Summer Issue of Flex007 Magazine Available Now

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An increasing number of OEMs are being forced into using flexible and rigid-flex circuits, for a variety of reasons: Sometimes rigid boards won’t fit the shrinking enclosures anymore, or the companies just need rugged, reliable circuits. 

In the July 2018 issue of Flex007 Magazine, our contributors discuss some of the hurdles they faced when they dove into flex and rigid-flex circuits, and they offer advice to anyone considering a move into the flexible arena.

Check it all out this month in Flex007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.

Be sure to download the PDF copy or future reference. The PDF is great for beach reading!

04/23/2019 | Nolan Johnson, I-Connect007

Cutting-edge automation, AI, machine learning, and Industry 4.0 are all part of the response to the increasing demands for printed circuit boards that are not only faster, smaller, and cheaper but also higher-frequency, lower-loss, more temperature tolerant, and higher reliability. In many cases, it will be unique and advanced research coming out of the university system that will help move the industry forward.

03/06/2019 | Nolan Johnson, I-Connect007

Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.

02/05/2019 | Real Time with...IPC

Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.