminate materials and their specifications.
Nolan Johnson, I-Connect007
Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing.
Latest Column: Nolan’s Notes: The Trade Show Is Over—Now What Do You Do?
John Mitchell, IPC
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: Advance in a New Era
Alfred Macha, AMT Partners
Alfred will provide insight into topics, including process validation, operational excellence, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more.
Tara Dunn, Averatek
When it comes to additive circuits, Tara really knows what she is talking about!
Latest Column: PCB Talk: Is DWM Just Another Buzzword?
Duane Benson, Screaming Circuits
Duane offers tips and tricks for PCB assembly issues.
Latest Column: Powerful Prototypes: Small Computer Modules
Tom Kastner, GP Ventures, Ltd.
'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.
Latest Column: Punching Out: Here’s the Deal About 2022
Istvan Novak, Samtec
Focusing on signal and power integrity issues related to PCB design and design engineering.
Latest Column: Quiet Power: Noise Mitigation in Power Planes
Team Electrolube, Electrolube
Team Electrolube illustrates the best PCB design practices for optimizing the conformal coating process.
Latest Column: Sensible Design: Automotive Conformal Coating Applications
Michael Ford, Aegis Software
Michael writes about the Industrial Internet of Manufacturing (IIoT), Industry 4.0 and smart factories, and how these technologies are accelerating the electronics manufacturing industry.
Latest Column: Smart Factory Insights: An Unblinkered View
Dr. Jennie Hwang, H-Technologies Group
As an internationally recognized SMT authority, Dr. Hwang offers her perspective on a range of technical and process issues.
Ray Prasad, Ray Prasad Consulting
Ray writes about reducing costs - improving yields - and increasing reliability.
Latest Column: SMT Solver: Flux and Cleaning—How Clean Is Clean? Part 2
Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: Progress Through Partnership
Kelly Dack, EPTAC Corporation
Kelly’s column pursues the need for stakeholder advocacy in the printed circuit industry head-on, deliberating topics essential for helping one another achieve 100% acceptability in PCB engineering, design, procurement, sales, manufacturing, test and inspection.
Latest Column: Target Condition: Scaling PCB Design to the Power of 10
Todd Kolmodin, Gardien Services, USA
Todd covers a range of electrical test and reliability issues.
Latest Column: Testing Todd: Coming Back to Life—Design Recovery
Mark Thompson, Out of the Box Manufacturing
Mark Thompson discusses PCB design from a fabricator's viewpoint, with a focus on DFM issues.
Latest Column: The Bare (Board) Truth: My Top Six Design Challenges
Mehul Davé, Entelechy Global and Linkage Technologies
Mehul's column explores benefits for outsourcing CAM engineering.
Latest Column: The Big Picture: The Virtual Via Drum
Christopher Bonsell, Chemcut
Discussions about topics concerning wet processes, wet processing equipment, and how changes in these areas can improve the PCB industry.
Latest Column: The Chemical Connection: Basics of Cupric Chloride Etchant
Mike Buetow, Printed Circuit Engineering Association
This column is dedicated to providing news about PCB design classes and events, as well as helping engineers, designers, and anyone related to printed circuit design from around the globe to network and share information.
Chris Mitchell, IPC
In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: Building Industry Resilience in 2023
Chris Ellis, Manncorp Inc.
Chris will address common problems that Manncorp customers have had with the in-house conversion process and share solutions that have worked in the past.
Latest Column: The Mannifest:Tips for Today's SMT Challenges
Hannah Nelson & Paige Fiet, IPC Student Directors
Two up and coming engineers discuss the bridge between electronics education and the electronics industry.
Latest Column: The New Chapter: A Tale of Two Towers
Team Elmatica, Elmatica
The PCB Norsemen from Elmatica share their knowledge, experience, technical advice, and thoughts about the fascinating world of PCBs.
George Milad, Uyemura International Corporation
George's columns cover PCB plating, IPC specifications, and more
Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Fitting Physics to Fact
Steve Williams, The Right Approach Consulting
A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.
Andy Shaughnessy, I-Connect007
Andy Shaughnessy discusses topics that are important to the community of PCB designers and design engineers.
Latest Column: The Shaughnessy Report: PCB Design and Advanced Packaging
Tim Haag, First Page Sage
Tim Haag discusses PCB design topics from his viewpoint as an EDA technologist and longtime board designer.
Imran Valiani, RUSH PCB Inc.
Imran Valiani addresses ways to get products to market as quickly as possible.
Latest Column: Time to Market: Ten Ways to Bring Your Product to Market
Michael Carano, Averatek
A comprehensive look at plating, metallization processes and PWB fabrication techniques.
Bill Cardoso, Creative Electron
Dr. Cardoso will cover everything related to X-rays from cool historical facts to the latest in technological advancements.
Latest Column: X-Rayted Files: ’23 and Me?
Zulki Khan, NexLogic Technologies, Inc.
Zulki Khan talks about new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.
Latest Column: Zulki's PCB Nuggets: Cleanliness is Next to Reliability