Whizz Systems on Competing in Silicon Valley

Whizz Systems is an EMS provider located in Silicon Valley that has managed to survive and thrive through many of the industry ups and downs of the past two decades. President Muhammad Irfan talks about trends he’s seeing from the industry in the Valley and how choosing the right type of customer has led Whizz to see sustained success in one of the most difficult and expensive areas for an assembly shop to survive.

The Role of Parylene Conformal Coatings in Next-gen Electronics

Designers and manufacturers of electronics are under pressure to make packages smaller, lighter, and more environmentally friendly, while ensuring that their new technologies perform reliably in their operating environments. This article takes a closer look at Parylene conformal coatings and the role they can play in helping manufacturers address current and future challenges in the electronics industry.

Seven Key Steps to Selecting a New EMS Partner

Choosing to outsource your electronics manufacturing to an EMS provider requires careful planning and consideration. And even once you’ve made your decision, there may still be things that test you or that don’t go quite to plan. An experienced EMS partner has been there before; they understand the challenges, and they’ll be able to support you through the process to ensure you achieve your goals.

Names to Know: Up and Comers in U.S. Congress

When major news occurs in the U.S. Congress, you usually hear the names of top congressional leaders such as House Speaker Nancy Pelosi (D-CA) or Senate Majority Leader Mitch McConnell (R-KY).

Conformal Coating Selection: Conventional vs. Two-part

As assemblies become more densely populated, and housing/casing designs become more permeable to save weight, the use of conformal coatings is essential to protect the assembly from its operating environment and ensure acceptable reliability for the application intended, especially when operating in hostile environments.

IEEE's Future Directions Programs Target Reliability

Dan Feinberg speaks with Kathy Grise, IEEE Future Directions senior program director, at the AWE conference recently in San Jose, California. In this excerpt, Dan and Kathy discuss the importance of reliability, blockchain, recruiting younger generations, etc.

Recent Advances in X-ray Technology: SMTA Webinar Recap

Technical Editor Pete Starkey recently attended a webinar on advances in X-ray technology and its applications in the electronics industry, as presented by Keith Bryant, Chair of SMTA Europe, on behalf of SMTA India. Here are the highlights of the webinar.

Which Matters Most: Unit Cost or Total Cost of Supply?

The primary objective for any OEM is to design, manufacture, and deliver high-quality products in the most cost-effective way possible. When demand patterns change, or there is an increase in competition, it can be easy to rely on the calculation of unit cost to relieve the price pressure. But, as many manufacturers are discovering, choosing to base their outsourcing decisions purely on unit cost may not always reap the expected benefits in the long term.

The Exciting Details Behind IPC’s Pledge to America’s Workers

In the nine months since IPC joined in President Trump’s “Pledge to America’s Workers” and committed to creating 1 million new skilled workforce opportunities over the next five years – a fair question has been asked: Are we taking credit for actions we would have done anyway? Was this motivated by politics?

IPC’s Hand Soldering Competition Program: A Brief History

The history of the IPC Hand Soldering Competition (HSC) grew from the 2010 Scandinavian Electronics Event which saw the first Swedish Championship in hand soldering organized by Lars Wallin IPC Europe, Lars-Gunnar Klag and Krister Park.

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Conformal Coatings

While conformal coatings may have been something of an afterthought at the front of the design process, that can no longer be the case. Conformal coatings are now a critical part of any board assembly that might be subjected to challenging conditions. But coatings can also contribute to increased mean time between failure in any conditions, even environmentally controlled environments.

Words of Advice: Making Life Easier for Fabrication and Assembly

In a recent survey, we asked the following question: What steps do you take to make the job easier for your fabrication and assembly providers? Here are a few of the answers, edited slightly for clarity.

How Do I Get Smart With IPC CFX? (Part 2)

The introduction of the CFX standard is the critical trigger that enables smart, flexible factory operation in line with business needs. The technology is simple to adopt, which creates a true “plug-and-play” environment on which advanced production AI software technologies can be developed.

Outsourcing Electronics Manufacturing: Key to Growth?

Deciding to outsource part or all of your electronics manufacturing operations could provide the means to increase production capacity and improve your sales lead times. But before you choose to hand over responsibility to an EMS provider, it’s important to take stock not just of the tangible benefits but also of the potential risks.

How Do I Get Smart With IPC CFX? (Part 1)

Today's assembly factories are seeing the biggest challenge to face the industry in a generation, called by many the next industrial revolution. However, in essence, the challenge is a simple extrapolation of trends that have been occurring and increasing in assembly manufacturing for decades. In Part 1 of this two-part article, Michael Ford writes about the history behind the drive for automation in the SMT assembly industry and where CFX fits in.

I-Connect007 Survey on 5G

In the recent I-Connect007 Survey on 5G, we asked the readers whether or not 5G will improve the reliability of communications. The result? While majority said 5G will improve communications, more than half of that number said it will not.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Surface Treatment Enabling Low-Temperature Soldering to Aluminum

An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.

ICT or Flying Probe: Which Test Is Best for Your Assembly?

In-circuit test (ICT) and flying probe are two of the most popular types of automated test equipment (ATE) used in electronic printed circuit board assembly (PCBA).

Failures and Reliability in Soldering

The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.

Size Matters: The Effects of Solder Powder Size on Solder Paste Performance

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. And the question commonly asked is, "When should we switch from Type 3 to a smaller solder powder?" Read more to find out.

Low-Temperature SMT Solder Evaluation

Until recently, the use of Sn/Bi-based SMT solder materials has been investigated with negative consequences for high strain rate (drop-shock) applications; thus, these alloys have been avoided. Recent advances in alloy 'doping' have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.

Cavity Board SMT Assembly Challenges (Part 2)

This article describes the details of a study of assembling SiP BGA packages into a cavity. It points out the challenges involved in the board cavity design and assembly of components in a cavity. The authors discussed the board design challenge of having a cavity and defining the proper depth of the cavity to accommodate the board fabricator, the product design, and the SMT assembly.

Clean vs. No-clean Solder Process

Although IPC suggests clear guidelines, agreeing on the cleanliness (or otherwise) of a PCB assembly can often be a subjective and even contentious subject within the electronics manufacturing industry. If you’ve chosen to outsource your assemblies, how do you decide what to specify to your EMS partner? Find out here.

Smart Manufacturing Roadmap: Data Flow Considerations for the Electronics Manufacturing Industry

The 2019 iNEMI Roadmap features a new chapter on smart manufacturing. The chapter identifies key technology gaps and needs and offers recommendations to guide the electronics manufacturing industry in realizing the benefits of smart manufacturing. This article is based on information excerpted from the chapter.

Reliability vs. Failure

Summer is officially underway here in the Northern Hemisphere, and just like the temperatures, we’re turning up the heat in this issue and getting technical. Enter “Reliability Man,” the hero who must persevere against all the challenges thrown in his path.

Digitalization: Key to the Future of Electronics Manufacturing?

Electronics manufacturers have long relied on automation to streamline their production processes. The concept of the smart factory takes this one step further with artificial intelligence (AI), robotics, analytics, big data, and the Internet of Things (IoT) promising an even greater level of autonomy, agility, and connectivity.

Saying Yes to Opportunities: IPC’s Emerging Engineer Program Offers Career Growth for Electronics Industry Newcomers

What makes the IPC Emerging Engineer Program a premier networking and career enriching program? IPC staff spoke to Emerging Engineer Kate Stees, materials and process engineer, Lockheed Martin, about her experience in the program and why she recommends it to other engineers.

IPC SummerCom Highlights: A Government Relations Perspective

Last week, IPC hosted SummerCom, our semi-annual standards development committee meetings, in Raleigh, North Carolina. The event brought together thousands of technical experts from around the world to shape the product, manufacturing, and supply-chain standards that guide our industry.

Cavity Board SMT Assembly Challenges (Part 1)

The concept behind Component-in-Cavity (CiC) is straightforward. If the tallest component(s) on the motherboard can be placed into a recession created in the motherboard, their thickness relative to the components on the surface of the PCB will thus effectively be reduced. While this concept may be straightforward, its implementation is not. That implementation is the focus of this paper. Read on.

3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0

Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.

Goepel electronic Solutions, Webinar Series, and Trends

Barry Matties catches up with Matthias Müller to chat about the wide range of test and inspection solutions currently being offered by Goepel electronic as well as the informative webinar series produced by the company to help further educate their customer base and promote technical discussion on a number of topics.

Here's What You Need When Outsourcing Box Build Assembly

Box build, or top-level assembly, can be less well-defined. A box build can mean many things—from a PCBA in a small enclosure to a large cabinet full of wires or a complex fully integrated electromechanical system with electronics and pneumatics. Here's what you will need to consider to get an accurate quote and help the build process go smoothly with your EMS partner.

Data: Key to Automating Right the First Time

Michael Ford, senior director of emerging industry strategy, reflects on his first two years with Aegis Software Corporation and looks to the future of the data-driven manufacturing environment. Michael shares how the CFX and data collection model can play an important role in the streamlining processes, including Industry 4.0 and the supply chain.

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

What Electronics Companies Need to Know About Environmental Product Requirements

The task of monitoring and complying with environmental, health and safety (EHS) rules that affect electronics companies and their products requires a watchful eye on all levels of government: local, state, national, and international.

Reflow Your Solder and Your Data for Industry 4.0

I-Connect007 Managing Editor Nolan Johnson recently spoke with KIC President and Founder Phil Kazmierowicz and Manager of Applications and Sales MB “Marybeth” Allen as they each transitioned into new roles in the KIC leadership team. The conversation ultimately turned to the current dynamics in the industry, particularly Industry 4.0 and streamlining processes.

Laserssel Brings High-speed Soldering to New Application Areas

In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.

4 Key Considerations When Auditing a New EMS Partner

Choosing whether (or not) to outsource your electronics manufacturing is likely to bring with it a multitude of questions—and some understandable doubts. Outsourcing is a critical decision—and it’s one that will rely on thorough research, close examination and the asking of some tough questions. This article summarizes four key areas that you'll want to scrutinize as you embark on your supplier selection process.

