-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Patty's Perspective: New Technology Heading our Way— Faster than Ever!
February 21, 2017 | Patty Goldman, I-Connect007Estimated reading time: 5 minutes

Way back when, in the early 1980s, I worked for a small PCB manufacturer in Danbury, Connecticut. We all loved new stuff, as in nobody wanted to make normal PCBs—just crazy impossible stuff. We did full panel soft gold (for wire bonding); we made about 90% of the first circuits (all gold-plated) that went in the early digital watches (for TI and Timex); we worked with Ohmega material and embedded resistors; we were making 5-mil line/space innerlayers in volume for IBM and even prototyped a 2-mil line/space multilayer (this was more than 30 years ago, mind you); we made the first (or darn close to the first) polyimide gold-plated chip-on-board multilayers to which something like 42 chips were gold wire-bonded (HP). Talk about new technology—we were deep into it!
And now, have we seen or done it all? Not even close! As technology moves faster and faster, so do our equipment, materials and chemistry suppliers to help us to enable that next greatest invention. We are all at the forefront of IoT, the fifth industrial revolution, autonomous and connected—everything, all those things that were unimaginable even 10 years ago. It’s hard work, there is no sitting back or relaxing, and those looking for an easy 9-to-5 job, forget about it. Are you ready for the next thing, to keep pushing forward?
As an excellent introduction to this issue, IPC’s John Mitchell gives us a wonderful overview of what emerging technology is and what we need to do to keep up. One thing he emphasizes is a trained and competitive workforce. Indeed, in our recent hiring survey we learned that an overwhelming percentage of you are concerned about a shortage of skilled and qualified people. John’s column is a great call to action.
Next, we have a very intriguing interview with Joan Tourné of NextGIn Technology BV, conducted by I-Connect007’s Pete Starkey. Joan talks about a new interconnect technology he calls “vertical conductive structures” or VeCS.
With VeCS one can achieve much higher interconnect density using existing equipment and processes. He talks of cost reductions associated with reduced material usage and provides an interesting illustration of this novel technique.
Apparently one of the most significant new technologies these days is jet printing solder mask. You may say, “Inkjet? Not new. Soldermask? Not new.” But put them together and the challenges are huge and the technology is right on the cutting edge. As such, we bring you several articles and interviews on this very subject.
Henk Goossens of Meyer Burger BV in The Netherlands provides a wonderful introduction to the thorny subject of direct digital inkjetting of soldermask. Removing steps like artwork generation, developing, and waste treatment, and reducing materials and process time, all equals to cost savings…of course we want to inkjet. Henk gives us a great view of the subject from the equipment perspective.
We have two interviews conducted by Publisher Barry Matties that explore the material/equipment partnership between Taiyo and Schmoll to develop an inkjet soldermask that is compatible with the inkjet machine. Dick Crowe of Burkle (U.S. distributor for Schmoll) contributed an excellent introduction. The first interview is with Taiyo’s John Fix, with Walt Custer of Custer Consulting, contributing. The second is an interview with Schmoll’s Thomas Kunz, who discusses not just the partnership but the technology, working with OEMs, and more.
Barry Matties and Pete Starkey bring us an interview with Agfa’s Frank Louwet, who explains Agfa’s partnerhsip with Electro Polymers to develop a nanoparticle ink. One can learn a great deal about the soldermask inks and the inkjet process from these interviews.
EIPC’s Alun Morgan gives us a great report on their recent workshop on PCB BioMEMS—aka PCB-on-a-chip. With a CAGR of greater than 25%, BioMEMS devices are a definite market of interest. This detailed article provides a wealth of information on the subject and certainly should be required reading for anyone involved in PCB fabrication.
Steve Williams of Right Approach Consulting takes us far away from soldermask to a look at the new Trump administration and what its promises may mean to our industry and business in general. He even includes a “Top Ten” on deregulation. Read on!
Back to some technical content with Michael Carano, of RBP Chemical Technology, as he delves into the metallizing difficult-to-plate substrates, in this case with electroless copper. Mike always includes some troubleshooting info as well as much practical advice in his columns.
Next, NTI’s Keith Sellers discusses various test methods to ensure that your incoming (or outgoing) PCBs perform as intended and that you “get what you pay for.” He proceeds from the basic incoming inspection through more in-depth analysis involving cross-sections, thermal stress testing and more, including some additional ones to determine basic laminate properties and suitability for the job at hand.
And finally, in his usual inimitable fashion is Barry Lee Cohen of Launch Communications. Each month Barry provides another piece to the marketing communications puzzle. This time his subject is e-newsletters and always worth a read, not to mention a commitment to followthrough.
And so you have it—our line-up for February. Lots of good new tech stuff to keep the wheels turning upstairs, plus some immediate things you can put into practice today or tomorrow at the latest. Next month our subject is “The Wide World of Flex.” Do tune in and read about all things flex—from the various types to the materials to the processing of same. We promise another issue of cover-to-cover value. If you haven’t yet subscribed, do so right now and be one of the first to get it in your e-mailbox.
Patricia Goldman is a 30+ year veteran of the PCB industry, with experience in a variety of areas, including R&D of imaging technologies, wet process engineering, and sales and marketing of PWB chemistry. Active with IPC since 1981, Goldman has chaired numerous committees and served as TAEC chairman, and is also the co-author of numerous technical papers. To contact Goldman, click here.
This article originally appeared in the February 2017 issue of The PCB Magazine.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
SASinno Americas Introduces the Ultra Series
10/07/2025 | SASinno AmericasSASinno Americas has introduced the new Ultra Series, the latest generation of offline selective soldering systems. Available in two models—the Ultra-i1 and Ultra-i2—the new series is designed to meet the needs of manufacturers running small to medium batch sizes, multiple product types, and frequent line changes, while maintaining exceptional precision and process control.
Elmotec by E-Tronix to Showcase SolderSmart® TOP Robotic Soldering at The Assembly Show 2025
10/06/2025 | ELMOTECE-tronix, a Stromberg Company, is pleased to announce its participation at The Assembly Show 2025 in Rosemont, IL, October 21st through 23rd. Exhibiting under Elmotec by E-Tronix, Booth #448, the team will highlight the SolderSmart® TOP robotic soldering system, featuring live demonstrations throughout the show.