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Current IssueThe Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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Call for Participation: IPC Electronics Materials Forum 2019
April 4, 2019 | IPCEstimated reading time: 1 minute
IPC invites you to present at the upcoming IPC Electronics Materials Forum to be held on November 5–7, 2019.
This new technical conference will focus on developments in materials and processes associated with advanced electronics assembly and manufacturing. Materials enable advancement because it is possible to envision many future technologies, but they will never be fully realized without the materials and processes to manufacture them.
The content will focus on materials for board fabrication, assembly, and post-assembly protection. The over-arching theme of emerging technologies that challenge our existing materials set will inform attendees on developments needed for the future. Interactive panels will also extend an open forum to discuss solutions to these challenges.
Seeking presentations on emerging technologies challenging existing material sets.
Other topics of interest include:
Substrate Materials:
- Novel board laminates
- Surface finishes
- Solder mask advancements
- Flexible/wearable circuits
- HDI developments
Assembly Materials:
- New solder alloys
- Flux development
- Cleaning chemistries
- Assembly process strategies
- Thermal interface solutions
Protective Materials:
- Cleaning chemistries
- Conformal coatings
- Adhesives
- Underfills
Who Should Attend?
Engineers and managers that procure materials or qualify materials, or want to understand advancements in materials for the board, assembly, components, and protective layers: process engineers, manufacturing managers, materials scientists, SMT line managers, quality managers (for materials or failure analysis).
Please send title and short description to Brook Sandy-Smith, IPC technical education program manager, at BrookSandy@ipc.org by June 28, 2019.
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Sweeney Ng - CEE PCBSuggested Items
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Our Legislative Outlook: PCB007 Magazine October 2025 Issue
10/16/2025 | I-Connect007 Editorial TeamMost agree that we are experiencing an unprecedented time in global business and economics, with rules and laws that open doors to business but can complicate operations and make profitability more challenging. This month, PCB007 Magazine features some of today’s leading experts on legislative issues affecting the electronics industry, including rules and laws, trade, sustainability, business expansion, grants, and more in the U.S., Europe, and China.
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