Minimizing Voids in Solder Joints

Dr. Hans Bell of Rehm Thermal Systems, Henryk Maschotta of Thales Deutschland GmbH, and Dr. Heinz Wohlrabe of TU Dresden presented the results of their project on reducing void content in the solder joints of land grid arrays (LGAs) at a soldering seminar during the Technology Days of the recent SMTconnect show in Nuremberg.

Synergy Between Smart Manufacturing and the Secure Supply Chain (Part 2)

With the trend of shortening lead-times within the material ordering process, and the frequency with which urgent orders for materials from the grey market are made, there is increased opportunity for the ingress of counterfeit materials. The situation is made far worse when a genuine shortage of materials in the supply chain occurs. The consequences of not being able to eliminate the risk of defects getting through into the market will be disastrous for individuals as well as for the company brand image, not to mention the associated costs of recovery. It is only a matter of time, unless something very significant changes.

Smart Factory Transitions Are Attainable—With a Plan

In a white paper, Zac Elliott, technical marketing engineer at Mentor, a Siemens company, outlines a structured organization for smart factory implementation. While there can be one set of challenges to overcome when building a smart factory on a greenfield site, firms restricted to pre-existing facilities face a different set of hurdles. In this interview, Elliott discusses how things have proceeded since the paper was published, and talks about strategies for smaller firms and brownfield companies.

Streamlining, but Streamlining What?

Electronics continue to grow in application areas, capabilities, and complexities. With such growth in the raw number of circuit boards being produced globally, the pressure is on to build more faster with higher quality and greater reliability. But this isn't new. What is new is the thinking and problem-solving that will need to happen at the manufacturing floor level to deliver on this coming need.

The GraftWorx Fluid Management Patch Story

The GraftWorx vision is to connect patients to clinicians with clinical data that will have a meaningful impact on their care. Its first application is to monitor patients with end-stage renal disease or kidney failure using a wearable device called the SmartPatch that records numerous clinical cardiovascular metrics. This article details how GraftWorx was designed, fabricated, and assembled.

Synergy Between Smart Manufacturing and the Secure Supply Chain (Part 1)

As MRP and ERP functions follow computing trends and start to migrate into the cloud, a fundamental question is being raised as to whether these are still the right tools to use in today’s modern Industry 4.0 driven factory, or whether these need to evolve, be enhanced, or even replaced in order to meet the more extreme requirements of operational flexibility, as well as cope with volatile material availability in the market.

Collaboratively Creating Wearable Medical Products

Patty Goldman, Barry Matties, and Happy Holden recently spoke with David Moody and Rich Clemente of Lenthor Engineering along with Anthony Flattery and Amit Rushi—their customers at GraftWorx. They discussed a recent project and how they worked together to solve a difficult problem by designing a rigidized flex circuit for their product.

4 Ways Electronics Manufacturers are Growing Their Businesses in 2019

At a time when many manufacturers are struggling to remain profitable, and with the uncertainty of the Brexit negotiations still looming large, finding new ways to nurture and grow your electronics manufacturing business has never been more crucial. Yet, despite the current challenges, some EMS providers are bucking the trend with reports of sustained growth. Here is their secret.

Whizz Systems on Knowing Your Strengths and Building Customer Relationships

Located in the heart of the Silicon Valley, Whizz Systems Inc. provides electronics product design, development and manufacturing services. Muhammed Irfan, president of the company, speaks with Nolan Johnson about knowing your strengths, engaging start-ups, and building strong customer relationships through education and preparation.

Co-owner Philip Kazmierowicz on New Role as KIC President

KIC is one of the leaders in reflow and thermal process control and smart oven technologies. On March 25, 2019, KIC announced that Philip Kazmierowicz, company co-owner, would take on the position of president. Nolan Johnson took that opportunity to sit down with Kazmierowicz in his Oregon-based R&D lab to discuss KIC's history and his plans for the future of the company.

Green Circuits' Three Tips to Be a Well-prepared Customer

Nolan Johnson speaks with Joe Garcia, VP of sales and marketing at Green Circuits, about how they can help on both the front and back end of the process, their hidden gem—design services—as well as three tips to be a well-prepared customer.

Communication and Information: Two Keys to Success

Nolan Johnson and Duane Benson, an I-Connect007 columnist and a representative from Milwaukee Electronics, discuss how assemblers can help their customers through submitting and maintaining accurate information, and engaging in open communication early and often about the highly important bill of materials.

From DataED’s NPI Center to the Manufacturing Floor

The I-Connecct007 team recently spoke with a team of technologists and managers at Data Electronic Devices (DataED). Jeff Hamlett, director of sales and marketing; Lori Giglio, general manager at the NPI Engineering Center; Vic Giglio, president and CEO; and Ron Sprizza, VP of quality for DataED, provided an overview of the importance of company culture and making your customers the first priority.

Five Key Components of an NPI Report

An NPI report is an opportunity for your contract manufacturer to highlight any outstanding issues that will need to be addressed for future builds. The information that your EMS partner provides can play a pivotal role in ensuring that they continue to deliver your products on time, within budget, and to the highest quality standards.

Incoming CEO Steve Pudles on the Acquisition of Zentech

Nolan Johnson talks to Steve Pudles about the recent acquisition of Zentech Manufacturing Inc. by BlackBern Partners LLC and Zentech management. Steve, also an investor in Zentech, steps in as the incoming CEO of the new organization and discusses the deal, his new role, changes to management, and the company's plans post-sale.

The One Thing

The vast majority of the problems that we run into fall to the categories of communication and information. As with the old 'telephone game,' each time information goes from one party to another, the risk of misinterpretation increases. If we are given unclear information from a customer, we may not be able to give the right information to our partner.

Five Key Questions Your EMS Partner Should Be Asking in the Supplier Selection Process

As we've continued to observe the impact of the ongoing global electronics components shortage, any challenge to the supply chain has the potential to cause major disruption. Whether you currently manage your own end-to-end electronics manufacturing, or you have opted to outsource to an EMS provider, there are five essential issues (and potential risks) to bear in mind when assessing the value and reliability of any proposed new supplier.

Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 2)

In the first part of this two-part article, Greg Smith talks about a study wherein a test vehicle was created to show transfer efficiency over a wide array of area ratios. Part 2 discusses the results of the experiment, including discussions of the different SEM results featuring the paste transfer efficiencies of each material, to better understand how the aperture wall surface smoothness compares to SMT stencil performance.

Catching up With Darrel Yarbrough of YES

Yarbrough Electronic Sales (YES) is one of the fastest growing contract manufacturers in the Southwest. As people get to know them better, they are becoming the go-to company in their area. In this interview, long-time industry veteran Darrel Yarbrough, owner of YES, provides a background about the company, its capabilities, and his outlook for the industry.

The Perfect Job

After all the days and weeks invested into developing the schematic, the PCB design, poring over the data sheets and online libraries for component parts, and running the calculations for mechanical clearances inside the enclosure, you—designers—are ready to be done. You're ready for the next design challenge—not for a week or so perfecting the bill of materials and the design notes. And there's the rub. Find out why.

Zentech's Mission-critical Tips for Program Success

Nolan Johnson and John Vaughan, I-Connect007 columnist and VP of sales and marketing at Zentech Manufacturing, discuss how to make customer programs successful through early communication, complete design packages, and more from a company servicing mission- and life-critical industries, including military, aerospace, and medical.

IPC Asia President Phil Carmichael on China Trends

At the productronica China 2019 show in Shanghai, Barry Matties joined Phil Carmichael, president of IPC Asia, to discuss the continued growth of IPC in Asia, including the increasing emphasis on training. IPC China has grown from hosting two technical conferences five years ago to 32 in the past year. Phil also addresses current trends he’s seeing as well as trade tensions between China and the U.S.

Ralf Wagenfuehr on Developing Rehm Thermal Systems' RDS Semico Oven

Ralf Wagenfuehr, plant manager of Rehm Thermal Systems, describes Rehm's new oven—the RDS Semico—and gives an in-depth analysis about how it was designed specifically with the semiconductor industry in mind. Ralf also discusses the semiconductor industry as a whole and outlines the company’s desire to gain market share in Taiwan and Korea in the upcoming year.

How Electronics Manufacturers Can Reduce Their Environmental Impact

With OEMs demanding ever greater value for money from their suppliers, EMS providers can find themselves facing increasing pressure on every front. To remain competitive, there's a growing recognition of the need to continually improve, adapt, and evolve the manufacturing process.

Cadence Design Systems Takes Tensilica to CES Show Floor

While roaming the aisles of CES, I happened across a suite hosted by Cadence Design Systems. It wasn’t a booth—just a quiet presence behind walls with demonstration hardware inside. Vic Markarian, senior group director for worldwide IP licensing and sales, explains why Cadence was at CES.

Rising Stars at Rising Stars

One key takeaway at the IEEE Rising Stars Conference was the pace of the event: fast, high-energy, and whirling—just as you’d expect from young people somewhere in the transition from teenager to adult. If their individual excitement about attending was like a photon of light energy, then over the course of the weekend, those photons aligned and collimated just as they would inside a laser chamber, resulting in a unified power and energy in the conference as everyone fell into phase with each other.

Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 1)

As innovation and demand continue to drive miniaturization in electronics, manufacturers face the constant challenge of assembling smaller and smaller components with repeatable processes and high yields. Stencil printing is the first step in the PWB assembly process, and improvements to the SMT stencil can significantly improve yields, especially for more challenging miniaturized products.

Lionrock Delivers Bendable, Industrial-grade Battery Tech

David Yeung, co-founder and CEO of Lionrock Batteries, discusses previous projects—including smartwatch straps—and his collaboration with the Nano and Advanced Materials Institute (NAMI) in Hong Kong on wearable, flexible battery technology at CES 2019.

From Participant to Volunteer to Leader: Matt Smith on the IEEE Rising Stars Conference

Matt Smith is one of the volunteer organizers for the IEEE Rising Stars Conference. As if that’s not enough, Matt also is an example of the impact this program can have on a young professional. In this interview, Matt provides an overview of the programs and what the conference strives to create for the attendees.

Eileen Hibbler and Jason Emes on Improving the West Penn SMTA Chapter

At the recent West Penn SMTA Expo, Eileen Hibbler, a chapter support specialist at SMTA, and Jason Emes, the current president of the West Penn SMTA Chapter, discuss ways to improve meeting attendance and develop a new slate of chapter officers.

