Compunetics Obtains New MIL-PRF-31032 Certifications, Expands PCB Offerings

Reading time ( words)

Compunetics, Inc. is newly qualified by Defense Logistics Agency (DLA) (VQE-17-031349) to provide multilayer flex printed circuit boards per MIL-PRF-31032/3 & MIL-PRF-31032/4 certifications and standards. These qualifications, effective 5/4/2017, allow Compunetics to build flexible circuit boards with up to five layers.  

Compunetics is certified to MIL-PRF-31032/1 and /2 for rigid PCBs for up 24 layers using FR-4 materials. Additional certifications include the capability to produce PCBs up to 18 layers composed of a mix of FR-4 and ceramic filled hydrocarbon material.       

Compunetics is pursuing a new DLA qualification that would certify them to manufacture 14-layer rigid-flex boards.  This certification acquisition is expected in the fall of 2017.

About Compunetics, Inc. 

Compunetics, a subsidiary of Compunetix Inc., was established in 1968 and has since been engaged in the design and manufacture of special systems for complex information processing applications. In 1969, the company began manufacturing printed circuit boards. Currently, Compunetics’ capabilities include the fabrication of rigid, flexible and rigid-flex printed circuit boards. More information regarding the company can be found here.

11/25/2019 | Nolan Johnson, PCB007

Sheri Kuretich, human resources manager, and Nancy Viter, VP of operations, of Sunstone Circuits speak with Nolan Johnson about what they see from the perspective of a prototyping shop, the current state of the hiring market, and how they have used ISO 9000 as an information repository to pass technical knowledge from experienced employees to newer ones.

11/22/2019 | Kelsey Smith, All Flex

Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product. This series of articles will focus on the seven key aspects to consider when designing for maximum durability and maximum “flexibility”.

11/22/2019 | I-Connect007 Editorial Team

The annual HKPCA Show, which has been renamed the 2019 International Electronics Circuit Exhibition (Shenzhen), will be held from December 4–6 at the Shenzhen Convention and Exhibition Center. This year’s exhibition will be jointly organized by the Hong Kong Printed Circuit Association (HKPCA) and the China Printed Circuit Association (CPCA) and will provide a more efficient business platform for all visitors. The PCB007 China Team interviewed a representative from the HKPCA about the exhibition, the industry’s current situation, and future developments.