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A Less Expensive Defense and Aerospace PCB Fab Startup

08/20/2024 | Alex Stepinski, Stepinski Group
Editor’s note: Investing in a new printed circuit board fabrication startup is not for the faint of heart or the light of wallet. Standing up a new “high-tech” PCB fab facility capable of becoming qualified for aerospace and defense work typically takes a minimum investment of $50 million. However, Alex Stepinski says entering the defense and aerospace markets with a new PCB fabrication start-up facility far under this prohibitive cost benchmark is possible when good partnerships, innovation, and sound engineering design enter from the beginning. In this article, Alex Stepinski outlines just how this can be achieved.

USPACE and EgSA to Form Aerospace Joint Venture in Egypt

08/16/2024 | PRNewswire
USPACE Technology Group Limited is pleased to announce that the Group has signed the strategic partnership agreement with the Egyptian Space Agency (EgSA), in relation to satellite manufacturing and testing, satellite launch, education and training, greatly expanding its business presence in the fast-growing African space market.

UHDI Fundamentals: UHDI Applications for Aerospace

08/13/2024 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology refers to advanced manufacturing processes used to create extremely compact and highly efficient electronic circuits at the sub-1-mil line and space level. In aerospace applications, UHDI is crucial due to the stringent requirements for weight, reliability, and performance in a challenging environment.

Barnes Aerospace Announces Long-Term Agreement with MTU Aero Engines AG Valued at $33M

07/30/2024 | BUSINESS WIRE
Barnes Aerospace is pleased to announce a long-term agreement extension with MTU Aero Engines AG, through which it will provide a package of precision fabricated components valued at $33 million.

Altair Signs MoU With University of Nottingham to Develop Aerospace Digital Twin Project

07/25/2024 | PRNewswire
Altair, a global leader in computational intelligence, has signed a memorandum of understanding (MoU) with the U.K.-based University of Nottingham for a digital twin project within the aerospace sector.
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