Innovative Battery and Pressure Sensor Technologies

Tracy Liu is the director of R&D of the Nano and Advanced Materials Institute (NAMI) in Hong Kong. In an interview with I-Connect007, Liu talked about NAMI and discussed a number of battery and pressure sensor technologies being developed by the institute for licensing.

Tips & Tricks: Water Contamination and Flux Expiry

Solder joints that form properly are not expected to exhibit reduced reliability. However, a higher number of defects created tends to lead to a higher chance that defective connections escape detection through inspection and functional testing, and that’s not a risk to be taken lightly.

DSG: Breaking Ground on the Smart Factory Revolution

Mauro Dallora leads the I-Connect007 team through the Dongguan Somacis Graphic (DSG) PCB Co. Ltd. facility in China, lays out the company’s strategy for becoming an Industry 4.0 smart factory, and explains the current ongoing major expansion. Read about various topics in this factory tour and interview.

A Working Definition of Automation

Automation in a working context means more than just automatic machinery. Machinery implies mechanization. Automation also means the system information directs and controls people, materials, and machines. This concept is also known as systemization. Therefore, automation is made up of two components: mechanization (material flow) and systemization (information flow). Find out more.

A Young Engineer’s Perspective

Jeffrey Diament, a recent Princeton University graduate and an engineering associate from sensor manufacturer Instrumems, talks about the company’s nanowire sensing platform that can measure velocity, temperature, and humidity. Being his first career job out of college, Diament discusses his experience on the hardware and manufacturing side of things and offers advice to other young professionals.

RTW IPC APEX EXPO: IPC Global Government Relations Initiatives and Updates

IPC VP of Global Government Relations Chris Mitchell discusses with Judy Warner the association’s initiatives such as the IPC Workforce Champions, the skills gap analysis, and how IPC plans to advocate for the industry and grow the supply chain in North America and around the world.

Tips & Tricks: Humidity Level for Electronics Assembly

Low relative humidity (RH) can allow for higher static charges to build on objects. It can also affect solder pastes, especially OR-class pastes, and this can reduce print performance and stencil life. Read on to find out what level of RH you need for your assembly facility.

Building a Smart Factory Supply Line

I-Connect007 recently toured Victory Giant Technology (VGT) Co. Ltd. in Huizhou, China—one of China’s largest PCB producers. Currently, VGT generates about US$500 million in annual sales, and have plans to reach $1.5 billion in the coming years. Read more to find out VGT's expansion plans and strategies for growth.

IPC Working to Revive Lead-Free R&D in High-Reliability Sectors

Ask yourself the following question: Why is it that the aerospace, defense and high performance (ADHP) electronics sectors remain reliant on lead solders and components even as the commercial sector has largely phased out their use?

IEEE Rising Stars Conference Founder: Empowering Young Professionals

Held each year in Las Vegas on the weekend preceding CES, the IEEE Rising Stars Conference is rapidly establishing itself as a model program for developing leadership, networking, and aptitude in navigating an organizational structure in technical students and young professionals. Michael Andrews, an IEEE Senior Life member, serial entrepreneur, and founder of the IEEE Rising Stars Conference, tells us more.

Which IPC-A-610 Class is Best for Your PCBA?

For many EMS providers, IPC-A-610 is the agreed standard to define what's acceptable and what's not in the world of PCBA production. As an OEM, it's important that you're clear on the basic principles that separate those classes so that you have a clear and realistic expectation of what the results are going to be.

WPC's Standardized Cordless Power Solutions

Phoebe Francis, a Wireless Power Consortium (WPC) representative who works as a senior manager in the Dallas offices for Golin, a PR firm, provides a rundown on WPC and what it means for printed circuit manufacturing.

Bill Cardoso Discusses Creative Electron’s Inspection Strategy

At PCB West in Santa Clara, California, Dr. Bill Cardoso of Creative Electron held a class on advanced packaging and X-ray inspection strategy. Guest Editor Tim Haag and Publisher Barry Matties met with Bill to further discuss his class and the importance of turning inspection data into information.

Tips & Tricks: Wave Solder Bridging

Wave solder bridging is the most difficult defect to troubleshoot because it has a number of potential causes. The key is to understand the role of flux during wave contact—thus reducing the surface tension of the solder to reduce the tendency to bridge between pins as the board leaves the wave.

Filling the Skills Gap: Strategic Hiring and Succession Planning

While attending the IEEE Rising Stars Conference in Las Vegas, Nevada, I had a long and insightful conversation with veteran technical recruiter Terry McNabb. We covered so much information that the interview has been broken into two sections. This section features our discussion on the shortage of mid-career expertise in the workforce and best practices for hiring experienced technical staff.

Industrial Cybersecurity Needs to Be in Front of Regulators

Chris Humphreys, principal at Anfield Group, a cybersecurity firm consulting with numerous industrial and infrastructure clients, discusses cybersecurity, the dynamics of regulation, and the responsibilities that manufacturers have to the greater good above and beyond simply adhering to regulation.

Octane Open Concept Solution: Innovative Analytics and Floor-control Software

Octane Open Concept targets the contract manufacturer and is well along in the development process for a pair of software tools designed to optimize assembly and testing results tracking on the manufacturing floor. In an interview, CEO Craig Reiselt discusses the company and the products and opportunities in front of Octane.

Top 10 Most-Read SMT007 Articles for March

Starting this month, we will take a look back at the most popular SMT007 news, articles, interviews, and columns over the past 30 days. For the month of March, these are the top 10 most-read SMT007 articles. Check them out.

No Rest for the Weary: Supply Chain Pressures Are Here to Stay!

As we leave 2018 behind, it should be noted that the challenges faced by all consumers of electronic components in our industry this year have stretched teams both physically and mentally. We will continue to see pressures across the supply chain through 2019 and beyond, so there is no rest for the weary.

Impact of 5G

In our recent I-Connect007 survey on 5G, we asked the following question: "How do you think 5G will impact the electronics manufacturing industry?" Below are some of the replies, edited slightly for clarity.

Jennie Hwang: Get Ready for Disruptive Technologies

At IPC APEX EXPO 2019, Dr. Jennie S. Hwang, a columnist, author, and all-around an expert in PCB assembly, discusses some of the changes she has seen since joining the industry, and disruptive technologies that technologists we are going to have to face in the near future. Are you ready for the future?

Tom Lavoie on Career Planning and Professional Development

In this interview at the IEEE Rising Stars Conference, Tom Lavoie, a former HP D-level executive and now president of Consensia IT Partners and a certified Focal Point business coach, discusses how to help entry-level technical stars get their careers started with a plan, and experienced executives enhance their professional skills.

KIC Co-owner Kazmierowicz Takes Reins as President

Philip Kazmierowicz, the company co-owner, has decided to take on the position of president to guide the company through a new and trail-blazing path.

Smart Factories: A Shift in Thinking

The components that make up the smart factory foundation are not new, at least not at a basic technological level. Factory automation still uses PLCs, sensors, robotics, etc. But two things are quite different today: governments and key industry players across the globe are striving for cleaner, greener factories for the sake of the environment; and the 21st century allows for interconnected, multifaceted use of the data available through all these sensors and robotics.

SMTA Europe Electronics in Harsh Environments Conference 2019: A Preview

As a prelude to this year's Electronics in Harsh Environments conference, which will be held on April 2–4, 2019 in Amsterdam, Netherlands, SMTA Europe chairman Keith Bryant, supported by technical specialist Bob Willis, showcased the challenges and key issues faced by design and process engineers worldwide, in a webinar entitled "Harsh Environment Failures—Causes & Cures."

IPC Validation Services: New Programs and Updates

At the recent IPC APEX EXPO 2019 show, Randy Cherry, director of IPC Validation Services, gives Judy Warner an overview of a new IPC-1791 QML program focused on prime contractors and OEMs, and provides updates on existing programs.

IPC: Trump’s FY2020 Budget Plan Kicks Off U.S. Policy Debates

Within the last week, U.S. President Trump released his $4.7 trillion fiscal 2020 budget plan, kicking off the annual federal budget process. IPC is watching several budget debates that could impact the electronics industry and its supply chain.

Four Hidden Materials Handling Costs Every OEM Should Know

Many of the expenses within your electronics manufacturing business are highly visible and undergo regular scrutiny. But there can also be much to be gained by keeping track of those less obvious material costs that may not be formally accounted for in your monthly reporting.

Current Megatrends You Pay the Most Attention To

In our recent survey, we asked the following question: "What current megatrends do you pay the most attention to?" Below are some of the replies, edited slightly for clarity.

RTW IPC APEX EXPO 2019: Joining Materials with Laser Energy

Kelly Dack and General Manager Denis Barbini discuss Laserssel's laser soldering equipment. Laser soldering is presented as a solution to mitigate the effects of high heat processing on printed board substrates and components by pinpointing energy where it's needed to join the metals. He talks about the challenges that their customers usually face, and how they are helping them address those by optimizing their processes. He also mentioned their device that eliminate any type of warpage.

Automation and the Smart Factory: Introduction to Industry 4.0

The characteristics of successful automation application in manufacturing depend on how well business and technical management understand and promote the strategies, tactics, and philosophies used in modern manufacturing. This article briefly outlines the background of computer-integrated manufacturing (CIM) and its evolution to Industry 4.0 and smart factories.

2019 IPC EMS Management Meeting Wrap-up

At the recent EMS Management Meeting during IPC APEX EXPO 2019, EMS leaders gathered to discuss issues critical to EMS providers today, including supply chain issues, customer contracts, labor optimization and talent shortages. The highlight of the day was a supply chain challenges panel and discussion featuring supplier, distributor, and end-user perspectives on addressing component supply and lead time challenges.

Industry Outlook from IPC's Sharon Starr

Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.

Rehm Focuses on International Hiring

Rehm Thermal Systems has been successfully recruiting skilled workers from abroad for some time now.

What Do You Know About Automation?

Test what you know in this 10-question automation quiz! Hint: It helps to download and read I-Connect007’s free eBook Automation and Advanced Procedures in PCB Fabrication, which provides an in-depth look at automation, computer-integrated and computer-aided manufacturing, mechanization, and chemical monitoring and control.

