It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
Call for Participation: IPC Electronics Materials Forum 2019
April 4, 2019 | IPCEstimated reading time: 1 minute
IPC invites you to present at the upcoming IPC Electronics Materials Forum to be held on November 5–7, 2019.
This new technical conference will focus on developments in materials and processes associated with advanced electronics assembly and manufacturing. Materials enable advancement because it is possible to envision many future technologies, but they will never be fully realized without the materials and processes to manufacture them.
The content will focus on materials for board fabrication, assembly, and post-assembly protection. The over-arching theme of emerging technologies that challenge our existing materials set will inform attendees on developments needed for the future. Interactive panels will also extend an open forum to discuss solutions to these challenges.
Seeking presentations on emerging technologies challenging existing material sets.
Other topics of interest include:
Substrate Materials:
- Novel board laminates
- Surface finishes
- Solder mask advancements
- Flexible/wearable circuits
- HDI developments
Assembly Materials:
- New solder alloys
- Flux development
- Cleaning chemistries
- Assembly process strategies
- Thermal interface solutions
Protective Materials:
- Cleaning chemistries
- Conformal coatings
- Adhesives
- Underfills
Who Should Attend?
Engineers and managers that procure materials or qualify materials, or want to understand advancements in materials for the board, assembly, components, and protective layers: process engineers, manufacturing managers, materials scientists, SMT line managers, quality managers (for materials or failure analysis).
Please send title and short description to Brook Sandy-Smith, IPC technical education program manager, at BrookSandy@ipc.org by June 28, 2019.
Share on:
Suggested Items
Compal Announces Completion of New Automotive Electronics Facility in Poland, Signaling Strategic Growth in Europe
06/30/2025 | Compal Electronics Inc.Compal Electronics is proud to announce the completion of Phase One of its new manufacturing facility in Czeladź, Silesian Voivodeship, Poland, marking a major milestone in its strategic expansion into the European automotive electronics market.
Leadership Development Continues at Incap Slovakia
06/30/2025 | IncapIncap Slovakia has launched the first leadership development training of 2025 as part of its ongoing Team Leaders Academy programme.
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.
Incap Estonia Recognized with Second Golden Label for Responsible Business
06/27/2025 | IncapIncap Electronics Estonia has been awarded a golden label by the Responsible Business Forum in Estonia for the second time. The responsible business label is a prestigious symbol in Estonia that identifies entrepreneurs and organisations that demonstrate excellence in environmental, social, and economic responsibility.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.