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Compunetics Obtains New MIL-PRF-31032 Certifications, Expands PCB Offerings
July 10, 2017 | CompuneticsEstimated reading time: Less than a minute
Compunetics, Inc. is newly qualified by Defense Logistics Agency (DLA) (VQE-17-031349) to provide multilayer flex printed circuit boards per MIL-PRF-31032/3 & MIL-PRF-31032/4 certifications and standards. These qualifications, effective 5/4/2017, allow Compunetics to build flexible circuit boards with up to five layers.
Compunetics is certified to MIL-PRF-31032/1 and /2 for rigid PCBs for up 24 layers using FR-4 materials. Additional certifications include the capability to produce PCBs up to 18 layers composed of a mix of FR-4 and ceramic filled hydrocarbon material.
Compunetics is pursuing a new DLA qualification that would certify them to manufacture 14-layer rigid-flex boards. This certification acquisition is expected in the fall of 2017.
About Compunetics, Inc.
Compunetics, a subsidiary of Compunetix Inc., was established in 1968 and has since been engaged in the design and manufacture of special systems for complex information processing applications. In 1969, the company began manufacturing printed circuit boards. Currently, Compunetics’ capabilities include the fabrication of rigid, flexible and rigid-flex printed circuit boards. More information regarding the company can be found here.
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Accurate Circuit Engineering: Be Nimble, Quick, and Open to Change
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ASC Acquires Cutting-Edge High Vacuum Plugging Machine CF 200 to Expand Via Fill Capabilities
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Hunting for Clues: Feng Xue Solving Circuit Board 'Crimes' With AOI Standard
05/08/2025 | Linda Stepanich, IPCWhen residents in sleepy English villages needed a top-tier detective to solve a murder, they called on Belgian super-sleuth Hercule Poirot, author Agatha Christie’s fictional detective famous for using his “little grey cells” to solve crimes. In the same way, IPC standards development committees, when creating a standard to detect defects in circuit boards using Automated Optical Inspection (AOI), call on IPC A-Team, Hercule.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.