2019 Outlook: IPC Advocacy for Workforce Education and Training

The chronic shortage of skilled workers is the top business challenge facing the electronics industry worldwide. Our skilled workers are aging and retiring faster than we can hire replacements.

Blackfox on IPC Training and Certification and Mexico Expansion

Joel Sainz, sales manager for Blackfox Training Institute in Mexico, speaks with Guest Editor Osvaldo Targon about his company’s IPC training and certification services during IPC APEX EXPO 2019. Sainz also discusses their plans for expanding their reach in Mexico.

What Drives Your Optimism?

In our previous I-Connect007 survey, we asked the following question: "What drives your optimism?" Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: Standards Updates—IPC-7093 & IPC-7530

Ray Prasad, IPC Hall of Famer and chairman for multiple committees, gives Guest Editor Joe Fjelstad an update on two IPC standards: IPC-7093 on bottom-termination components (BTCs), and IPC-7530 progress with reflow characterization. Prasad talks about the many challenges in dealing with BTCs, including circuit/board design, manufacturing, voiding, connections (or lack thereof), warpage, and reliability. He also addresses no-clean flux and its challenges.

RTW IPC APEX EXPO 2019: iNEMI on Next-generation Soldering

Grace O’Malley, VP of technical operations at iNEMI, and Editor Nolan Johnson discuss the next-generation soldering buzz session workshop hosted by iNEMI at IPC APEX EXPO 2019 and the upcoming bi-annual technology roadmap that will be released this spring.

Nate Ramanathan on Choosing a Prototype Partner and Production Supplier

AEye, a developer of perception systems for autonomous vehicles, has transitioned from initial engineering development into the final design for production and manufacturing of very large quantities. In an interview with I-Connect007, Nate Ramanathan, VP of operations at AEye, speaks about the criteria and his perspective on selecting vendors.

RTW IPC APEX EXPO 2019: Aculon on Technology Developments and Partnership with Henkel

Aculon CEO Edward Hughes and Editor Pete Starkey discuss surface modification technologies based on nanochemistry. Of particular interest to electronics technologists are recent developments in waterproofing treatments for assemblies, and how Aculon's strategic partnership with Henkel opens up new opportunities.

Digi-Key’s Dave Doherty: Tweaking the Supply Chain

In an interview with I-Connect007, Digi-Key COO Dave Doherty discusses supply chain disruptions and shortages and shares a number of ways in which Digi-Key is helping to smooth out the delivery of components even with the current turmoil.

Advice to OEM System Designers

In our previous survey, we asked the following question: "What advice would you give an OEM system designer?" Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

RTW IPC APEX EXPO 2019: Thermaltronics Discusses New Soldering Robot

Michael Gouldsmith, director of Thermaltronics, speaks with Editor Dan Feinberg about their new TMT-9800S robotic soldering unit. He also talks about an inline robotic soldering system—the next stage of their product development—which is scheduled to be released in the middle of the year.

USMCA Fights Ramps Up; IPC Helps Launch New Coalition

The coalition has a series of daunting and time-pressing tasks ahead of it. The USMCA needs to surmount procedural and political hurdles and be passed this year if we are to avoid the pitfalls of election year politics in the United States.

RTW IPC APEX EXPO 2019: Five-year Standard Committee Collaboration on JS-001

David Hillman from Collins Aerospace and IPC's Teresa Rowe speak with Editor Dan Feinberg about how a seemingly simple question resulted in years of committee work to develop the JS-001 standard on the use of conformal coatings and avoiding tin whiskers.

Two Full CFX Demo Lines at IPC APEX EXPO 2019

During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.

RTW IPC APEX EXPO 2019: MIRTEC Discusses Automation, CFX, and Sales Success

MIRTEC President Brian D'Amico speaks with I-Connect007 Guest Editor Dan Beaulieu about automation, the Connected Factory Exchange (CFX) standard, and their banner year last year. He speaks about Industry 4.0, automating the inspection process, and collecting more data to help refine the manufacturing process.

Stephanie Martin: Component Supply Challenges from the Catbird Seat

Vexos Senior Vice President for Global Supply Stephanie Martin gives the I-Connect007 editorial team a wide-ranging and insightful overview of the current parts supply situation from the perspective of procurement at a contract manufacturer.

How Inspection Improved the Manufacturing Process

In our previous survey, we asked how inspection has helped improve the manufacturing process. Here are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: Advanced 3D Solder Paste Inspection Technology

Olivier Pirou, managing director of Vi TECHNOLOGY, provides Joe Fjelstad with an overview of the company's advanced 3D solder paste inspection technology, featuring the ability to make corrections in real time. Pirou also talks about their efforts in strengthening their inspection systems.

RTW IPC APEX EXPO 2019: BTU Discusses New Solder Flux Reclamation Solutions

Bob Bouchard, corporate marketing manager at BTU International Inc., updates I-Connect007 Managing Editor Nolan Johnson on new solder flux reclamation solutions and details the new aqueous scrub methodologies, their increased ROI and efficiencies, and reduced maintenance.

Executive Forum on Advancing Automotive Electronics

Presented by IPC Hall of Fame Council, the Executive Form on Advancing Automotive Electronics, which aims to provide information on the complete supply chain for automotive electronics, featured 10 presentations on all facets of automotive electronics from materials, fabrication, and reliability testing to market information and future needs.

RTW IPC APEX EXPO 2019: Making Components Count

VJ Electronix is filling the void in pre-build component count verification challenges. Don Naugler, president and general manager, sits down with Guest Editor Kelly Dack to explain details of the machine, how it works, and who benefits from it.

RTW IPC APEX EXPO 2019: Manncorp Highlights Custom SMT Lines

Ed Stone, sales manager for Manncorp Inc., sits down with I-Connect007 Guest Editor Dan Beaulieu and discusses how they are helping customers with low- to medium-volume type production needs by installing custom SMT lines within 48 hours.

RTW IPC APEX EXPO 2019: LPKF on Benefits of Laser Depaneling

Laser technology marches on, and marching along with it is LPKF's new line of laser depaneling equipment. Stephan Schmidt, president, talks with I-Connect007 Guest Editor Kelly Dack about the many benefits of using lasers including cleanliness and higher yields through increased array density.

Advice to OEM System Designers

In a recent I-Connect007 survey, we asked the following question: "What advice would you give an OEM system designer?" Here are just a few of replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: Lenthor Discusses Facility Expansion and New Equipment

Rich Clemente, general manager of Lenthor Engineering, discusses with Dan Feinberg, I-Connect007 Guest Editor, the company’s expansion and new facility and equipment. He also talks about his outlook for the electronics manufacturing industry in North America.

RTW IPC APEX EXPO 2019: MacDermid Alpha Highlights Solutions to Combat Voids in Solder

Joe Fjelstad speaks with Paul Salerno, global portfolio manager at MacDermid Alpha Electronics Solutions, about their latest product and process solutions to combat voids in solder including modifications in pastes, preforms, and vacuum assist soldering.

RTW IPC APEX EXPO 2019: Comet Group's Lab One Facility in Silicon Valley

Joe Fjelstad speaks with Ken Burden, senior director of North American field service, and Craig Arcuri, business development, about Comet Group’s Silicon Valley-based Lab One customer center, which is a key resource for a variety of testing and inspection services, and also offers opportunities to collaborate with Comet Group's industry experts.

Award-winning Koh Young Process Optimizer

Joel Scutchfield, sales director with Koh Young America, discusses the company's outlook and new product offerings for 2019, including their Koh Young Process Optimizer (KPO), which won an award at IPC APEX EXPO 2019 for the process control software category.

Dan Schoenfelder: Searching for Parts in Real Time

The I-Connect007 editors recently sat down with Dan Schoenfelder, vice president of business development at Octopart. We discussed online parts libraries and the impact they can have on choosing parts based on availability data during the design process.

Improving the Efficiency of Your PCBA Production

Ensuring you're hitting your build times is always a major priority in surface mount production. The challenge for many OEMs, however, is that the processes involved with PCBA can be numerous and complex. And the smallest of details can make the biggest of differences.

Flex Circuit Supply Chain Challenges

In our recent Flex and Rigid-Flex survey, we asked the following question: "Do you have problems with your flex circuit supply chain?" Below are just a few of the explanations of those who answered "Yes", slightly edited for clarity.

RTW IPC APEX EXPO 2019: Electrolube Discusses Overcoming Secondary Cure Issues

Phil Kinner, technical director of Electrolube's coatings division, speaks with I-Connect007 Technical Editor Pete Starkey about how secondary cure issues with UV conformal coatings have been overcome and shows some typical examples.

RTW IPC APEX EXPO 2019: Enabling Complete Automation for Customers

Steve Williams and Saki CEO Norihiro Koike discuss Saki's AOI equipment and complete solution for electronic manufacturers, the industry-leading accuracy of their 3D equipment, and their recent Panasonic IoT certification to provide process data back to the pick-and-place equipment.

RTW IPC APEX EXPO 2019: Panasonic Highlights New Products, IPC STEM Student Outreach Program

Sean M. Murray, GM of North American Sales EAG Group for Panasonic, and Nolan Johnson, I-Connect007 Managing Editor, discuss two new product announcements at the show—PanaCIM process tracker software and MPM-WX—and being a sponsor for the IPC STEM Student Outreach Program.

Super Dry Storage Options to Manage Intermetallic Growth

Guest Editor Kelly Dack speaks with Richard Heimsch, director of Super Dry, about some of the differences between storing components and other materials for assembly floor storage versus long-term storage, and how Super Dry can help combat intermetallic growth.

RTW IPC APEX EXPO: Zentech on the Fourth Pillar of DoD Acquisitions, and NIST

Steve Williams speaks with John Vaughan, VP of sales and marketing for Zentech, about their dominance in the military/aerospace market sector, the new "fourth pillar of DoD acquisitions," and how companies that do not take the NIST initiative seriously will be quickly left behind.

