NPL and SMART Group to Hold Design, Process & Reliability Seminar


Reading time ( words)

The National Physical Laboratory and SMART Group will hold a seminar November 9, 2017, that will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, and high temperature reliability for alternative solders and substrates materials.

Presentations include performance and lifetime of printed semiconductors, high-temperature electronics and their reliability, coatings for high temperature applications, and factors affecting moisture diffusion in PCBs.

The event will be held at the National Physical Laboratory in Hampton Road, Teddington in London.

To register, click here.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/21/2020 | Nolan Johnson, I-Connect007
This week, the top five is full of progress in technology and financial performance. It’s more evidence that the electronics industry, at its core, continues to thrive.

Just Ask Joe: Optimum Copper Plating for Thermal Via Farms

08/19/2020 | I-Connect007 Research Team
First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

New Solder Joint Technology From Schmartboard

08/17/2020 | I-Connect007 Editorial Team
Schmartboard has a surprisingly simple patented process to improve solder joint reliability; in this interview, they discuss the process in detail, along with their search for a go-to-market partner.



Copyright © 2020 I-Connect007. All rights reserved.