Insulectro Energizes Booth at IPC APEX EXPO with Power Chats


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Insulectro has announced it will repeat its highly anticipated 13.5 minute power chats during this year’s IPC APEX EXPO at the San Diego Convention Center, February 27 – March 1, 2018.

The Insulectro Power Chats, branded ipc@IPC, will provide details on many new products, processes and services that Insulectro plans to introduce in 2018.

“We are pleased to continue our ipc@IPC - Insulectro Power Chats,” commented Ken Parent, Vice President of Sales & Product Management, “We’ve taken our top eight most interesting, new products and processes for 2018 and crafted short, info-packed learning sessions to be presented during IPC APEX EXPO. In 13.5 minutes per topic, attendees will learn the WHAT/WHY/HOW of these 8 game changers.”

Currently, Amphenol, DuPont, Isola, Oak-Mitsui, and Shikoku will be featured.

“Our new products can change the way a board is designed and fabricated. In our field testing, we’re hearing ‘We could have never made this board before’,” continued Parent. “We’re anxious to share our process information about our offerings in very concise power chats in our booth we’ve combined with Isola - #317/#417 – it’s the largest in materials section of the show.”

Insulectro Vice President of Technology Chris Hunrath agrees, “Over the past six years our IPC Power Chats have been enormously popular. Often times, it’s standing room only. That’s due to the intriguing topics we spotlight in our chats and in our booth. This year is no exception. For instance, although IPC APEX is primarily a PCB industry tradeshow, we know many of our customers are interested in printed electronics so we’ve included a 13.5 minute Boot Camp on PE.”

IPC@IPC Product Power Chats Schedule for Booth #317/#417:

Tuesday, February 27

11:00 am

Amphenol: UltraSpeed Technology
UltrasSpeed insertion loss reduction using Isola’s Tachyon 100-G
Norm Berry, Director of Laminates & OEM Marketing

1:00 pm

Shikoku’s GliCap for High Speed Digital
Non-etch adhesion promoter composed of azole derivative
Chris Hrusovsky, Vice President of Sales & Chemistry

2:00 pm

DuPont Interra
Thin copper clad laminates designed for use in multilayer rigid PCBs
Michelle Walsh, Director of Product Management & Jin Hyun Hwang, Dow DuPont

3:00 pm

DuPont Intexar - Revolutionary Electronic Ink & Film
Seamlessly transforms fabric into smart clothing!
Bob Lee, Technical Account Manager

4:00 pm

Insulectro Customer System Tools
Enhancements that Improve Customer Satisfaction
Trey Adams, Regional Vice President – Sales

Wednesday, February 28

11:00 am

Shikoku’s GliCap for High Speed Digital
Non-etch adhesion promoter composed of azole derivative
Chris Hrusovsky, Vice President of Sales & Chemistry

1:00 pm

Printed Electronics 101
Want to learn about Printed Electronics? Give us 13.5 minutes!
Chris Hunrath, VP of Technology & Bob Lee, Technical Account Manager

2:00 pm

DuPont Flexible Laminates
New product developments.
Michelle Walsh, Director of Product Management & Jonathan Weldon, Dow DuPont

3:00 pm

Amphenol: UltraSpeed Technology
UltrasSpeed insertion loss reduction using Isola’s Tachyon 100-G
Norm Berry, Director of Laminates & OEM Marketing

4:00 pm

Copper Foil Technology
Industry Trends for Signal Integrity and Global Market Overview
Joe Bevan, Product Manager & John Fatcheric, Oak-Mitsui

All Power Chats are in Space #317/#417 at IPC APEX EXPO. No sign-up required.

About Insulectro

Insulectro is the leading supplier of PCB and Printed Electronics materials used to manufacture circuit boards. Insulectro combines its premier product offering with local inventory in strategic stocking locations across the country, fabrication capabilities and backed up by expert customer and technical support services.

Insulectro supplies advanced engineered materials manufactured by DuPont®, Isola, LCOA®, CAC, Inc., Pacothane, Oak-Mitsui, Focus Tech, Shikoku, Kodak, and Coveme. These products are used by our customers to fabricate complex, multilayer circuit boards. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards and printed electronics for applications in a variety of end markets including telecom, data communications, high speed computing, mobile devices, military, and medical.

For more information click here.

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