Supply Chain in Crisis

In a traditional design flow, the project team tends to use the parts they already know and have footprints for—maybe a little long in the tooth, but known quantities, after all. Except these are not traditional times. Component supplies, prices, and lead times are in a great deal of turmoil. The automotive, IoT, and telecommunications sectors are vacuuming components out of the supply chain at a record pace, exerting influences like early obsolescence of older components and more.

Critical Process Issues

In our recent I-Connect007 survey, we asked what the top three critical issues are in the production process. Below are just a few of the replies, slightly edited for clarity.

RTW IPC APEX EXPO 2019: ASM Updates Mid-Level Machines

ASM CEO Americas Jeffery L. Timms and Technica President and CEO Frank Medina give Nolan Johnson a product update on ASM's mid-speed machines—EbySIPLACE and EbyDEK. By bringing key features from ASM's high-end products to their new mid-level models, ASM's new machines are gaining attention Timms and Medina discuss the how and why.

RTW IPC APEX EXPO 2019: KYZEN Intros New Aquanox Aqueous Cleaner

In an interview with I-Connect007 Technical Editor Pete Starkey, KYZEN Executive VP Thomas M. Forsythe introduces the latest member of the Aquanox family of aqueous cleaners and comments on issues of compatibility, rinsability, and consistency of operation.

IPC APEX EXPO 2019 Show Week Time-lapse Video

From set up to tear down, I-Connect007 captured a 4-day time-lapse video of the show floor from our Real Time with... IPC APEX EXPO booth. In addition, this video includes overhead shots of each of our generous premium sponsor's booths.

RTW IPC APEX EXPO 2019: KIC Speaks on Data, Voiding and Traceability

Bjorn Dahle, president of KIC, talks with I-Connect007 Technical Editor Pete Starkey about how the industry has shifted its focus from the machine to data; the issue on voiding and how manufacturers can address this process challenge; and traceability.

RTW IPC APEX EXPO: OK International Soldering Robot Integrates CV Technology

Bryan Gass, vice president at OK International, talks with I-Connect007 Managing Editor Nolan Johnson about their new soldering robot that integrates their Connection Validation (CV) technology. Launched at the IPC APEX EXPO last year, the CV technology provided the company a springboard to have a good start into 2018, and to achieve growth throughout the year.

Benefits of Jet Printing Solder Pastes

In a recent I-Connect007 survey on jet printing solder pastes, we asked the following question: "What are the major benefits with jet printing solder pastes?" Here are just a few of the replies, slightly edited for clarity.

Day One, Nothing but Fun: The Show Warms Up

The first official day of the IPC APEX EXPO 2019 was full of excitement, activity and business getting done. From the exuberant crowd at the ribbon cutting ceremony, to the closing moments of day number one, the show floor was bustling. Spirits were high from both attendees and exhibitors, sending the signal that optimism and business strength are still the industry mood.

RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses New Materials to Improve Void Issues

Traian Cucu, Ph.D., G.A.T.E Group Leader at MacDermid Alpha Electronics Solutions, discusses with I-Connect007 Managing Editor Nolan Johnson some of the methods to reduce, or eliminate, the solder voiding issue, especially with the continuing trend towards lower-pitch, high-density components.

IPC Conferences Set the Tone for Innovation During IPC APEX EXPO 2019

Monday's docket of sessions at IPC APEX EXPO 2019 presented a wide-ranging array of topics, including the Automotive Executive Forum, the Connected Factory Initiative Workgroup mapping out the future of CFX, the DFX committee celebrating the release of the IPC 2231 Guidelines document, and the Critical Components Traceability Workgroup addressing the creation of a secure supply chain.

The Sun Rises on IPC APEX EXPO 2019

It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.

In the Studio: Real Time with…IPC

It's almost time for IPC APEX EXPO 2019 at the San Diego Convention Center, and that means another Real Time with…IPC video program bringing you interviews with the electronics industry's top movers and shakers, engineers, and managers.

Most Important Attributes of Customer Service

In a recent I-Connect007 survey, we asked what the most important attributes of customer service are. Understanding and meeting the customer's needs and expectations top the list, followed by quality of service, and on-time delivery.

Electrolube Overcomes Secondary Cure Issues with New UV-cured Conformal Coatings

Electrolube Managing Director Ron Jakeman and Marketing Manager Julia Vorley speak with I-Connect007 Technical Editor Pete Starkey about the successful outcome of the international collaboration between the company's R&D teams in the UK and China, which resulted in a brand-new range of solvent-free UV-cured conformal coatings about to be launched at the upcoming IPC APEX EXPO 2019.

Mark Friedman on IPC Membership

Mark Friedman, a member success advocate at IPC, recently spoke with I-Connect007's Barry Matties about the current status of IPC's membership programs, the recent growth they've seen, and some hidden benefits of IPC membership that potential members might not be considering.

STEM: The Future of Our Industry

Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.

IPC APEX EXPO 2019 to Demo Operating CFX Line

A year on from their first demonstration, IPC’s Connected Factory Exchange (CFX) now nears the release of version 1.0 at this year’s upcoming IPC APEX EXPO. The I-Connect007 team spoke with CFX specialists Michael Ford and Dave Bergman about how far the program has come from the first initial public demo all the way through now becoming a published standard, and what users can expect from the demonstrations planned for the 2019 show.

Mentor and Seica Partner for Data Prep and Testing Big Boards

Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

The Future of the Customer Experience in Mobility

Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.

Solder Paste Selection/Qualification

In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

Shopping at IPC APEX EXPO: Evolutionary or Revolutionary Products?

As you're finalizing your shopping list, take a second to consider this: Are you in the market for products that are evolutionary or revolutionary? And what do those terms even mean for someone looking for new DFM software or a new pick-and-place machine?

Executive Forum at IPC APEX EXPO 2019 Focuses on Advancing Automotive Electronics

Senior-level executives from across the global electronics supply chain will gather to discuss opportunities and challenges facing the rapidly changing automotive electronics industry. With five expert speakers and a powerful keynote from GreenSource VP Alex Stepinski, registration will fill fast.

Dispatches from CES 2019: The Future in the Kickoff

Press kickoff briefings at the Consumer Electronics Show (CES) are no stranger to big claims and hyperboles. At the “CES 2019 Trends to Watch” presentation on Monday morning, Steve Koenig, Consumer Technology Association’s (CTA’s) VP of market research, made some pretty big claims about what we should expect to see at the show, but those claims don't seem at all to be hyperbolized.

Who’s the Best of the Best in Hand Soldering?

IPC APEX EXPO 2019 will include the new IPC World Championship Hand Soldering and Rework Competition on the expo floor on January 29 and 30. Twelve competitors from Britain, China, France, Germany, India, Indonesia, Japan, South Korea, and Thailand will compete for the crown and the title of the first-ever IPC World Hand Soldering and Rework Champion.

More Than Inspection: It’s Process Improvement

Barry Matties speaks with Brian D’Amico, president of MIRTEC, about the current state of machine-to-machine communication in the industry, and how the inspection company is interfacing with the different manufacturing languages currently available to gather predictive data and feedback from every inspection step to eliminate future defects.

Most Important Feedback

In our recent I-Connect007 survey, we asked the following question: “What is the most important feedback that you receive after your board is manufactured?” Here are just a few of the replies, edited slightly for clarity.

Welcome to the BIG Show!

This month, we celebrate the impact and reach of the IPC APEX EXPO slated for January 26--31, 2019, in San Diego, California. Have something truly new? It needs to be seen here at IPC APEX EXPO with long-standing products and evolutionary advances from industry stalwarts will grow their installed base here, too. There are other industry shows, but the must-go show for our industry is IPC APEX EXPO.

Top 10 Most-Read SMT Interviews of 2018

We continue our top 10 lists, this time with the most-read SMT interviews in 2018. Topping the list is an interview with Joe O’Neil and Matthew Becker of Power Design Services (PDS), along with Ted Park of Green Circuits, who announced their merger last year.

Words of Advice

In our recent designer survey, we asked the following question: “What advice would you give an OEM system designer?” Here’s what our EMS experts said.

Top 10 Most-Read SMT007 Columns of 2018

Each year, we compile the lists of most-read news, articles and columns. Here are the top 10 most-read SMT007 columns from the past year.

Top 10 Most-Read SMT007 Articles of 2018

Every year, we like to take a look back at the most popular SMT007 news, articles, interviews, and columns. These are the top 10 most-read SMT007 articles from the past year. Check them out.

What Electronics Manufacturers Need to Know About RoHS 3 Compliance

On July 22, 2019, the latest incarnation of RoHS will come into full effect across the European Union. So, what’s changed? And what exactly are the implications for UK electronics manufacturers? This article provides a recap of what RoHS is, why it matters, and the steps that OEMs will need to take to ensure compliance.

Best Advice for Increasing Productivity

We recently asked the industry what their best advice is for increasing productivity. Here are just a few of the replies, edited slightly for clarity.

A Look at Medical Electronics Design and Assembly Challenges

We recently spoke with Dr. Despina Moschou, lecturer at the University of Bath, as well as Kaspars Fricbergs, VP of global quality, and Tom Reilly, director of marketing and sales operations, of EMS firm Vexos Corp., to learn more about the challenges and opportunities in medical electronics design and assembly, as well as the relevant regulatory and supply chain issues.

SMT Electrolytic Capacitor Solder Joint Criteria and Integrity Investigation

The body configuration of SMT electrolytic capacitors results in the solder joints being only partially visible for optical inspection purposes. Therefore, the use of adequate reflow soldering processes is critical for producing solder joints that are acceptable for their end-product use environment.

Challenges in Flex Circuit Assembly

In a recent I-Connect007 survey on flex circuits, we asked the following question: What are some of the challenges that you face utilizing flex circuits? Here are just a few of the replies, edited slightly for clarity.

Defense Speak Interpreted: PERM—Pb-free Electronics Risk Management

In this column, we explore PERM—the Pb-free Electronics Risk Management Consortium. No, the group members do not all have curly hair! The name was chosen around 2008 by a group of engineers from aerospace, defense, and harsh environment (ADHE) organizations.

Internet of Body: The Next Big Thing for Medical

Titu Botos, Ph.D., the VP of engineering at NeuronicWorks, discusses with I-Connect007 Managing Editor Nolan Johnson the next big thing to come after the Internet of Things (IoT)—the Internet of Body (IoB), which could include implantables and ingestible medical devices to monitor your body better.

