ELEXCON 2017 Addresses Industry Hot Spots
December 20, 2017 | Elexcon 2017Estimated reading time: 2 minutes
Around 50,000 industry professionals are expected to gather in China's international electronic manufacturing epicenter this week for the ELEXCON & Embedded Expo 2017. Scheduled to be held at the Shenzhen Convention & Exhibition Center from December 21–23, 2017, ELEXCON 2017 will showcase five technology themes that are shaping the future of the electronics industry. The highlighted tracks include next generation smart phone technology; sense technologies: smart home, AI, smart medical care and IoT; automotive electronics, car networking, motor, battery and electric control; global distributors and providers dedicated to presenting faster Internet services; and charging classrooms.
More than 1,000 products and solutions related to smart phones, smart home furnishing, smart cars, smart hardware, sensing technologies and wireless communication solutions will be displayed at the exhibition. These include the latest smart phone technologies such as full screen, face recognition, 3D sensing, wireless charging, and new materials and processes. Attendees will also see smart phone advancements that are shaping other markets, such as automotive electronics and Internet of Things (IoT). With the participation of leading international brands, ELEXCON 2017 offers an in-depth expo experience. Additional product highlights include miniature blood flow sensor developed by KYOCERA, MEMS sensor and NCU series patched temperature sensor bed provided by Murata, vibration feedback module and multi-sensor integrated module of IoT developed by Alps, solutions to deal with wireless module, sensor node and gateway problems offered by SunTec, and AI rearview cameras from Kyocera.
To enhance the attendee experience, ELEXCON 2017 will feature many conferences and seminars. This year’s titles include the Wireless Charging Industry Summit Forum; New Technology of Mobile Phone Release Conference; China Mobile Manufacture Forum 2017; Wireless Charging Industry Summit Forum; EV & Autotronics China Expo; All Schools of Car Networking Forum, sponsored by Shenzhen Automotive Electronics Association; Main Technology Conference of Electric Vehicles; Roundtable of Electric Vehicle Total; and Research on Magnetic Components of New Energy Vehicle and Their Development Trend.
There will also be many training courses during this year's exhibition, such as:
- Quick charge of century power training
- Medical equipment EMC electromagnetic compatibility training
- Technical Analysis of High Speed Digital Connector
- Series Research Courses of Electronic Manufacturing Technology
- Development of 2.4G RF Wireless Technology
- 2017 TI Engineer Training
The supply chain will also be represented, with distributors and online retailers including Digi-Key, Mouser, Arrow, CEC Port, Sekorm, SZLCSC, YKY, Iczoom, Icorebuy, Rightic, Digital Network, B1B, and more.
With more than 500 leading global technology providers, 20-plus forums, and hundreds of industry experts, ELEXCON 2017 offers attendees an excellent opportunity to learn about advanced technologies supporting future product and project R&D, seek substitutive product solutions with lower costs or higher quality, and exchange with industrial elites, suppliers, media and industry organizations on latest researches and their respective views.
For more information, visit www.elexcon.com.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.