Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Alun Morgan Named Technology Ambassador for Ventec
September 19, 2018 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group Co., Ltd. announced that Alun Morgan, chairman of the EIPC, has been named technology ambassador for Ventec International Group. In support of a common mission to promote the next generation’s progress in PCB material design, Alun will apply his extensive background and expertise in advocating for the Taiwan stock exchange listed company as an advisor and ambassador.
One of Alun's first public appearances in his new role as Technology Ambassador for Ventec will be at the 11th CTI Symposium in Munich (November 22-23, 2018) with a presentation titled 'Hot Cars, cool electronics… Thermal Management Materials for Automotive Electronics'.
Alun continues to serve as the chairman of The European Institute for the PCB Community (EIPC) and holds the posts of director and trustee of the charity Scottish Autism.
He began his career as a research investigator at the Institute of Physics' Fulmer Research Institute in the UK and after serving as technical manager of a PCB manufacturer, he joined PCB materials supplier MAS Electronics going on to become UK general manager. Following the acquisition of MAS by Isola, he joined the Isola management team serving as a director and corporate vice-president of Operations and Engineering of the Isola Group worldwide.
Alun holds a B.Sc. Honors degree in Metallurgy from the Department of Materials Science and Engineering at the University of Surrey, is an associate of the University of Surrey and a Fellow of the Institute of Circuit Technology.
"I am excited to work with an organization whose strong reputation and global recognition as a leading materials supplier is built upon its innovative culture and unique & proven product development capabilities," said Alun of his new role.
"I can't think of a more perfect ambassador for Ventec than Alun. He is highly networked & respected in the industry and widely acknowledged as a PCB expert. His experience and entrepreneurial flair will be of great benefit to Ventec as we journey through our most exciting period of development for the Group," Mark Goodwin, Ventec's COO Europe and Americas, added.
About Ventec International Group
With volume manufacturing facilities and Headquarters in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.