Dr. Traian Cucu Discusses Low-Temperature and Lead-Free Soldering

Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.

How to Avoid Supply Chain Disruption this Chinese New Year

To avoid any negative impact on deliveries or lead-times during the Chinese New Year, the best tactic is to start planning early. And while there's no need to panic buy, you'll definitely want to think ahead when communicating with your PCB suppliers.

Greatest Challenges in Soldering

In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

AOI Programs with a Magic Click

Production runs of 10–1,000 assemblies are everyday life for an EMS provider. But what if important staff are on vacation, and component deliveries are very much delayed? And then the customer is determined to have AOI, but the layout of the assembly is highly customized, making it virtually impossible to use complete library entries. Here's how AOI programs can help you in these scenarios.

3D Printing and Medical Electronics: A Disruptive Beneficial Technology

We are seeing significant advances and increased uses for 3D manufacturing in medicine—many more than 3D-printed and conductive circuits on device structural components. There is enough movement in this area that 3D additive fabrication in medicine—including but not limited to 3D-printed circuits—has become its own topic, and one that we will be watching and continuing to cover.

What is ESD and Why Should We Worry About It?

The realities of ESD, how static charges are generated, how they can be transferred to electronic components and the damage they can do, and what practical controls are required to protect components, assemblies and equipment from damage—these topics were explored and clearly explained in a webinar presented by SMTA Europe Technical Committee members Dr. Jeremy Smallwood of Electrostatic Solutions and Charles Cawthorne of MBDA.

I-Connect007 Research

In a recent SMT007 survey, we asked our readers how inspection has helped them improve their manufacturing process. Here are just a few of the answers, edited slightly for clarity.

Greg Vance on SMTA Ohio Chapter Updates

This summer, Patty Goldman interviewed Greg Vance, senior project engineer at Rockwell Automation and president of the Ohio chapter, at the SMTA Ohio Valley Expo and Tech Forum in Independence, Ohio. Vance discusses the show, young professionals in the industry, and other events, such as solder paste roundtables.

Is This a Golden Age for Medical Devices?

Just as the telecommunications golden age launched 30 years ago—which led to wireless phones, electronic data terminals, and technology that allows us to watch our favorite shows on our own time and not the TV stations' schedule—it seems that medical device technology is gearing up to do something similar. The Internet of Things (IoT), Internet of the Body (IoB), and printed electronics technologies are emerging, and they're converging with medical devices in a big way.

Electrolube on Managing Thermal Interfaces and Conformal Coatings

Electrolube's Jade Bridges, global technical support manager, speaks with I-Connect007 Technical Editor Pete Starkey about how to manage thermal interfaces for maximum heat transfer efficiency. She also provides an update on conformal coatings.

Solving the UK Manufacturing Productivity Puzzle

Since the financial crisis of 2008, manufacturing has seen an undeniable slump. Latest industry statistics paint a pretty compelling picture—where once the UK manufacturing sector was hot on the heels of its international counterparts, it now lags behind with average annual growth of less than 1% a year since the advent of the financial crisis. This article looks at five issues that could help to inform our decisions and boost performance within the sector.

Understanding the Benefits of CFX

In an interview with SMT007 Magazine, David Fenton, group customer support manager for Blakell Europlacer, discusses the technical challenges and the impact of the IPC Connected Factory Exchange (CFX) initiative on the PCB assembly industry, and what manufacturers can expect from this electronics assembly connectivity standard.

I-Connect007 Research

In a recent I-Connect007 survey on flex circuits, we asked the following question: What are the major drivers causing you to utilize flex circuits? Here are just a few of the replies, edited slightly for clarity.

Tempo Automation's Open House Raises the Curtain in San Francisco

Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.

RTW SMTAI: Inventec Discusses the 'Green Way'

At SMTA International 2018, Dan Walker, North American sales manager at Inventec Performance Chemicals USA, provides Editor Nolan Johnson an overview and update on Inventec’s environment-friendly cleaning, soldering and coatings products. He also discusses how they are addressing the latest manufacturing issues, including solder voiding.

U.S. Career Opportunities with Electrolube

In a recent interview, Julia Vorley, group marketing manager for Electrolube, discusses a career opportunity Electrolube is seeking in the U.S. Read on to hear what they’re looking for in a technical account manager.

Training: One of The Best Investments You Can Make

Dan Patten, general manager at BEST Inc., speaks with I-Connect007's Barry Matties about the drivers behind the recent uptick in training from U.S. companies—from contract-driven training for certification levels to newfound demands from quality departments—and why reinvesting in the workforce is beneficial to all parties involved.

How Effective is Your Induction Process?

This article looks at eight ways manufacturers can ensure their induction process passes the 'so what' test. And more importantly, addresses all of the questions and concerns a new starter might have during their first couple of days.

A Look at Our Readers’ Manufacturing Challenges

In a recent SMT007 survey, we asked the following question: "What are your greatest challenges when it comes to soldering?" Here are just a few of the replies, slightly edited for clarity.

Solder Paste Jetting: An Integral Approach

Solder paste jetting is a technique that differs greatly from traditional solder paste deposition methods. In this article, solder paste jetting is compared with the other solder paste deposition methods—solder paste dispensing and solder paste printing and solder paste jetting—and highlights why it is becoming a viable option and how it increases the flexibility of a single production system.

Koh Young's Joel Scutchfield on Smart Factory Connectivity

Joel Scutchfield of Koh Young speaks with I-Connect007's Barry Matties about the struggles system providers currently face in implementing the machine-to-machine connectivity needed for a smart factory with no common platform or protocol in place yet.

Christine Pearsall on Tempo Automation and PCB West

Christine Pearsall, senior director of marketing for Tempo Automation, discusses with Consulting Technical Editor Tim Haag what services Tempo Automation provides, what attracts engineers and designers most to the company, and what events they plan to attend in the upcoming year.

Managing Cyber-Threats Within Electronics Manufacturing

The rise of the 4th Industrial Revolution (4IR) has brought with it digital interconnectivity that offers unprecedented opportunities for original equipment manufacturers (OEMs). But with that openness there also comes risk—the threat of the loss of data, the theft of capital or intellectual property, and the disruption of access to systems or operational technology—all of which can impede businesses and impact on trade.

Survey: Low-Temperature Soldering on PCBAs

The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.

RTW SMTAI: KIC's MB Allen on Smart Factory, CFX

Marybeth (MB) Allen, product manager at KIC, speaks with I-Connect007 Managing Editor Nolan Johnson about the smart factory, KIC's new RPI i4.0 software release, and as well as her company's leadership in IPC's Connected Factory Exchange (CFX) initiative.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.

How to Avoid Common Wave Soldering Issues

Wave soldering involves using waves of molten solder that act as glue to attach electrical components to the PCB. While this process is expedient and efficient in producing high-quality products, it sometimes experiences glitches that can be prevented or corrected. This article explores some of the main issues and how to remedy them.

Green Circuits' Joe O'Neil and Joe Garcia on the Best Kept Secret

Joe O'Neil, CEO, and Joe Garcia, VP of sales and marketing, at Green Circuits discuss with I-Connect007 Managing Editor Nolan Johnson about recruiting new employees, new training and certification requirements, tariffs, and more.

Challenges and Opportunities with CFX

Larry Chen, global marketing supervisor at Taiwan-based Test Research Inc. (TRI), speaks about how the company is supporting IPC’s Connected Factory Exchange (CFX) initiative, the user interest on the standard, the challenges, and his outlook for CFX.

4 Questions OEMs Typically Ask When Outsourcing

The decision to transfer your electronics manufacturing to an EMS company is a complex process, with the potential to impact your business, your staff, your customers and your suppliers in a multitude of ways. This article highlights four questions OEMs typically ask prospective contract manufacturing partners when they first start engaging with them—and our take on the answers.

I-Connect007 Survey Sees Bright Prospects for Low-Temperature Soldering

There has been an increasing amount of discussion on low-temperature soldering, and solder pastes. And why not? There are several advantages of using low temperature solders—from a technical standpoint and economic perspectives. A recent survey by I-Connect007 saw majority, or 67%, of the respondents saying they will consider using low-temperature solders in their assembly process.

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.

Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications

Solder voiding is a common phenomenon across all semiconductor packaging and electronic board assemblies. There are many factors that influence void frequency and size. This article focuses on several process, design and materials selection considerations which control or potentially reduce voiding to meet industry and end-market acceptance criteria.

CFX: Building the Foundation for Industry 4.0

IPC has been showcasing the Connected Factory Exchange (CFX) initiative in action at the many industry events this year, providing a technical demonstration operating in real time with standardized machine data delivered from participating exhibitors through the cloud and onto visitors' cellphones. In this interview, Dave Bergman, VP for international relations at IPC, discusses the latest developments with IPC’s CFX standard, including key highlights, impact in the electronics assembly industry, and what’s next.

Pros and Cons of Dual Sourcing

Now, more than ever, there's a need for responsive and flexible supply chains. For OEMs, one solution to mitigate the risk of supply chain disruption is to maintain relationships with more than one supplier through dual sourcing—the practice of purchasing a chosen raw material, product, or service from two (or sometimes multiple) sources. Here are it's pros and cons.

Low-temperature Solder Paste Process Advantages

This article examines the performance of two low melting point SnBi alloys used in solder paste when assembling BGA components with SAC alloy spheres, and the advantages of a low-temperature process over the regular SAC assembly process. It will also evaluate solder paste capability regarding the process and the performance of a joint formed with a low melting point alloy solder paste and SAC305 spheres, including process advantages and material capabilities.

Meet Goepel electronic's New Managing Director, Alice Göpel

In August 2018, Alice Göpel took over the managing director position of Goepel electronic, replacing her father Holger Göpel who had managed the company since 1991. In this interview with SMT007, Alice discusses her career, what inspires her, and her outlook for the industry.

I-Connect007 Survey: Inspection Systems to See Increasing Use of 3D Technology

There is a critical need for inspection in the PCB assembly industry amid the continuing trend towards miniaturization in electronic systems and devices. Further, as solder joints become smaller and fine pitch becomes denser, the use of 3D technologies in inspection systems is becoming a must to help improve the quality and reliability of tests.

RTW SMTAI: Steve Greathouse Discusses Award, Highlights Need for New Engineers

Steve Greathouse, senior staff engineer at Plexus Corp., and recipient of SMTA’s Excellence in Leadership Award this year, speaks about the magic of the SMTA as a collaborative and supportive professional organization. He also discusses the need for “new blood” to join the manufacturing workforce as more senior engineers leave the industry.

RTW SMTAI: PalPilot on Adding Value to Design and Assembly

Tim Sullivan, vice president of sales at PalPilot International Corp., speaks with I-Connect007 Managing Editor Nolan Johnson about their services, and how they add value to their customers from design to assembly/manufacturing. He also talks about their online platform called FootPrintKu, which help designers when it comes to footprints of their design.

How to Measure Manufacturing Employee Engagement

Disgruntled employees have the ability to sap the lifeblood from your organization. And in some cases, one or two negative views can spread quickly throughout a business like an uncontrollable virus. While it is important to deal with issues the moment they arise, it is also vital to have a system in place to measure views and opinions on a regular basis and with a long-term view.

Taking an Independent Path: Strategies for Low Risk Sourcing of Components in a Constrained Market

Today, the challenges of a highly stressed supply chain are forcing many OEMs and EMS providers to rethink the way they source components. With parts such as multilayer ceramic capacitors (MLCCs) and other low-cost components in chronic shortage with extended lead times for delivery, manufacturers must be able to get these parts on-time at the lowest possible cost without assuming additional risk.

RTW SMTAI: Libra's Rod Howell Discusses Tariffs Issue

Rod Howell, CEO of EMS firm Libra Industries, speaks with I-Connect007 Managing Editor Nolan Johnson about the ongoing tariffs issue, how it impacts the global electronics manufacturing supply chain, and their strategic response to address the issue.

RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge

Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge. He also speaks about their new products in data collection and monitoring software for cleaning equipment.

RTW SMTAI: Harold Sneath Highlights Alpha’s Reclaims Business

Reclamation can be a profit center, not a cost of doing business. At the recent SMTA International 2018 conference and exhibition, Harold Sneath, Eastern Regional Reclaim Manager at Alpha Assembly Solutions, lays out the reclamation services available through Alpha.

SMTAI 2018 Closes on a High Note

SMTA International 2018, which took place in Rosemont, Illinois is now in the history books. This multi-day event, held October 14-18, at the Donald E. Stephens Convention Center, was packed with keynotes, conferences, lively discussions, committee meetings and a two-day exhibition.

Real Time with...SMTAI 2018 Coverage Now Available

The I-Connect007 team traveled to Rosemont, Illinois this week to cover the SMTA International 2018 conference and exhibition. Video interviews of key executives and leaders of our industry are now available for viewing. Also check out the photo gallery for snapshots of the exhibition floor and the conference as well as the after-hours festivities.

Do's and Don'ts of Thermal Management Materials

Selecting a thermal management material that is broadly applicable to a particular electronic assembly and its predicted operating conditions is a good starting point; however, as with many of these things, the devil is very much in the details! Find out the key considerations in choosing your materials.

AI-Powered Inspection

Viscom AG COO Peter Krippner discusses artificial intelligence (AI) and its impact in the electronics manufacturing industry. He speaks about how AI will change the industry, the challenges in adopting AI, and the state of implementation of AI in electronics manufacturing right now.

IoT: Driving Change in Manufacturing

In the manufacturing world, the Internet of Things (IoT) can be seen as an element of Industry 4.0. The idea behind it is that factories would evolve to become smarter, to become a lot more flexible—to be able to make the products that customers want, basically at any time that they need.

How CIM and IoT Can Make Your Factory Smart

As business needs challenge the electronics assembly industry to support increased flexibility, lower overhead, and stricter quality standards, the industry is rapidly adopting improvements in automation and analytics to meet the challenge. This article explores the changes in culture between the past, where data was simply sent point to point, and today’s multi-layered IoT technology-based solutions, as well as the effects and opportunities that are here now for the taking.

Tips to Improve Soldering Tip Life and Reduce Cost

Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

The Smart Robot Revolution is Here

The distance between imagination and reality has reduced considerably. Thanks to advanced technologies such as artificial intelligence (AI), data processing, and machine vision, the science fiction writers' vision of smarter robots is becoming a reality. These more intelligent machines are also making a big impact in manufacturing.

Indium on Voiding and Auto Electronics Test Standard

In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manufacturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing.

The Megadrivers

Henry Ford's innovation in manufacturing—the moving assembly line—helped reduce the time it took to build a car from more than 12 hours to just two hours and 30 minutes. It was a revolutionary advancement in production. Through continuous improvements over decades, the assembly line has become the highly efficient primary mode of manufacturing in a wide range of industries and it has changed the way we live and work forever.

Electronic Components Market Update

Unfortunately, there is still no end in sight to the electronic component shortage, and some lead-times are being quoted with 2019 and even 2020 delivery dates! So if you are working with an EMS provider, it remains vital that you communicate and share forecast information with them. You may also want to start looking at the option of fitting, or designing in, smaller components to your PCB assemblies.

RTW NEPCON South China: SEHO Discusses New Production Facility in South Korea

Andreas Reinhardt, R&D director at SEHO Systems GmbH, speaks about their new production facility in South Korea, which aims to address the growing lead times in their supply chain. He also talks about how emerging technologies such as more and more sensors and connections, big data, and cloud computing are impacting the electronics assembly industry.

XR Update: Emerging Realities

The rate of advance in the use of XR—the term now being used to cover AR (augmented reality), VR (virtual reality), and MR (mixed reality)—in many areas, along with advances in the hardware and network capability supporting the use of XR, is accelerating. And because things are moving so quickly, here's a quick review and an update on recent developments in this field.

RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering

Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.

RTW NEPCON South China: Viscom Increases 3D AXI Throughput

Guido Bornemann, head of sales for Asia at Viscom, speaks with Editor Edy Yu about the innovations in in-line 3D AXI systems that help manufacturers reduce handling time by about 40–50% and improve their throughputs.

Mexico: A New Hub for Electronics Manufacturing

With its competitive production costs, good logistical access, a skilled and deep talent pool and state-of-the-art technology, Mexico now produces everything from flat-screen televisions to smartphones and other consumer devices employing surface-mount technologies. Here's how Mexico’s strengths in electronics manufacturing services (EMS) evolved, and why more and more electronics manufacturers are moving to the country.

Mark Curtin on Large-Board Stencil Printing and Metal Squeegees

Transition Automation Inc. recently developed a large-area benchtop stencil printer targeted for high-mix low- or medium-volume production. In an interview with I-Connect007, Mark Curtin talks about the new system, and why metal squeegees are the way to go when it comes to solder paste printing.

Should You Send Your PCB Assembler Loose Parts?

Everybody has a few loose PCB components lying around. Sometimes, it's a few chip caps left over from a hand-rework task, or maybe it's a tiny QFN or big old BGA. But, should you send your PCB assembler those loose parts? Read on.

Towards a Data-Driven Cleaning Environment

Tom Forsythe, executive vice president at KYZEN, discusses the most critical challenges of the cleaning process, a new approach to testing the cleanliness of PCB assemblies, and how KYZEN is helping customers develop a more data-driven approach to cleaning.

Why Clean?

In our conversations, many assemblers said that cleaning is not a value add, that their customers are getting nothing out of it. It also means an added process, and as such, an additional production cost. On top of that, no-clean fluxes have been in the industry for over 20 years now. But still, why clean?

Interview with a High School Robotics Team Mentor

On the floor of the recent Wisconsin SMTA Annual Tech Forum, I-Connect007 Technical Editor Happy Holden sat down with Aaron Denk, representing the local Cedarburg High School’s robotics team.

What SMT Component Shortages Mean for Design and Manufacturing Engineers

Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

Looking Under the Hood of MLCCs

The multilayer ceramic capacitor (MLCC) is one of the most widely used, and the most highly produced, passive devices in modern electronics manufacturing—with more than a thousand billion devices being produced worldwide every year. This article explores the evolution, applications and current state of the MLCC industry and what this means for electronics manufacturers.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.

Whitepaper: Electronics Cleanliness Testing

This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.

Getting More with Cleaning

The continuing growth of the electronics industry, driven by the rapid expansion of electronics into areas such as automotive and medical, is creating a new mindset with regard to cleaning, mainly due to quality and reliability issues. Read more to find out what our experts have to say when it comes to cleaning challenges in PCBAs and possible solutions.

A New Standard for Standards – From Data to Information

The main challenge we have today with our manufacturing standards is that they are deterministic, such as the 30% maximum void per ball for X-ray inspection of BGAs—which determines if a BGA assembly passes or fails. This article proposes a new perspective on setting pass and fail thresholds in the manufacturing line.

Is Component Testing Using ROSE Practical?

Industry experts are saying that Resistivity of Solvent Extract (ROSE) testing should be retired as a cleanliness or process control test in the PCB assembly industry. This article emphasizes that position by highlighting some work by the authors comparing component cleanliness results from the ROSE against Ion Chromatography (IC) results.

Strengthening the Joint with a Revolutionary New Low-Temp Solder Paste

I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.

Newly Re-Branded Optel Software Lays Down China Strategy

Optimal Electronics Corp., a provider of smart software solutions for electronics assembly, recently rebranded globally as Optel Software, as it starts its venture in China. In an interview with SMT007 Magazine, Dr. Ranko Vujosevic, CEO and CTO, updates on the latest developments from the company and discusses their plans in China and Asia this year.

3D Printing: Enabling a New Manufacturing Landscape

At the recent Michigan SMTA Tech Forum, Scott Schwarz, senior sales representative for rapid technology at Fisher Unitech, discusses with I-Connect007 Technical Editor Happy Holden the latest developments in 3D printing, and the advanced applications that have made significant impacts in the automotive manufacturing industry.

Riding Out the Electronic Components Crisis is No Longer an Option

The electronic components shortage is continuing to take its toll on the electronics manufacturing sector. As market demand outstrips manufacturing capacity, the fallout from the components crisis is now predicted to extend well into 2020, and beyond. And it’s a problem which OEMs can no longer hope to simply ride out. Find out what you can do to address this issue.

Inspection and Design for Testability

In an interview with I-Connect007, Matthias Müller of Goepel electronic talks about about test and inspection technologies, especially in the automotive industry. He discussed design for testing (DFT) and the benefits technologists can gain from DFT. He also mentioned about the increasing need for 3D SPI, as well as why X-ray inspection has become very important now for the automotive, military, and aerospace industries.

Practicing Best Practices

Recently, we looked into electronics assembly best practices that help optimize your manufacturing processes. To provide you more insights on this, here's an interview with two assembly experts: Jason Keeping of EMS firm Celestica, and Bob Willis, a renowned EMS consultant and trainer.

Best Practices in Manufacturing: Wave Soldering

Over the years, best practices have evolved and will continue to evolve with the changing environments, company needs and challenges and what may work for one company may not necessarily be best for another. This article offers recommendations to consider in managing your wave soldering process.

The Impact of Industry Regulations on Your Supply Chain

Changes and updates to existing legislation is an ongoing process, and the introduction of new rules is inevitable. It is vital that your EMS partner is committed to staying up to date and to keeping you informed of how these changes may impact your the manufacturing supply chain.

Use of Lean Manufacturing Principles Enhances Quality and Productivity

Using work-cell-based batch assembly processes will enable EMS firms to provide greater flexibility and responsiveness to their box build customers. Here's an example of why this flexibility is important, and find out how regional EMS providers, often thought of as companies primarily focused on PCBA assembly and cellular box builds, who are skilled in mechanical assembly can easily shift to higher-volume work.

KYZEN: Cleaning with Data

With the ability to monitor the temperature and concentration of the bath, and automatically adjust either if needed, the KYZEN Analyst system has caught the attention of the electronics assembly industry. In this interview with I-Connect007, Tom Forsythe, executive vice president for KYZEN, provides an update on KYZEN Analyst and describes how it has evolved into an Internet 4.0 solution with the ability to increase performance and life of the chemistry.

Full Material Declarations: Removing Barriers to Environmental Data Reporting

Full material declaration of product content in electronics and other industries continues to be a challenge for both suppliers and customers alike. This article focuses on requirements for tools that enable rapid and accurate reporting of Class D FMDs that can be used by suppliers primarily in the base of the supply chain.

Demand Forecasting: The Art of Knowing What You Need Before You Need It

Forecasting is a skill born out of experience, intuition, and most of all, knowledge. But what do you need to know when you’re creating an accurate demand forecast? What data is needed? Are there tools you can use? Where do you start? Find out here.

5 Supply Chain Questions to Ask Your Assembly Partner

A key question for any OEM who may be considering outsourcing production is whether to maintain its existing supply chain or to hand those crucial purchasing decisions over to its assembly partner. This article highlights five questions to ask a potential assembly partner before handing over the responsibility for your supply chain management.

Cross Functional Teams Drive Strong Focus on Risk Mitigation and Quality

Having a traditional cross-functional team (CFT) approach, with a much larger CFT group that includes a tactically focused program manager, a strategically focused account director, a buyer, a product engineer, a process engineer, a test engineer, a quality engineer, a production supervisor or lead person, and a customer service representative focused on materials and scheduling, will help EMS firms govern all the necessary outputs associated with each customer.

Best Practices to Achieve Zero Defects

To ensure that a complex electronics build can be completed on time, on budget and with zero defects, here is a list of checks and balances that will help you with adjustments or corrections real time, instead of discovering them at the end of the build or worse, when it's already arrived at the end user.

We Have the Best Practice for That

Most best practices have been developed over time, based on the many different experiences that people encounter in the manufacturing line. And it is important to institute these best practices to make sure that your processes will result in outstanding job at the end of the day.

Strategies for Choosing Solder Paste for Successful Electronics Assembly

One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

How Investment in Staff Well-Being Impacts Manufacturing Productivity

As manufacturers seek to address the challenges of increasing efficiency, there's a greater emphasis on the value of high-performance working practices such as Lean manufacturing. But the emphasis on continual quality improvement processes can also have an indirect effect on employee health and well-being. Here's why manufacturers should invest in the well-being of its employees.

Alpha's Revolutionary Approach to Low-Temp Soldering

In an interview with I-Connect007, Morgana Ribas discusses the new technology on low-temperature solder that she has developed at Alpha Assembly Solutions. She also talks about why there is a need for a low-temperature process and the benefits it offers.

Factronix on Cleaning, the Market and More

Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.

AXI 4.0 in a Smart Factory Environment

Outstanding quality is vital to be able to survive the fierce competition between contract manufacturers. Here's how one EMS provider address inspection challenges and board complexities to ensure the quality and reliability of their PCB assemblies.

How DFA Converts Complexity into Freedom for Medical Device Development

The assembly of medical devices comprising electronic and mechanical components has become an increasing challenge as devices grow more complex, functional and compact, and as they undergo increasingly frequent product refresh cycles. Read on to find assembly techniques that will help manufacturers to deliver highly engineered and integrated products.

IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle

I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.

Novel Approach to Void Reduction Using Microflux Coated Solder Preforms

Shrinking QFN package sizes and power requirements are driving new developments in micro-fluxed preform. Learn what factors contribute to an optimal solution.

Addressing Temperature Challenges in Flex Circuit Rework

Zen Lee and Michael Gouldsmith of Thermaltronics discuss the challenges of flex circuit assemblies during the rework process, the power-on-demand feature of smarter hand soldering systems, as well as how Curie Point helps operators avoid temperature overshoots during rework.

I-Connect007 Survey Shows Rising Use of Flex and Rigid-Flex

In our recent survey on flex and rigid-flex circuits, the majority of our respondents indicated an increase in their use of flex and rigid-flex technologies in their designs, indicating a continued shift in flex technology usage. We bring you the survey details here.

Conversation with… Vexos: Doing It Right the First Time

Harry Chan, Deputy GM and VP Manufacturing for EMS firm Vexos Shenzhen, is responsible for all aspects of manufacturing through continuous process improvement, production management, and development of manufacturing talent and teams. In an interview with SMT007 Magazine, he shared the challenges when dealing with flexible circuit assemblies, and strategies and techniques to address them.

Plasmatreat on Atmospheric Pressure Plasma

At the recent SMT Hybrid Packaging 2018 event held in Nuremberg, Germany, I-Connect007's Barry Matties sat down with Nico Coenen, global business development manager of Plasmatreat, for a discussion on Plasmatreat's atmospheric pressure plasma (AP plasma) treatment process and its various applications in the electronics industry.

Overcoming Growth Challenges

Growth is usually seen by manufacturers as a good thing—a sign of success and a result of hard work. But if this growth isn’t planned for, or the manufacturer can’t react in time, growth can cause the same devastating results as if the business was in decline. This article looks at seven common areas that can cause manufacturers a headache when their business is growing, along with solutions to help ease the pain.

Tackling Reliability Challenges in Low-Temperature Soldering

William Yu, senior technical services manager for Alpha Assembly Solutions, recently shared with I-Connect007 the challenges when it comes to the reliability of low-temperature solder pastes, and soldering strategies to overcome these issues.

Nearing Retirement, Juki's Bob Black Reflects on a Long Career

After more than 40 years in the electronics manufacturing industry, Juki's Bob Black is nearing retirement. Bob sat down with Barry Matties at the recent SMT Hybrid Packaging show in Nuremberg to reflect on his career and talk about the importance of strategic partnerships, even if that means playing nice with your competitors.

ASM Assembly Solutions on CFX

ASM Assembly Solutions was one of the 30+ companies participating in IPC's CFX (Connected Factory Exchange) showcase at the recent SMT Hybrid Packaging show in Nuremberg, Germany. In this interview, ASM's Thomas Marktscheffel shared his perspective on CFX and its current challenges, and dispelled the notion that CFX might be a cookie-cutter approach to the smart factory.

Reflow Perspectives to Flex Circuit Assemblies

At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.

Is There an End in Sight to the Electronic Components Crisis?

As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.

Conversation with Miraco… Strategies for Successful Flex Circuit Assembly

Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.

Aegis on CFX and Hermes Efforts

The Connected Factory Exchange (CFX) specification is truly revolutionizing the PCB industry. Michael Ford, from Aegis Software, met with I-Connect007's Barry Matties for an interview during the SMT Hybrid Packaging show in Nuremberg, Germany, to discuss the impact of this collaborative effort, and how it differs from the Hermes Standard.

DFM: Top Ten PCB Concerns

DFM—design for manufacturability—is a critically important but often ignored aspect of the PCB design process that directly impacts product quality and reliability. This article will discuss the top 10 DFM concerns that should be part of any design review process.

Tackling the Challenges in Flex Assembly

Apart from the design and manufacturing of flex printed circuits, a critical challenge that needs attention is assembly. Their flexible nature requires specific strategies for paste printing, chip mounting, soldering—whether reflow, wave, or hand—and rework/repair processes. Which is why the June 2018 issue of SMT007 Magazine looks into the many challenges in flex circuit assembly and highlight some of the strategies, techniques and best practices to help assemblers deal with flex circuit issues.

High School Team's Robotics Entry on Spotlight at Wisconsin Expo & Tech Forum

In May, I took the opportunity to drive around Lake Michigan and visit the SMTA Milwaukee Chapter’s Wisconsin Expo & Tech Forum. Held at the Crowne Plaza Milwaukee Airport Hotel, this was a well-organized and attended table-top expo and technical forum, with over 60 exhibitors, and a high school team with their FIRST Robotics entry.

Dave Bergman on IPC and CFX

The recent SMT Hybrid Packaging show in Nuremberg, Germany, marked the second opportunity for IPC to showcase its new Connected Factory Exchange (CFX) initiative. In this interview, David Bergman, VP for international relations at IPC, tells us more on the overall reception of CFX and the benefits users are seeing thus far. He also provides an update on what’s next for the open source standard.

The Value of Site Visits in Selecting Your Electronics Manufacturer

A site visit can be an invaluable exercise in helping you to better understand your electronics manufacturing services (EMS) outsourcing options and to see first-hand the operational capability, procedures and culture of a prospective EMS partner.